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  85510-5018 Datasheet PDF File

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    MOLEX INC
Part No. 85510-5018
Description TOPENT 6/4 SMT JK W/TABS LCP

File Size 83.10K  /  1 Page

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Amphenol Communications Solutions

Part No. 85855-104LF
Description 5 Row Signal Header, Straight, Press-Fit, Wide body, 8 Mod
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0855105018 85510-5018

Molex Electronics Ltd.
Part No. 0855105018 85510-5018
Description Modular Jack, Vertical, SMT, 6/4, Solder Tabs

File Size 113.66K  /  3 Page

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Renesas Electronics Corporation

Part No. RJL5018DPK-00#T0
Description Nch Single Power Mosfet 500V 35A 170Mohm To-3P
Tech specs    

Official Product Page

    855107-15

TriQuint Semiconductor
Part No. 855107-15
Description 70 MHz Bandpass Filter 1.228 MHz Bandwdith

File Size 30.69K  /  1 Page

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Renesas Electronics Corporation

Part No. RJK5018DPK-00#T0
Description Nch Single Power Mosfet 500V 35A 155Mohm To-3P
Tech specs    

Official Product Page

    TRIQUINT[TriQuint Semiconductor]
Part No. 855104
Description 499.25 MHz Bandpass Filter

File Size 36.11K  /  1 Page

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Amphenol Communications Solutions

Part No. 10132450-1821GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 18 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    5018

Philips Semiconductors
Part No. 5018
Description 8-Bit uP-compatible D/A Converter

File Size 293.52K  /  5 Page

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Amphenol Communications Solutions

Part No. 54112-111501850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    5018

Pomona Electronics
Part No. 5018
Description Hex Head Binding Post

File Size 19.95K  /  2 Page

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Amphenol Communications Solutions

Part No. 95615-018LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Header- Through Mount - Double row - 18 Positions - 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0855105025 85510-5025

Molex Electronics Ltd.
Part No. 0855105025 85510-5025
Description Modular Jack, Vertical, SMT, 4/4, Solder Tabs

File Size 113.65K  /  3 Page

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Amphenol Communications Solutions

Part No. 50000-5018ELF
Description High Pin Count, Backplane Connectors, Receptacle, Right Angle, Through Hole, 3 Row, 18 Positions, 0 Guide Pin, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0855105026

Molex Electronics Ltd.
Part No. 0855105026
Description Modular Jack, Vertical, SMT, 6/4, Solder Tabs

File Size 113.65K  /  3 Page

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Amphenol Communications Solutions

Part No. 10132450-1811GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 18 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    0855105020

Molex Electronics Ltd.
Part No. 0855105020
Description Modular Jack, Vertical, SMT, 8/8, Solder Tabs

File Size 113.65K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-109501850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0855105027

Molex Electronics Ltd.
Part No. 0855105027
Description Modular Jack, Vertical, SMT, 6/6, Solder Tabs

File Size 113.65K  /  3 Page

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Amphenol Communications Solutions

Part No. 73725-0180RLF
Description USB 2.0, Input Output Connector, Receptacle, Type A, Up Right, Right Angle, Through Hole, Single Deck, 4 Positions
Tech specs    

Official Product Page

For 85510-5018 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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