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ligitek electronics co.,ltd. property of ligitek only pb lead-free parts srace mount led tape and reel data sheet doc. no : qw 0905-lrgb9 553/r5-b01 rev. : a date : 20 - apr. - 2017 lrgb9553/r5-b01
features: 1. top view white led. 2. white smt package. 3. leadframe package with indivi dual 4 pin. 4.wide viewing angle. 5.soldering methods:ir reflow soldering. 6.feature of the device:more light due to higher optical efficiency;extremely wide viewing angle;ideal for backlighting and coupling in light guide. descriptions: the lrgb9553 smd has wide viewing angle and optimized light coupling by inter reflector,the low current requirement makes this device i deal for portable equipment or any other application where power is at a premium. applications: 1. lcd back light. 2. mobile phones. 3. indicators. 4. switch lights. 5. lighting. page 1/13 ligitek electronics co.,ltd. property of ligitek only part no. lrgb9553/r5-b01 device selection guide: color ingan algainp material part no blue red emitted water clear lens ingan green lrgb9553/r5-b01
page 2/13 ligitek electronics co.,ltd. property of ligitek only package dimensions note : 1.all dimension are in millimeter tolerance is 0.2mm unless otherwise noted. 2.specifications are subject to change without notice. note : the tolerances unless mentioned is 0.1mm unit=mm. recommended soldering pad dimensions part no. lrgb9553/r5-b01 4.9 1.6 0.65 1.6 0.85 0.85 0.70.05 0.70.05 2.7 0.8 0.8 3.2 0.8 4 1 3.5 3 1.9 2 2.2 soldering terminal 0.70.05 0.70.05 0.8 0.8 - + 2 + 3 + 4 1 brg
page 3/13 ratings ma unit mw ma v - 40 ~ + 100 - 40 ~ + 85 a symbol pd i fp i f power dissipation forward current peak forward current duty 1/10@10khz parameter ir esd tstg t opr electrostatic discharge operating temperature reverse current @5v storage temperature ! ligitek electronics co.,ltd. property of ligitek only typical electrical & optical characteristics (ta=25 ) absolute maximum ratings at ta=25 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2.the luminous intensity data did not including 15% testing tolerance. 3.the color coordinates measurememt allowance is 0.01 testing tolerance. 2 1/2 d symbol forward voltage v f viewing angle dominant wavelength spectral line half-width luminous intensity items iv v deg min. typ. max. nm nm if=20ma condition mcd unit rg b r 500 800 ---- ---- 1600 1250 ---- 320 200 ---- 470 525 ---- ---- 625 ---- 30 36 ---- ---- 20 2.6 2.8 2.8 3.6 3.6 1.7 ---- 120 120 ---- ---- 120 ---- ---- ---- ---- ---- ---- ---- ---- ---- ---- ---- ---- if=20ma if=20ma if=20ma if=20ma g b b g b g b g g b r r r r part no. lrgb9553/r5-b01 50 30 30 90 100 100 130 108 108 10 50 50 2000 500 500
ligitek electronics co.,ltd. property of ligitek only page 4/13 luminous intensity classification iv(mcd) at 20ma bin code min. max. iv(mcd) at 20ma bin code min. max. iv(mcd) at 20ma bin code min. max. part no. lrgb9553/r5-b01 r u 500 800 v-1 800 1000 v-2 1000 1250 w-1 1250 1600 g w-1 1250 1600 w-2 1600 2000 x-1 2000 2550 x-2 2550 3200 b s 200 320 t 320 500 u 500 800 v-1 800 1000
ligitek electronics co.,ltd. property of ligitek only typical electro-optical characteristics curve page 5 /13 fig.6 directive radiation -60 100% 50% 75% 25% -30 60 75% 0 25% 50% 100% 30 0 part no. lrgb9553/r5-b01 fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) relative intensity@20ma wavelength (nm) forward voltage@20ma normalize @25 : fig.4 luminous intensity vs. temperature ambient temperature( ) luminous intensity(%)@20ma normalize @25 : forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) forward current(ma) luminous intensity normalize @20ma 0 0 10 100 0 0.0 0204060 0.5 1.0 1.5 2.0 80 100 1.9 40 20 0 80 100 60 20 r chip fig.2 luminous intensity vs. forward current 2.5 3.0 0 550 600 650 700 0.5 1.0 51015202530 0.5 1.0 1.5 3.5 40 60 80 100 120
3.0 2.5 1.5 1.0 0.5 0.0 2.0 fig.4 relative intensity vs. temperature relative intensity@20ma wavelength (nm) 450 0.0 0.5 500 550 600 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature forward voltage@20ma normalize @25 1.0 -40 0.8 -20 1.1 1.0 0.9 1.2 relative intensity@20ma normalize @25 20 060 40 100 80 ambient temperature( ) -40 -20 020 60 40 100 80 3.0 2.5 2.0 1.5 1.0 0.5 0.0 ! ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current typical electro-optical characteristics curve 2.0 fig.1 forward current vs. forward voltage forward voltage(v) 100 forward current(ma) 1.0 0.1 1.0 10 g chip 1000 relative intensity normalize @20ma 3.0 4.0 5.0 1000 forward current(ma) 1.0 10 100 page 6/ 13 fig.6 directive radiation -60 100% 50% 75% 25% -30 60 75% 0 25% 50% 100% 30 0 part no. lrgb9553/r5-b01
ligitek electronics co.,ltd. property of ligitek only typical electro-optical characteristics curve b chip page 7 /13 fig.6 directive radiation 0 30 60 -30 -60 25% 100% 0 25% 50% 75% 75% 100% 50% part no. lrgb9553/r5-b01 0.5 relative intensity@20ma normalize @25 : forward voltage@20ma normalize @25 : 20 ambient temperature( ) ambient temperature( ) 0 -20 -40 0.8 0 -40 -20 100 80 60 40 20 0.0 60 100 80 40 fig.4 relative intensity vs. temperature 2.5 1.0 0.9 1.1 1.5 1.0 2.0 fig.3 forward voltage vs. temperature 1.2 3.0 relative intensity normalize @20ma forward current(ma) forward current(ma) forward voltage(v) 110 0.0 0.5 1.0 1.5 2.0 100 1000 fig.2 relative intensity vs. forward current fig.1 forward current vs. forward voltage 2.5 3.0 2.0 100 1.0 0.1 10 1.0 1000 3.0 4.0 5.0 fig.5 relative intensity vs. wavelength relative intensity@20ma wavelength (nm) 400 450 500 0.0 0.5 1.0 550
page 8 /13 ligitek electronics co.,ltd. property of ligitek only carrier type dimensions description quantity/reel packing specifications ? part no. note : the tolerances unless mentioned is d 0.1mm,angle d3 0.5. unit=mm. part no. lrgb9553/r5-b01 lrgb9553/r5-b01 label 0.8 0.2 0.2 0.4 0.6 0.8 0.4 0.6 2000 pcs 12.0mm tape,7"reel aluminum moist-proof bag label 4.0 2.0 4.0 5.4 8.0 0.3 2.08 ? 1.5 1.75 3.5 3.00 3.66

page 10 /13 box explanation 1. 5 bag / inner box 2. inner box size : l x w x h 23cm x 8.5cm x 26cm ligitek electronics co.,ltd. property of ligitek only part no. lrgb9553/r5-b01 3. 10 inner boxes / carton 4. carton size : l x w x h 58cm x 34cm x 35cm l w h l h w
page 1 1 /13 recommended soldering conditions 1. hand solder basic spec is Q 320 3 sec one time only. ! ligitek electronics co.,ltd. property of ligitek only 6c/sec 260c max. 10sec.max 1~5c/sec 2 pb-free reflow solder 120 sec.max. 1~5c/sec preheat 180~200c above 220c 60 sec.max. part no. lrgb9553/r5-b01 3.when soldering,do not put stress on the leds during heating. 1.reflow soldering should not be done more than two times. 4.after soldering,do not warp the circuit board. note: 2.wave solder should not be done more than one times.
page 1 2 /13 led led circuit model a ligitek electronics co.,ltd. property of ligitek only circuit model b drive method: led is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. this current limiting typically takes the form of a current limiting resistor placed in series with the led. consider worst case voltage variations than could occur across the current limiting resistor. the forwrd current should not be allowed to change by more than 40% of its desired value. (a) recommended circuit. (b) the difference of brightness between led could be found due to the vf-if characteristics of led. esd(electrostatic discharge): static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. cleaning: use alcohol-based cleaning solvents such as isopropyl alcohol to clean the led. part no. lrgb9553/r5-b01 precautions for use: storage time: 1. calculated shelf life before opening is 12 months at < 30c and < 90% relative humidity (rh) 2. after bag is opened, devices which will be subjected to reflow soldering or other high temperature processes must be a) assemblied within 168 hours in an environment of Q 30c / 60% rh, or b) stored at ambient of 10% rh or less 3. devices are required baking before assembly if: a) humidity indicator card reads >10% (for level 2a -5a) or >60% (for level 2) at ambient temperature 23 d 5c b) 2.a) or 2.b) doesn't meet 4. if baking is required, devices should be baked for >72 hours at 605c / 5% rh.performing baking only once, and using the baked devices within 72 hours.
page 1 3 /13 reliability test: ligitek electronics co.,ltd. property of ligitek only part no. lrgb9553/r5-b01 environmental test 1.t=260c max. 10sec.max. 2. 6 min ir reflow 1.100c5c ~ -40c5c 30mins / 5mins / 30mins 2.100 cyeles temperature cycling endurance test classification 1.ta=85c 2.rh=85% 3.t=1000hrs(-24hrs,+72hrs) 1.ta=-40c5c 2.t=1000 hrs (-24hrs,+72hrs) 1.ta=100c5c ~ -40c5c 20min/ 10sec / 20min 2.total 100 cycles high temperature high humidity storage test thermal shock test low temperature storage test 1.ta=100c5c 2.t=1000 hrs (-24hrs,+72hrs) 1.ta=25c 2.if=20ma 3.t=1000 hrs (-24hrs,+72hrs) high temperature storage test test item operating life test test condition sample size 22 22 22 22 22 22 22

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