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  features complete control for a high current, low dropout, linear regulator fixed 5v or adjustable output voltage accurate 2.5a current limiting with foldback internal current sense resistor remote sense for improved load regulation external shutdown under-voltage lockout and reverse voltage protection thermal shutdown protection 8 pin mini-dip package (surface mount also available) description the uc1835/6 families of linear controllers are optimized for the de- sign of low cost, low dropout, linear regulators. using an external pass element, dropout voltages of less than 0.5v are readily obtained. these devices contain a high gain error amplifier, a 250ma output driver, and a precision reference. in addition, current sense with fold- back provides for a 2.5a peak output current dropping to less than 0.5a at short circuit. these devices are available in fixed, 5v, (uc1835), or adjustable, (uc1836), versions. in the fixed 5 volt version, the only external parts required are an external pass element, an output capacitor, and a com- pensation capacitor. on the adjustable version the output voltage can be set anywhere from 2.5v to 35v with two external resistors. additional features of these devices include under-voltage lockout for predictable start-up, thermal shutdown and short circuit current limiting to protect the driver device. on the fixed voltage version, a reverse voltage comparator minimizes reverse load current in the event of a negative input to output differential. high efficiency regulator controller block diagram note: pin numbers refer to 8-pin dil package uc1835 uc1836 uc2835 uc2836 uc3835 uc3836 8/94
uc1835 uc1836 uc2835 uc2836 uc3835 uc3836 soic-16 (top view) dw package connection diagrams package pin function function pin n/c 1 +v in 2 +v in 3 n/c 4 compensation/ shutdown 5 n/c 6 ground 7 n/c 8 n/c 9 driver source 10 n/c 11 v out sense 12 n/c 13 n/c 14 driver sink 15 n/c 16 current limit (-) 17 n/c 18 sense resistor out 19 sense resistor out 20 dil-8, soic-8 (top view) n or j package, d package plcc-20, lcc-20 (top view) q, l packages input supply voltage (+v in ) . . . . . . . . . . . . . . . . C1.0v to + 40v driver output current (sink or source) . . . . . . . . . . . . . 600ma driver source to sink voltage . . . . . . . . . . . . . . . . . . . . . + 40v maximum current through sense resistor. . . . . . . . . . . . . . 4a v out sense input voltage . . . . . . . . . . . . . . . . . . C.3v to + 40v power dissipation at t a = 25c (note 2) . . . . . . . . . . . 1000mw power dissipation at t c = 25c (note 2) . . . . . . . . . . . 2000mw operating junction temperature . . . . . . . . . . . -55c to +150c storage temperature . . . . . . . . . . . . . . . . . . . . -65c to +150c lead temperature (soldering, 10 seconds) . . . . . . . . . . 300c note 1: voltages are referenced to ground, (pin 3). currents are positive into, negative out of, the specified terminals. consult packaging section of databook for thermal considerations and limitations of packages. electrical characteristics: unless otherwise stated, specifications hold for t a = 0c to + 70c for the uc3835/6, C25c to + 85c for the uc2835/6, and C55c to +125c for the uc1835/6, +v in = 6v, driver source= 0v, driver sink = 5v, t a = t j . parameter test conditions min. typ. max. units input supply supply current +v in = 6v 2.75 4.0 ma +v in = 40v 3.75 6.0 ma uvlo threshold +v in low to high, v out sense = 0v 3.9 4.4 4.9 v threshold hysteresis 0.1 0.35 v reverse current +v in = -1.0v, driver sink open 6.0 20 ma regulating voltage and error amplifier (uc1835 family only) regulating level at v out sense (v reg ) driver current = 10ma, t j = 25c 4.94 5.0 5.06 v over temperature 4.9 5.1 v line regulation +v in = 5.2v + 35v 15 40 mv load regulation driver current = 0 to 250ma 6.0 25 mv bias current at v out sense v out sense = 5.0v 75 125 210 m a error amp transconductance 100 m a at compensation/shutdown pin 0.8 1.3 2.0 ms maximum compensation output current sink or source, driver source open 90 200 260 m a absolute maximum ratings (note 1) 2
uc1835 uc1836 uc2835 uc2836 uc3835 uc3836 parameter test conditions min. typ. max. units regulating voltage and error amplifier (uc1836 family only) regulating level at v out sense (v reg ) driver current = 10ma, t j = 25c 2.47 2.5 2.53 v over temperature 2.45 2.55 v line regulation +v in = 5.2v to 35v 6.0 20 mv load regulation driver current = 0 to 250ma 3.0 15 mv bias current at v out sense v out sense =2.5v -1.0 -0.2 m a error amp transconductance 100 m a at compensation/shutdown pin 0.8 1.3 2.0 ms maximum compensation output current sink or source, driver source open 90 200 260 m a driver maximum current 250 500 ma saturation voltage driver current = 250ma, driver sink 2.0 2.8 v pull-up current at driver sink compensation/shutdown=0.45v 140 250 300 m a driver sink leakage in uvlo 10 m a in reverse voltage (uc1835 family only) 10 m a thermal shutdown 165 c foldback current limit current limit levels at sense resistor out v out sense = (0.99) v reg 2.2 2.5 2.8 a v out sense = (0.5) v reg 1.3 1.5 1.7 a v out sense = 0v 0.25 0.4 0.55 a current limit amp tansconductance 100 m a at compensation/shutdown, v out sense = (0.9) v reg 12 24 42 ms limiting voltage at current limit (-) (note 2) v out sense = (0.9) v reg volts below +v in , t j = 25c 80 100 140 mv sense resistor value (note 3) v out sense = (0.9) v reg, i out = i a , t j = 25c 40 m w note 2: this voltage has a positive temperature coefficient of approximately 3500ppm/c. note 3: this resistance has a positive temperature coefficient of approximately 3500ppm/c. the total resistance from pin 1 to pin 8 will include an additional 60 to 100m w of package resistance. electrical characteristics: unless otherwise stated, specifications hold for t a = 0c to + 70c for the uc3835/6, C25c to + 85c for the uc2835/6, and C55c to +125c for the uc1835/6, +v in = 6v, driver source= 0v, driver sink = 5v, t a = t j . uc 1835 - typical configurations for a 2a, low dropout 5v regulator uc1836 - typical configuration for a 2a, low dropout adjustable regulator note 4: suggested pass devices are tip 32b. (dropout voltage 0.75v) or, d45h, (dropout voltage 0.5v), or equivalents. application and operation information 3
uc1835 uc1836 uc2835 uc2836 uc3835 uc3836 equations: r 1 = 0.100 v/i out (max) r 2 = (v out - 2.5v/1ma) r 3 = ((v in - v be - v sat )*beta(min))/i out (max) uc3835/36 typical applications low current application using the uc3836 internal drive transistor typical output current vs v in and v out of the uc3836 internal drive transistor for p diss = 0.5w (approx.) high current application using drive transistor q 2 to increase q 1 base drive and reduce uc3836 power dissipation parallel pass transistors can be added for high current or high power dissipation applications unitrode integrated circuits 7 continental bl vd. merrimack, nh 03054 tel. (603) 424-2410 fax 603-424-3460 application and operation information (cont.) uc1835/6 foldback current limiting 4
package option addendum www.ti.com 25-sep-2013 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) op temp (c) device marking (4/5) samples 5962-9065002pa active cdip jg 8 1 tbd a42 n / a for pkg type -55 to 125 9065002pa uc1836 uc1835j obsolete cdip jg 8 tbd call ti call ti -55 to 125 UC1835J883B obsolete cdip jg 8 tbd call ti call ti -55 to 125 uc1835l883b obsolete lccc fk 20 tbd call ti call ti -55 to 125 uc1836j active cdip jg 8 1 tbd a42 n / a for pkg type -55 to 125 uc1836j uc1836j883b active cdip jg 8 1 tbd a42 n / a for pkg type -55 to 125 9065002pa uc1836 uc1836l obsolete to/sot l 20 tbd call ti call ti -55 to 125 uc1836l883b obsolete to/sot l 20 tbd call ti call ti -55 to 125 uc2835d active soic d 8 75 green (rohs & no sb/br) cu nipdau level-2-260c-1 year -25 to 85 uc2835d uc2835dg4 active soic d 8 75 green (rohs & no sb/br) cu nipdau level-2-260c-1 year -25 to 85 uc2835d uc2835j obsolete cdip jg 8 tbd call ti call ti -25 to 85 uc2835n active pdip p 8 50 green (rohs & no sb/br) cu nipdau n / a for pkg type -25 to 85 uc2835n uc2835ng4 active pdip p 8 50 green (rohs & no sb/br) cu nipdau n / a for pkg type -25 to 85 uc2835n uc2836d active soic d 8 75 green (rohs & no sb/br) cu nipdau level-2-260c-1 year -25 to 85 uc2836d uc2836dg4 active soic d 8 75 green (rohs & no sb/br) cu nipdau level-2-260c-1 year -25 to 85 uc2836d uc2836dw obsolete soic dw 16 tbd call ti call ti -25 to 85 uc3835n active pdip p 8 50 green (rohs & no sb/br) cu nipdau n / a for pkg type 0 to 70 uc3835n uc3835ng4 active pdip p 8 50 green (rohs & no sb/br) cu nipdau n / a for pkg type 0 to 70 uc3835n uc3836d active soic d 8 75 green (rohs & no sb/br) cu nipdau level-2-260c-1 year 0 to 70 uc3836d uc3836dg4 active soic d 8 75 green (rohs & no sb/br) cu nipdau level-2-260c-1 year 0 to 70 uc3836d
package option addendum www.ti.com 25-sep-2013 addendum-page 2 orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) op temp (c) device marking (4/5) samples uc3836dtr active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-2-260c-1 year 0 to 70 uc3836d uc3836dtrg4 active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-2-260c-1 year 0 to 70 uc3836d uc3836n active pdip p 8 50 green (rohs & no sb/br) cu nipdau n / a for pkg type 0 to 70 uc3836n uc3836ng4 active pdip p 8 50 green (rohs & no sb/br) cu nipdau n / a for pkg type 0 to 70 uc3836n (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release.
package option addendum www.ti.com 25-sep-2013 addendum-page 3 in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. other qualified versions of uc1835, uc1836, uc3835, uc3836 : ? catalog: uc3835 , uc3836 ? military: uc1835 , uc1836 note: qualified version definitions: ? catalog - ti's standard catalog product ? military - qml certified for military and defense applications
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant uc3836dtr soic d 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 q1 package materials information www.ti.com 14-jul-2012 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) uc3836dtr soic d 8 2500 367.0 367.0 35.0 package materials information www.ti.com 14-jul-2012 pack materials-page 2
important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per jesd46, latest issue, and to discontinue any product or service per jesd48, latest issue. buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all semiconductor products (also referred to herein as ? components ? ) are sold subject to ti ? s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in ti ? s terms and conditions of sale of semiconductor products. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. ti assumes no liability for applications assistance or the design of buyers ? products. buyers are responsible for their products and applications using ti components. to minimize the risks associated with buyers ? products and applications, buyers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which ti components or services are used. information published by ti regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of significant portions of ti information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. ti is not responsible or liable for such altered documentation. information of third parties may be subject to additional restrictions. resale of ti components or services with statements different from or beyond the parameters stated by ti for that component or service voids all express and any implied warranties for the associated ti component or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of ti components in its applications, notwithstanding any applications-related information or support that may be provided by ti. buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. buyer will fully indemnify ti and its representatives against any damages arising out of the use of any ti components in safety-critical applications. in some cases, ti components may be promoted specifically to facilitate safety-related applications. with such components, ti ? 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