oval type led lamps ligitek electronics co.,ltd. property of ligitek only pb lead-free parts lwk22842z/s16-a01/tbs-2 lwk22842z/s16-a01/tbs-2 a - 2011 11 -oct. doc. no : qw0905- rev. : date : data sheet l dcc
1/7 page lwk22842z/s16-a01/tbs-2 part no. ligitek electronics co.,ltd. property of ligitek only note : 1.all dimension are in millimeter tolerance is - + wk zener
ligitek electronics co.,ltd. property of ligitek only absolute maximum ratings at ta=25 ? discharge typ. part no. lwk22842z/s16-a01/tbs-2 water clear horizontal axis 76
ligitek electronics co.,ltd. property of ligitek only page 3/7 . chromaticity coordinates specifications for bin grading . cie chromaticity diagram part no. lwk22842z/s16-a01/tbs-2 bin x y c1 c2 0.31 0.340 0.31 0.300 0.32 0.315 0.32 0.355 0.32 0.355 0.32 0.315 0.33 0.330 0.33 0.370 2200 1800 max group min 2200 2700 2700 3400 3400 4000 4000 5000 a24 a25 a26 a27 a28 b5 0.30 0.30 0.31 0.31 0.340 0.300 0.285 0.325
page 4/7 inch 0.08 0.12 0.43 1.42 0.89 0.17 0.3 0.51 0.23 0.38 0.61 0.06 0.75 0.16 h inch symbol mm minimum ------- 0.09 w0 ------- 0.85 ? ?
fig.5 relative intensity vs.wavelength(ta=25 ( m c d ) f o r w a r d v o l t a g e ( v ) current(ma) forward current(ma) 20020 0 60100 fig.2 relative intensity vs. forward current fig.1 forward current vs. forward voltage wk chip 420 0 page 5/7 ligitek electronics co.,ltd. property of ligitek only part no. lwk22842z/s16-a01/tbs-2 radiation angle(0.5):h 76degree/v 100 degree fig.6 directivity radiation 25% -60 ?
260 0 0 25 50 preheat 120 150 100 5
the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test intended to see soldering well performed or not. the purpose of this test is the resistance of the device under tropical for hours. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. thermal shock test 1.ta=105
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