15.25 15.25 0.75 typ 13.50 13.50 top view a1 side view 0.36 2.56 1 2 2 proprietary and confidential - the information contained in this drawing is the sole property of ironwood electronics, inc. any reproduction in part or as a whole without the written permission of ironwood electronics, inc. is prohibited. u.s. patent no. 8,091,222 b2 item no. description material 1 non-clad substrate; 15.254mm sq., 19x19 array, 0.75mm pitch, bga354 high temperature substrate 2 p-s527a, 0.8mm giga-snap receptacle shell: brass alloy 360; 0.25m [10?] au over 2.54 m [100?] ni finish contact: becu alloy 172; 0.25m [10?] au over 1.27 m [50?] ni finish 3 solder ball, 0.4572mm dia see table part no. suffix solder ball alloy -74 sn63pb37 -74f* sn96.5ag3.0cu0.5 *rohs compliant ironwood electronics, inc. tele: (800) 404-0204 www.ironwoodelectronics.com tolerances: hole diameters 0.03mm [0.001"], pitches (from true position) 0.025mm [0.001"], substrate thickness tolerance 10%, all other tolerances 0.13mm [0.005"] unless stated otherwise. materials and specifications are subject to change without notice. description: giga-snap bga smt foot bga354 19x19 array 0.75 pitch 15.254 sq.mm primary dimension units are millimeters, secondary dimension units are [inches]. status: released rev. a date: 07/16 2015 material: n/a finish: n/a weight: n/a SF-BGA354A-B-74f drawing scale: 4:1 sheet: 1 of 1 drawn by: m. raske file: SF-BGA354A-B-74 dwg SF-BGA354A-B-74 drawing
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