spec no: dsao7003 rev no: v.2b date: apr/13/2016 page: 1 of 8 approved: wynec checked: allen liu drawn: m.liu erp: 1102015374 single level surface mount cbi part number: aaa3528avu/ansgct pure orange super bright green features z surface mount type. z compatible with automatic placement equipment. z compatible with infrared and vapor phase solder proc- esses. z black case enhances contrast ratio. z housing material meets ul94v-0 flammability rating. z lens material meets ul94-hb flammability rating. z moisture sensitivity level : level 3. z rohs compliant. descriptions z the pure orange source color devices are made with gallium arsenide phosphide on gallium phosphide pure orange light emitting diode. z the super bright green source color devices are made with gallium phosphide green light emitting diode. package dimensions notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.25(0.01") unless otherwise noted. 3. the specifications, characteristics and technical data descri bed in the datasheet are subject to change without prior notice . 4.the device has a single mounting surface. the device must be mounted according to the specifications. recommended soldering pattern orange polarity mark
spec no: dsao7003 rev no: v.2b date: apr/13/2016 page: 2 of 8 approved: wynec checked: allen liu drawn: m.liu erp: 1102015374 selection guide notes: 1. 1/2 is the angle from optical centerline where the lumi nous intensity is 1/2 of the optical peak value. 2. luminous intensity / luminous flux: +/-15%. 3. luminous intensity value is traceable to cie127-2007 standards. absolute maximum ratings at ta=25c electrical / optical characteristics at ta=25c notes: 1. wavelength: +/-1nm. 2. forward voltage: +/-0.1v. 3. wavelength value is traceable to cie127-2007 standards. 4. excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradat ion or premature failure. notes: 1. 1/10 duty cycle, 0.1ms pulse width. 2. relative humidity levels maintained between 40% and 60% in pr oduction area are recommended to avoid the build-up of static electricity ? ref jedec/jesd 625-a and jedec/j-std-033. part no. emitting color (material) lens type iv (mcd) [2] @ 20ma v iewing angle [1] min. typ. 2 1/2 aaa3528avu/ansgct pure orange (gaasp/gap) water clear 5 12 super bright green (gap) 5 9 50 symbol parameter emitting color typ. max. units test conditions peak peak wavelength pure orange super bright green 607 565 nm i f =20ma d [1] dominant wavelength pure orange super bright green 602 568 nm i f =20ma ? 1/2 spectral line half-width pure orange super bright green 35 30 nm i f =20ma c capacitance pure orange super bright green 15 15 pf v f =0v;f=1mhz v f [2] forward voltage pure orange super bright green 2.05 2.2 2.5 2.5 v i f =20ma i r reverse current pure orange super bright green 10 10 ua v r = 5v parameter pure orange super bright green units power dissipation 62.5 62.5 mw dc forward current 25 25 ma peak forward current [1] 145 140 ma reverse voltage 5 v operating temperature -40c to +85c storage temperature -40c to +100c
spec no: dsao7003 rev no: v.2b date: apr/13/2016 page: 3 of 8 approved: wynec checked: allen liu drawn: m.liu erp: 1102015374 aaa3528avu/ansgct pure orange
spec no: dsao7003 rev no: v.2b date: apr/13/2016 page: 4 of 8 approved: wynec checked: allen liu drawn: m.liu erp: 1102015374 super bright green
spec no: dsao7003 rev no: v.2b date: apr/13/2016 page: 5 of 8 approved: wynec checked: allen liu drawn: m.liu erp: 1102015374 aaa3528avu/ansgct reflow soldering is recommended and the soldering profile is shown below. other soldering methods are not recommended as they might cause damage to the product. tape dimensions (units : mm) reel dimension
spec no: dsao7003 rev no: v.2b date: apr/13/2016 page: 6 of 8 approved: wynec checked: allen liu drawn: m.liu erp: 1102015374 packing & label specifications aaa3528avu/ansgct terms and conditions for the usage of this document 1. the information included in this docum ent reflects representative usage scenarios and is intended for technical reference on ly. 2. the part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. before production usage customer should refer to the latest datasheet for the updated specifications. 3. when using the products referenced in this document, please make sure the produc t is being operated within the environmental and electrical limits specified in the dat asheet. if customer usage exceeds the spec ified limits, kingbright will not be respon sible for any subsequent issues. 4. the information in this document applies to typical usage in consumer electronics applicati ons. if customer's application ha s special reliability requirements or have life-threatening liabilitie s, such as automotive or m edical usage, please consult with kingbright representative for further assistance. 5. the contents and information of this document may not be reproduced or re-transmitted without permission by kingbright. 6. all design applications should refer to kingbright application notes available at http://www.kingbrightusa.com/applicationnotes
spec no: dsao7003 rev no: v.2b date: apr/13/2016 page: 7 of 8 approved: wynec checked: allen liu drawn: m.liu erp: 1102015374 application notes introduction kingbright aaa3528avu series ar e surface-mounted right -angle light-emitting diode (led) circuit- board indicators. it offers the convenience of su rface-mount production while offering the right-angle height profile of circuit-board indicator lamps. the part is suitable for automated smt and lead-free reflow soldering production. the clear silicone lens extends out to provide broad viewing angles. when installed on customer?s circuit board, it can provide illuminated indication or backlight panel indicators. transport and storage surface mount devices (smd) are moisture sens itive components. atmospheric moisture will seep into the component package, so when placed on the circuit board for 160-200c reflow soldering, the high temperatures cause the absorbed mois ture to vaporize and rapidly expand, creating vapor pressure that could damage the led component by causing cracks in the lens, delamination of the chip and wire bonds, or other reliability issues. 1. transportation the product is packed in anti-static, moisture -proof mylar bags. the package should be carefully handled to avoid external pressure and a ccidental puncture during transport.proper anti-static practices should be in place. if package leakage or damage is found before opening, suggest customer take the damaged package off-line for additional testing and bake to dry before use. 2. storage conditions (before opening) to prevent moisture-absorption reliability i ssues, the parts must be properly stored. suggest do not open the moisture-proof package until immediatel y before usage (except for sample inspection purposes).the opened package must be re-sealed with fresh desiccant and humidity indicator and stored in a dry box (<30 /60% rh). 3. humidity control (after opening) after opening the moisture-proof packaging, immediately check the humidity indicator card contained inside to confirm the parts have been exposed to excess moisture.the production environment should follow ipc/jedec j-std-020 standards for temperature,humidity, and exposure time. smd environmental exposure time accumulates as long as the parts are outside the packaging, unless they are being baked dry. table 1: ipc/jedec j-std-020 moisture sensitivity levels (msl) msl allowed exposure after opening time conditions level 1 no limit Q 30 /85%rh level 2 1 year Q 30 /60%rh level 2a 4 weeks Q 30 /60%rh level 3 168 hours Q 30 /60%rh level 4 72 hours Q 30 /60%rh level 5 48 hours Q 30 /60%rh level 5a 24 hours Q 30 /60%rh level 6 immediately upon open Q 30 /60%rh 4. storage of unused and remaining parts if the full reel was not consumed during production, the production environment was within limits (<30 /60% rh), and the exposure time did not exc eed the limits in table 1, then the remaining parts may be stored as below: z re-sealed with desiccant. z stored within a dry box (5% rh). the dry box storage time would not count against the total exposure time. when the stored parts are taken ou t, the exposure time is accu- mulated from the previous production run.
spec no: dsao7003 rev no: v.2b date: apr/13/2016 page: 8 of 8 approved: wynec checked: allen liu drawn: m.liu erp: 1102015374 application notes 5. humidity control of pcb-mounted parts if the moisture-sensitive smd parts will not undergo further reflow or other high-temperature processes, then no special treatment is requir ed. however, if the pcb assembly requires further reflow or other high-temperature process, in cluding rework, then the mounted smd?s exposure time should continue to accumulate against the msl limit, unless the board is kept in a dry environ ment (<5% rh).if the exposure time exceeds the ms l limit, the board and part must be baked dry to reset the exposure time before undergoing further reflow. installation and usage if the part?s silicone lens extends beyond the boa rd?s edge after installation, proper protection should be made (such as covers) to prevent acci dental impact or stress on the exposed lens that would cause damage or detachment. the silicone lens may withstand up to 1.5-newton in shear force when properly mounted.if exte rnal protection is not available, strongly suggest following these handling procedures to prevent damage: 1. when the pcb assembly is handled or transpor ted after reflow soldering, care must be taken to prevent accidental contact or impact on the exposed silicone lens. 2. when the pcb assembly is installed into the ca sing or panel, care must be taken to maintain sufficient clearance for the lens. 3. do not subject the silicone lens to outside impact or friction. cleaning 1. do not use unknown chemicals or acidic solv ents to clean the part. please check to insure the cleaning solvent will notcorode epoxy resin, silicone resin, silver plating, and other component materials before using. 2. kingbright suggests ethanol as a safe solvent for use with the surface mount devices. softly wipe away any surface partcles,avoiding excessi ve force scratching the surface or damaging the struc- tures. then place down and allow to naturally dry under room temperature conditions before further use. do not soak the component in the solvent.
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