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product structure : silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays 1/19 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14? 001 tsz02201-0323aaj00020-1-2 16.feb.2015 rev.003 4.2v to 18v, 2a 1ch synchronous buck converter with integrated fet bd9328efj general description the bd9328efj is a synchronous step-down switching regulator with built-in two low-resistance n-channel mosfets. this ic can supply continuous output current of 2a over a wide input range, and provides not only fast tran sient response, but also easy phase compensation because of current mode control. features ? uses low esr output ceramic capacitors ? low standby current ? 380 khz fixed operating frequency ? feedback voltage ? 0.9v 1.5%(ta=25c) ? 0.9v 2.0%(ta=-25c to +85c) ? under voltage protection ? thermal shutdown ? over current protection applications distributed power systems pre-regulator for linear regulators key specifications ? input voltage range: 4.2v to 18v ? output voltage range: 0.9v to (v in x 0.7)v ? output current: 2a (max) ? switching frequency: 380khz(typ) ? hi-side fet on-resistance: 0.15 ? (typ) ? lo-side fet on-resistance: 0.13 ? (typ) ? standby current: 15 a (typ) ? operating temperature range: -40c to +85c package w (typ) d (typ) h (max) typical application circuit r_bs protect from vin-bst short destruction. figure 1. typical application circuit c_co1 r_pc 7.5k ? r_up c_bs 0.1 f 10h c_vc1 10 f c_pc 3300pf r_dw 10k ? 27k ? 20 f c_ss 0.1 f l ss en comp fb bst vin gnd sw thermal pad (to be shorted to gnd) v in = 12v v out = 3.3v r_bs 22? htsop-j8 4.90mm x 6.00mm x 1.00mm datashee t
datasheet d a t a s h e e t 2/19 16.feb.2015 rev.003 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bd9328efj tsz02201-0323aaj00020-1-2 pin configuration block diagram figure 2. pin configuration figure 3. block diagram pin description pin no. pin name function 1 bst high-side gate drive boost input 2 vin power input 3 sw power switching output 4 gnd ground 5 fb feedback input 6 comp compensation node 7 en enable input 8 ss soft start control input (top view) bst vin sw gnd fb comp en ss v in
datasheet d a t a s h e e t bd9328efj 3/19 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 15 001 tsz02201-0323aaj00020-1-2 16.feb.2015 rev.003 absolute maximum ratings (ta = 25 c ) parameter symbol rating unit supply voltage v in 20 v switch voltage v sw 20 v power dissipation for htsop-j8 pd 3.76 (note 1) w package thermal resistance ja (note 2) ja 29.27 c /w package thermal resistance jc (note 2) jc 3.75 c /w operating temperature range topr -40 to +85 c storage temperature range tstg -55 to +150 c maximum junction temperature tjmax 150 c bst voltage v bst v sw +7 v en voltage v en 20 v all other pins v oth 20 v (note 1) derating is done 30.08 mw/c when operating above ta 25c (mount on 4-layer 70.0mm x 70.0mm x 1.6mm board) (note 2) mount on a 4-layer 50mm x 30mm x 1.6mm application board caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta= -40 c to +85 c ) parameter symbol rating unit min typ max supply voltage v in 4.2 12 18 v sw voltage v sw -0.5 - +18 v output current i sw3 - - 2 a output voltage range v range 0.9 - v in x 0.7 v electrical characteristics (unless otherwise specified v in =12v ta=25c) parameter symbol limit unit conditions min typ max error amplifier block fb input bias current i fb - 0.02 2 a feedback voltage1 v fb1 0.886 0.900 0.914 v voltage follower feedback voltage2 v fb2 0.882 0.900 0.918 v ta=-25c to +85c sw block ? sw hi-side fet on-resistance r onh - 0.15 - ? i sw = -0.8a lo-side fet on-resistance r onl - 0.13 - ? i sw = 0.8a hi/lo-side fet leak current i leakn - 0 10 a v in = 18v, v sw = 0v / 18v switch current limit i limit3 3 - - a maximum duty cycle m duty - 90 - % v fb = 0v general enable sink current i en 90 180 270 a v en = 12v enable threshold voltage v en 1.0 1.2 1.4 v under voltage lockout threshold v uvlo 3.5 3.75 4.0 v v in rising under voltage lockout hysteresis v hys - 0.3 - v soft start current i ss 5 10 15 a v ss = 0 v soft start time t ss - 22 - ms c ss = 0.1 f operating frequency f osc 300 380 460 khz circuit current i cc - 1.2 3 ma v fb = 1.5v, v en = 12v standby current i qui - 15 27 a v en = 0v
datasheet d a t a s h e e t bd9328efj 4/19 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 15 001 tsz02201-0323aaj00020-1-2 16.feb.2015 rev.003 typical performance curves (unless otherwise specified, v in = 12v ta= 25c) figure 6. input bias current vs feedback voltage figure 5. standby current vs input voltage (shutdown mode) figure 4. circuit current vs input voltage (no switching) figure 7. feedback voltage vs temperature temperature [c] i fb (a) v fb (v) i cc (a) v in (v) i cc (ma) v in (v)
datasheet d a t a s h e e t bd9328efj 5/19 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 15 001 tsz02201-0323aaj00020-1-2 16.feb.2015 rev.003 typical performance curves - continued figure 10. step-down efficiency vs i o (v in = 12v v out = 3.3v l=10h) figure 9. operating fr equency vs temperature figure 8. hi-side, low-side fet on-resistance vs temperature figure 11. soft start time vs soft start capacitor soft start time [ms] c ss [f] 50 55 60 65 70 75 80 85 90 95 0 500 1000 1500 2000 io[ma] efficiency[%] efficiency i o [ma] 360 365 370 375 380 385 390 -40-20 0 204060 80 temp (c) fosc (khz) f osc (khz) temperature [c] r on [ ? ] temperature [c]
datasheet d a t a s h e e t bd9328efj 6/19 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 15 001 tsz02201-0323aaj00020-1-2 16.feb.2015 rev.003 typical waveforms figure 13. transient response (v in = 12v v out = 3.3v l= 10h c out =20f i out = 0.2-1.0a ) figure 15. transient response (v in = 12v v out = 3.3v l= 10h c out =20f i out = 0.2-2.0a) figure 14. output ripple voltage (v in = 12v v out = 3.3v l= 10h c out =20f i out = 1.0a ) v out i out figure 12. over current protection (v out is shorted to gnd)
datasheet d a t a s h e e t bd9328efj 7/19 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 15 001 tsz02201-0323aaj00020-1-2 16.feb.2015 rev.003 typical waveforms - continued figure 17. start-up waveform (v in = 12v v out = 3.3v l= 10h c ss = 0.1f) figure 16. output ripple voltage (v in = 12v v out = 3.3v l= 10h c out =20f i out = 2.0a ) t ss
datasheet d a t a s h e e t bd9328efj 8/19 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 15 001 tsz02201-0323aaj00020-1-2 16.feb.2015 rev.003 application information 1. typical application circuit r_bs protect from vin-bst short destruction. figure 18. typical application circuit symbol maker part no input capacitor c_vc1 tdk c3225jb1e106k 10f/25v output capacitor c_co1 tdk c3216jb1c106m 10f/16v inductor l tdk slf10165-100m3r8 10h/3.8a c_co1 r_pc 7.5k ? r_up c_bs 0.1 f 10h c_vc1 10 f c_pc 3300pf r_dw 10k ? 27k ? 20 f c_ss 0.1 f l ss en comp fb bst vin gnd sw thermal pad (to be shorted to gnd) v in = 12v v out = 3.3v r_bs 22 ?
datasheet d a t a s h e e t bd9328efj 9/19 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 15 001 tsz02201-0323aaj00020-1-2 16.feb.2015 rev.003 2. block operation (1) vreg this block generates a constant voltage for dc/dc boosting. (2) vref this block generates an internal reference voltage of 5.1 v (typ). (3) tsd/uvlo tsd (thermal shutdown)/uvlo (under voltage lockout) protection block. the tsd circuit shuts down the ic at high temperature. the uvlo circuit shuts down the ic when the vin voltage is low. (4) error amp block (err) this block compares the reference voltage and the feedback voltage from the output. the output voltage of this block, which is connected to comp pin, determines the switching duty cycle. at the time of startup, since the soft start is operated by the ss pin voltage, the comp pin voltage is limited to the ss pin voltage. (5) oscillator block (osc) this block generates the oscillating frequency. (6) slope block this block generates the triangular waveform with the us e of the clock created by os c. the generated triangular waveform is sent to the pwm comparator. (7) pwm block the comp pin voltage output of the error amp is compared to the slope block's triangular waveform to determine the switching duty. since the switching duty cycle is limited by the maximum duty ratio which is determined internally, 100% duty cycle cannot be achieved. (8) drv block a dc/dc driver block that accepts signal from the pwm block to drive the power fets. (9) ocp block ocp (over current protection) block. t he current that flows through the fets is detected, and ocp starts when it reached 3.0a (min). after ocp detection, switching is tu rned off and the ss capacitor is discharged. ocp is not a ?latch type? but an ?auto restart?. (10) soft start circuit this circuit prevents output voltage overshoot or inrush current by making the output voltage rise gradually while restricting the current at the time of startup.
datasheet d a t a s h e e t bd9328efj 10/19 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 15 001 tsz02201-0323aaj00020-1-2 16.feb.2015 rev.003 3. selecting application components (1) output lc filter constant selection (buck converter) the output lc filter is required to suppl y constant current to the ou tput load. a larger inducta nce value at this filter results in less inductor ripple current ( ? ) and less output ripple voltage. however, inductors with large values tend to have slower load transient-response, a larg er physical size, a lower saturation current, and a higher series resistance. a smaller value of inductance has almost opposite characte ristics as above. so, choosi ng the inductor ripple current ( ? ) between 20% to 40% of the averaged inductor current (equivalent to the output load current) is a good compromise. figure 19 figure 20 setting ? i l = 30% x averaged inductor current (2a) = 0.6 [a] where: v in = 12v, v out = 3.3v, fosc = 380 khz, fosc is the switching frequency also the inductor should have a higher saturation current than i outmax + ? i l / 2. the output capacitor c out affects the output ripple-voltage. choose a high-value capacitor to achieve a smaller ripple-voltage that is enough to meet the application requirement. output ripple voltage ? v rpl is calculated using the following equation: where: r esr is the parasitic series resistance of the output capacitor. setting c out = 20f, r esr = 10m ? (2) loop compensation choosing compensation capacitor c cmp and resistor r cmp the current-mode buck converter has 2-poles and 1-zero sy stem. choosing the appropriate compensation resistor and capacitor is important to achieve a good load-transient response and good stability. an example of a dc/dc converter applicatio n bode plot is shown in figure 22. the compensation resistor, r cmp , determines the cross over frequency f crs (the frequency at which the total dc-dc loop-gain falls to 0db). setting a higher cross-over frequency achieves good response speed, but less stability. on the other hand, setting the cross-over frequency to a lower value may result to better stability, but poorer response speed. setting the cross-over frequency to 1/10 of the switch ing frequency shows good performance at most applications. v out l v in c out i l t i outmax + ? ?? ?? h i f v v v v l l osc in out in out ? ? ? ? ? ? ? ? ? ?? v f c r i v osc out esr l rpl ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? i l i l mv k m v rpl 8 . 15 )) 380 20 8 /( 1 10 ( 6 . 0 ? ? ? ? ? ? ? ?
datasheet d a t a s h e e t bd9328efj 11/19 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 15 001 tsz02201-0323aaj00020-1-2 16.feb.2015 rev.003 phase margin >+ 180 >+ 90 >+ 180 >+ 90 0 0 a (a) gbw(b) f f gain [db] phase f crs (a) choosing phase compensation resistor r cmp the compensation resistor r cmp can be calculated by the following formula: where: v out is the output voltage f crs is the cross over frequency c out is the output capacitor v fb is the internal feedback voltage ( 0.9v (typ) ) g mp is the current sense gain ( 7.8a/v (typ) ) g ma is the error amplifier trans-conductance ( 300a/v (typ) ) setting v out = 3.3v, f crs = 38khz, c out = 20f; (b) choosing phase compensation capacitor c cmp for stability of the dc/dc converter, cancellation of the phase delay that derives from output capacitor c out and resistive load r out is possible by inserting the phase advance. the phase advance can be added by the zero on compensation resistor r cmp and capacitor c cmp . making f z = f crs / 6 gives a first-order estimate of c cmp . compensation capacitor setting f z = f crs /6 = 6.3khz; compensation capacitor however, the best values for zero and f crs differ between applications. decide the values accordingly after calculation using the formula above and conf irmation on the actual application. (c) the condition of the loop compensation stability the stability of dc/dc converter is important. to ensure operation stability, check if the loop compensation has enough phase-margin. for the condition of loop compensation stability, the phase-delay must be less than 150 degrees at 0 db gain. feed-forward capacitor, c rup , boosts phase margin over a limited frequency range and is sometimes used to improve loop response. c rup will be more effective if r up >> r up ||r dw figure 21 figure 22 (3) design of feedback resistance constant set the feedback resistance as shown below. figure 23 >+ >) v out r up c cmp comp r cmp fb r dw 0.9v c rup 0.9v >+ v out r1 r2 err fb ?? ? ? ? ? ? ? ? ma mp fb out crs out cmp g g v c f v r ? ?? f fz r c cmp cmp ? ? ? ? v r r r v out ? ? ? phase margin phase margin phase f crs ] [ 5 . 7 5 . 7482 300 8 . 7 9 . 0 20 38 3 . 3 2 ? ? ? ? ? ? ? ? ? k k r cmp ? ? ? f k r c cmp cmp ? ? ? ? ? ? ? ? ? ?
datasheet d a t a s h e e t bd9328efj 12/19 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 15 001 tsz02201-0323aaj00020-1-2 16.feb.2015 rev.003 4. soft start function an adjustable soft-start function to prevent high inrush current during start-up is available. the soft-start time is set by the external capacitor connected to ss pin. the soft start time is given by the charge time of c ss the ss terminal rising time setting c ss = 0.1f please confirm the overshoot of the output voltage and inrush current in deciding the ss capacitor value. 5. en function the en terminal controls the ic?s shut down. leaving en terminal open shuts down the ic. to start the ic, the en terminal should be connected to v in or to another power source. when the en voltage exceeds 1.2v (typ), the ic starts operating. (attention) if the falling edge of en input is too slow, output chattering occurs. this may cause large inverse current from output to input to flow and v in voltage to increase, leading to destruction of the ic. thus, set the fall time of en signal within 100s when controlling the on/off operation of the ic. this requirement is not needed when en pin is connected with vin and en is not controlled. as a recommendation, control en with an open drain mosfet connected as shown on figure 25. figure 25 c ss ss + + - comp i ss 10a erramp v in en 66 k ? (typ) 91 k ? (typ) ? ? ss ss ss i c s t / 2 . 2 ? ? ren on/off signal en r en ? ? ss ss ss i c s t / 6 . 0 1 ? ? ? ? ss ss ss i c s t / 6 . 1 2 ? ? ms s t ss ? ? ? ? ? ? figure 24
datasheet d a t a s h e e t bd9328efj 13/19 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 15 001 tsz02201-0323aaj00020-1-2 16.feb.2015 rev.003 c in fet c out l v out v in 6. layout pattern consideration two high pulsing current loops exist in the buck regulator syst em. the first loop, when fet is on, starts from the input capacitors, to the vin terminal, to the sw terminal, to the in ductor, to the output capacitors, and then returns to the input capacitor through gnd. the second loop, when fet is off, starts from the low fet, to the inductor, to the output capacitor, and then returns to the low fet through gnd. to reduce the noise and improve the efficiency, please minimize these two loop areas. the input capacitor, output capacito r and the low fet should be connected to the pcb?s gnd plain. pcb layout may greatly affect the therma l performance, noise and efficiency. so please take extra care when designing pcb layout patterns. (1) the thermal pad on the back side of the ic has the grea test thermal conduction into the chip. so using the gnd plane as broad and wide as possible can help thermal dissipat ion. adding thermal via for dissipation of heat into the different layers is also effective. (2) the input capacitors should be connect ed as close as possible to the vin terminal. (3) when there is an unused area on the pcb, please arrange the copper foil plain of dc nodes, such as gnd, vin and vout for better heat dissipation of the ic or circumference parts. (4) to avoid the noise influence from ac coupling with the ot her lines, keep the switching lines such as sw as short as possible, and coil traces as short and as thick as possible. (5) keep sensitive signal traces such as traces connected to fb and comp away from sw pin. (6) the inductor and the output capacitors should be placed close to sw pin as much as possible. comp bst vin sw fb ss en gnd c out l v out c in figure 26. current loop in buck regulator system figure 27. an example of pcb layout pattern
datasheet d a t a s h e e t bd9328efj 14/19 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 15 001 tsz02201-0323aaj00020-1-2 16.feb.2015 rev.003 i/o equivalence circuit 1.bst 3.sw 5.fb 6.comp 7.en 8.ss figure 28. i/o equivalence circuit power dissipation v in v in sw reg v in v in v in v in v in htsop-j8 package on 70mm x 70mm x 1.6 mm glass epoxy pcb (1) 1-layer board (backside copper foil area 0 mm x 0 mm) (2) 2-layer board (backside copper foil area 15 mm x 15 mm) (3) 2-layer board (backside copper foil area 70 mm x 70 mm) (4) 4-layer board (backside copper foil area 70 mm x 70 mm) 150 0 50 75 100 125 2000 4000 1000 3000 25 power dissipation: pd [mw] ambient temperature: ta [c] (1)820mw (2)1100mw (3)2110mw (4)3760mw 0 power dissipation : pd [mw] ambient temperature : ta [c]
datasheet d a t a s h e e t bd9328efj 15/19 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 15 001 tsz02201-0323aaj00020-1-2 16.feb.2015 rev.003 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance s upply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and s upply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all powe r supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epox y board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the ex pected characteristics of the ic can be approximately obtained. the electrical characteristics are guar anteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possi ble that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always dischar ge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
datasheet d a t a s h e e t bd9328efj 16/19 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 15 001 tsz02201-0323aaj00020-1-2 16.feb.2015 rev.003 operational notes ? continued 11. unused input pins input pins of an ic are of ten connected to the gate of a mos transis tor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electr ic field from the outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic . the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 29. example of monolithic ic structure 13. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circui t that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are autom atically restored to normal operation. note that the tsd circuit operates in a situation that exceed s the absolute maximum rati ngs and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other t han protecting the ic from heat damage. 14. over current protection circuit (ocp) this ic incorporates an integrated overcu rrent protection circuit that is acti vated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit. 15. en control speed chattering happens if standing lowering speed is slow when standing of en pin is lowered. the reverse current in which the input side and the pressure operation are done fr om the output side is generat ed when chattering operates with the output voltage remained, and there is a case to destruction. please set to stand within 100us when you control on/off by the en signal. 16. about output voltage when en terminal on when restarting by en terminal, bd9328efj starts from 0v. when an electric charge is left in an output capacitance at this time, electric current discharge from an output capacit ance is performed. when many electric charges are left in an output capacitance, this electrical current di scharge becomes big, and bd9328efj sometimes comes to destruction. therefore please do the discharge control to follow conditions of output voltage when en terminal on. in case of output capacitor value is less than 100 f,: please set the output voltage less than 2.0v when en terminal on. in case of output capacitor value is more than 100 f,: please set the output voltage based on the next formula. (output voltage when en terminal on [v]) < 9.15 x ( output capacitance [ f] ) (-0.33)
datasheet d a t a s h e e t bd9328efj 17/19 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 15 001 tsz02201-0323aaj00020-1-2 16.feb.2015 rev.003 ordering information b d 9 3 2 8 e f j - e 2 part number package efj : htsop-j8 packaging and forming specification e2: embossed tape and reel marking diagram htsop-j8(top view) d9328 part number marking lot number 1pin mark
datasheet d a t a s h e e t bd9328efj 18/19 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 15 001 tsz02201-0323aaj00020-1-2 16.feb.2015 rev.003 physical dimension tape and reel information package name htsop-j8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin
datasheet d a t a s h e e t bd9328efj 19/19 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 15 001 tsz02201-0323aaj00020-1-2 16.feb.2015 rev.003 revision history date revision changes 11.apr.2012 001 new release 02.sep.2014 002 applied the rohm standard style and improved understandability. 16.feb.2015 003 add ?16.about output voltage when en terminal on? in operational notes
datasheet d a t a s h e e t notice-ge rev.004 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be us ed on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice-ge rev.004 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bd9328efj package htsop-j8 unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes bd9328efj - web page

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