this is information on a product in full production. december 2015 docid024809 rev 3 1/8 STPSC12H065C 650 v power schottky silicon carbide diode datasheet - production data features ? no or negligible reverse recovery ? switching behavior independent of temperature ? high forward surge capability ? ecopack ? 2 compliant component description the sic diode is an ultrahigh performance power schottky diode. it is ma nufactured us ing a silicon carbide substrate. the wide band gap material allows the design of a schottky diode structure with a 650 v rating. due to the schottky construction, no recovery is shown at turn-off and ringing patterns are negligible. the minimized capacitive charge at turn-off behavior is independent of temperature. especially suited for use in interleaved or bridge- less topologies, this dual -diode rectifier will boost the performance in hard switching conditions. its high forward surge capa bility ensures a good robustness during transient phases. $ . $ $ $ . 7 2 $ % table 1. device summary symbol value i f(av) 2 x 6 a v rrm 650 v t j (max) 175 c www.st.com
characteristics STPSC12H065C 2/8 docid024809 rev 3 1 characteristics when the diodes 1 and 2 are used simultaneously: ? t j (diode 1) = p(diode1) x r th(j-c) (per diode) + p(diode2) x r th(c) to evaluate the conduction loss es use the following equation: p = 1.35 x i f(av) + 0.192 x i f 2 (rms) table 2. absolute ratings (limiting values per diode at 25 c unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 650 v i f(rms) forward rms current 22 a i f(av) average forward current t c = 135 c (1) , dc per diode 6 a t c = 135 c (2) , dc per device 12 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal, t c = 25 c t p = 10 ms sinusoidal, t c = 125 c t p = 10 s square, t c = 25 c 60 52 400 a i frm repetitive peak forward current t c = 135 c (1) , t j = 175 c, ? = 0.1 25 a t stg storage temperature range -65 to +175 c t j operating junction temperature (3) -40 to +175 c 1. value based on r th(j-c) max (per diode) 2. value based on r th(j-c) max (per device) 3. condition to avoid thermal runaway for a diode on its own heatsink dptot dtj --------------- 1 rth j a ? ?? ------------------------- - ? table 3. thermal resi stance parameters symbol parameter typ. max. unit r th(j-c) junction to case per diode 1.6 2.4 c/w per device 0.875 1.275 r th(c) coupling - 0.15 table 4. static electrical characteristics (per diode) symbol parameter tests conditions min. typ. max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm -560 a t j = 150 c - 50 250 v f (2) forward voltage drop t j = 25 c i f = 6 a - 1.56 1.75 v t j = 150 c - 1.98 2.5 1. t p = 10 ms, ? < 2% 2. t p = 500 s, ? < 2%
docid024809 rev 3 3/8 STPSC12H065C characteristics 8 table 5. dynamic electrical characteristics (per diode) symbol parameter test conditions typ. unit q cj (1) total capacitive charge v r = 400 v 18 nc c j total capacitance v r = 0 v, t c = 25 c, f = 1 mhz 300 pf v r = 400 v, t c = 25 c, f = 1 mhz 30 1. most accurate value for the capacitive charge: 4 f m y 5 g y 5 f m 3 9 2 8 7 figure 1. forward voltage drop versus forward current (typical values, low level, per diode) figure 2. forward voltage drop versus forward current (typical values, high level, per diode) 7 d ? & 7 d ? & 7 d ? & 3 x o v h w h v w w s ? v 7 d ? & $ , ) 0 9 ) 0 9 , ) 0 $ 7 d ? & 7 d ? & 7 d ? & 3 x o v h w h v w w s ? v 7 d ? & 9 ) 0 9 figure 3. reverse leakage current versus reverse voltage applied (typical values, per diode) figure 4. peak forward current versus case temperature , 5 ? $ ( ( ( ( ( 7 m ? & 7 m ? & 7 m ? & 9 5 9 , 0 $ 7 / w s 7 w s / / / / / 7 & ? & |