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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys 1/ 24 tsz22111 ? 14 ? 001 ? 20 16 rohm co., ltd. all rights reserved. tsz02201-0j2j0a601130-1-2 06.jun.2016 rev.002 www.rohm.com 0.95v to v cc -1v , 0.5a/1.0a 1ch ultra low dropout linear regulators bd 35 40nuv bd3541nuv general description the bd3540nuv, bd3541nuv are ultra low-dropout linear chipset requlator that operate from a very low input supply. they offer ideal performance in low input voltage to low output voltage applications. the input - to -output voltage difference is minimized by using a built-in n-channel power mosfet with a maximum on-resistance of r on =4 00m (typ) , 2 00m (typ). by lowering the dropout voltage, the regulator realizes high output current (i outmax =0.5a to 1.0a) thereby, reducing conversion loss, making it comparable to a switching regulator and its power transistor, choke coil, and rectifier diode constituents. the bd3540nuv, bd3541nuv are available in significantly downsized package profiles and allow low -cost design. an external resistor allows the entire range of output voltage configurations between 0.65v and 2.7v, while the nrcs (soft start) function enables a controlled output voltage ramp-up, which can be programmed to a required power supply sequence. features ? h igh -precision voltage regulator (0.65v 1%) ? built-in vcc undervoltage lockout circuit ? nrcs (soft start) function reduces the magnitude of in -rush current ? internal n-channel mosfet driver offers low on -resistance ? built-in current limit circuit ? built-in thermal shutdown (tsd) circuit ? variable output ? tracking function key specifications ? in input voltage range: 0.95v to v cc -1v ? vcc input voltage range: 3.0v to 5.5v ? output voltage range: 0.65v to v in - 0. 3v ? output current: bd3540nuv 0.5a (max) bd3541nuv 1 .0 a (max) ? on-resistance: bd3540nuv 400m ( typ) bd3541nuv 200m( typ) ? standby current: 0a (typ) ? operating temperature range: - 10 c to +100c package w(typ) x d(typ) x h(max) applications notebook computers, desktop computers, lcd-tv, dvd, digital appliances typical application circuit, block diagram vson010v3030 3.00mm x 3.00mm x 1.00mm reference block thermal shutdown nrcs current limit cl uvlo tsd en v cc uvlo cl en v cc in out fb gnd nrcs pgdly out in tsd 1 2 power good 9 10 4 3 8 7 6 5 pg out r 1 r 2 c fb c 3 c 2 c 1 c nrcs c pgdly amp datashee t downloaded from: http:///
2/ 24 bd3540nuv bd3541nuv ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 06.jun.2016 rev.002 tsz02201-0j2j0a601130-1-2 pin descriptions pin no. pin name pin function 1 vcc power supply pin 2 en enable input pin 3 pg power good pin 4 pgdly power good delay capacitor connection pin 5 in input voltage pin 6 out output voltage pin 7 out output voltage pin 8 fb reference voltage feedback pin 9 nrcs capacitor connection pin for non rush current on start- up 10 gnd ground pin description of blocks 1. amp this is an error amp that compares the reference voltage (0.65v) with fb voltage to drive the output n-channel fet. (ron=400m :bd3540nuv,ron=200m :bd3541nuv) frequency optimization aids in attaining rapid transient res ponse, and to support the use of ceramic capacitors on th e output. the amp output voltage ranges from gnd to vcc. when en i s off, or when uvlo is active, output goes low and the output of the n-channel fet switches off. 2. en the en block controls the on and off state of the regulator via the en logic input pin. during off state, circuit voltage stabilizes at 0a which minimizes the current c onsumption during standby mode. the fet is switched on to enable discharge of the nrcs and out, thereby draining the excess charge and preventing the load side of an ic from malfunctioning. since there is no electrical connectio n required (e.g. between the vcc pin and the esd prevention diode), module operation is independent of the input sequence. 3. uvlo to prevent malfunctions that can occur during a sudden d ecrease in vcc, the uvlo circuit switches the output off, and (like the en block) discharges nrcs and out. once the uvl o threshold voltage (typ2.5v) is reached, the power-on reset is triggered and output is restored. 4. current limit during on state, the current limit function monitors the output curre nt of the ic against the current limit value (0.5a or more: bd3540nuv,1.0a or more for bd3541nuv). when output current exce eds this value, this block lowers the output current to protect the load of the ic. when it overcomes the overcurrent state, output voltage is restored to the normal value. 5. nrcs (non rush current on start- up) the soft start function is enabled by connecting an ex ternal capacitor between the nrcs pin and gnd. output ramp-up can be set for any period up to the time the nrcs pin reaches v fb (0.65v). during startup, the nrcs pin serves as a 20a (typ) constant current source to charge the external capacitor. output start time is calculated by formula (1) below. ? ? 1 a 20 v 65 .0 c t ??? ? ? tracking sequence is possible by connecting the nrcs ou tput to an external power supply instead of external capacitor. and then, ratio-metric sequence is also availa ble by changing the resistor-divi der ratio of external power supply voltage. (see page 13 ) 6. tsd (thermal shut down) the shutdown (tsd) circuit automatically latched off when th e chip temperature exceeds the threshold temperature after the programmed time period elapses, thus protecting the ic against thermal runaway and heat damage. since the tsd circuit is designed only to shut down the ic in th e occurrence of extreme heat, it is important that the tj (m ax) parameter should not be exceeded in the thermal design, in ord er to avoid potential problems with the tsd. 7. in the in line acts as the major current supply line, and is connected to the output n-channel fet drain. since there is no electrical connection (such as between the vcc pin an d the esd protection diode)required, in operates independent of the input sequence. however, since an outpu t n-channel fet body diode exists between in and out, a v in -v out electric (diode) connection is present. therefore, that wh en output is switched on or off, reverse current may flow from out to in . downloaded from: http:///
3/ 24 bd3540nuv bd3541nuv ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 06.jun.2016 rev.002 tsz02201-0j2j0a601130-1-2 de scription of blocks C continued 8. power g ood i t determines the status of the output voltage. this is an o p en -drain pin, which is connected to vcc pin through the pull - up resistance (100k or so). pg pin will be judged high between the fb voltage v out 0.9v (typ) to v out 1.1v(typ), and will be judged low if the voltage is out of this ra nge. 9. pgdly pg pin output delay can be set by connecting pgdly pin to a 100pf capacitor. pg pin delay time is determined by the following formula. ? ? ? ? ? ? sec a i 75 .0 pf c t pgdly pgdly ? ? ? ? absolute maximum ratings (ta=25c) parameter symbol limit unit bd3540nuv bd3541nuv input voltage 1 v cc +6.0 (note 1) v input voltage 2 v in +6.0 (note 1) v enable input voltage v en -0.3 to +6.0 v pg pin input voltage v pgood +6.0 (note 1) v power dissipation 1 pd 1 0.70 (note 2) w power dissipation 2 pd 2 1.27 (note 3) w power dissipation 3 pd 3 3.03 (note 4) w operating temperature range topr - 10 to +100 c storage temperature range tstg - 55 to +150 c junction temperature tjmax +150 c (note 1) should not exceed pd. (note 2) derate by 5.6mw/ c for ta above 25 c (when mounted on a 74.2mm x 74.2mm x 1.6mm glass-epoxy board, 1-layer) copper foil area 0mm 2 (note 3) derate 10.1mw/ c for ta above 25 c (when mounted on a 74.2mm x 74.2mm x 1.6mm glass-epoxy bo ard, 4-layer) copper foil area 6.28mm 2 (note 4) derate by 24.2mw/ c for ta above 25 c (when mounted on a 74.2mm x 74.2mm x 1.6mm glass-epoxy b oard, 4-layer) copper foil area 5505mm 2 caution: operating the ic over the absolute maximum ratings may damage th e ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating condition s (ta=25 c ) parameter symbol min max unit input voltage 1 v cc 3.0 5.5 v input voltage 2 v in 0.95 v cc -1 (note 5) v output current i o ut - bd3540nuv bd3541nuv a 0.5 1.0 pg pin input voltage v pgood -0.3 5.5 v output voltage setting range v out v fb v in - 0. 3 v enable input voltage v en -0.3 5.5 v (note 5) vcc and in do not have to be implemented in the order listed. downloaded from: http:///
4/ 24 bd3540nuv bd3541nuv ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 06.jun.2016 rev.002 tsz02201-0j2j0a601130-1-2 electrical characteristics (unless otherwise specified, ta=25 c , v cc =5v, v en =3v, v in =1.7v, r 1 =3.9k, r 2 =3.3k) parameter symbol limit unit conditions min typ max circuit current i cc - 0.7 1.0 ma vcc shutdown mode current i st - 0 10 a v en =0v output voltage temperature coefficient tcvo - 0.01 - %/ c feedback voltage 1 v fb1 0.643 0.650 0.657 v feedback voltage 2 v fb2 0.637 0.650 0.663 v tj =-10c to +100c load regulation reg.l - 0.5 10 mv (bd3540nuv i o ut =0a to 0.5a) (bd3541nuv i out =0a to 1.0a) line regulation 1 reg.l1 - 0.1 0.5 %/v v cc =3.0v to 5.5v line regulation 2 reg.l2 - 0.1 0.5 %/v v in =1.5v to 3.3v standby discharge current i den 1 - - ma v en =0v, v out =1v [enable] enable pin input voltage high v enhi 2 - - v enable pin input voltage low v enlow 0 - v cc x 0.15 v enable input bias current i en - 7 10 a v en =3v [nrcs] nrcs charge current i nrcs 14 20 26 a v nrcs =0.5v nrcs standby voltage v stb - 0 50 mv v en =0v [uvlo] vcc undervoltage lockout threshold voltage v ccuvlo 2.3 2.5 2.7 v vcc: sweep- up vcc undervoltage lockout hysteresis voltage v cchys 50 100 150 mv vcc: sweep-down [p ower good] low -side threshold voltage v thpgl v out x 0.87 v out x 0.9 v out x 0.93 v high-side threshold voltage v thpgh v out x 1.07 v out x 1.1 v out x 1.13 v pgdly charge current i pgdly 1.4 2.0 2.6 a ron r pg 30 75 150 [amp] minimum dropout voltage bd3540nuv dv out - 200 300 mv i out =0.5a, v in =1.2v, ta=-10c to +100c bd3541nuv dv out - 200 300 mv i out =1.0a, v in =1.2v, ta=-10c to +100c downloaded from: http:///
5/ 24 bd3540nuv bd3541nuv ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 06.jun.2016 rev.002 tsz02201-0j2j0a601130-1-2 typical waveforms bd3540nuv figure 1. transient response (0 a to 0.5a) c out =100 f, c fb =1000pf figure 2. transient response (0 a to 0.5a) c out =47 f , c fb =1000pf 38mv v out 50mv/div i out 0.5a/div i out =0a to 1a/ sec t(10 sec/div) 0.5a fi gure 3. transient response (0 a to 0.5a) c out =22 f, c fb =1000pf figure 4. transient response (0.5a to 0a) c out =100 f, c fb =1000pf v out 50mv/div i out 0.5a/div 13mv 0.5a i out =1a to 0a/ sec t(100 sec/div) 29mv 0.5a v out 50mv/div i out 0.5a/div i out =0a to 1a/ sec t(10 sec/div) 13mv 0.5a v out 50mv/div i out 0.5a/div i out =0a to 1a/ sec t(10 sec/div) downloaded from: http:///
6/ 24 bd3540nuv bd3541nuv ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 06.jun.2016 rev.002 tsz02201-0j2j0a601130-1-2 typical waveforms C continued bd3541 nuv 35mv 0.5a i out =1a to 0a/ sec t(100 sec/div) v out 50mv/div i out 0.5a/div 25mv 0.5a i out =1a to 0a/ sec t(100 sec/div) v out 50mv/div i out 0.5a/div figure 5. transient response (0.5 to 0a) c out =47 f, c fb =1000pf figure 6. transient response (0.5a to 0a) c out =22 f, c fb =1000pf figure 7. transient response (0 a to 1.0a) c out =100 f, c fb =1000pf figure 8. transient response (0 a to 1.0a) c out =47 f, c fb =1000pf 42mv 1.0a v out 50mv/div i out 1a/div 53mv 1.0a v out 50mv/div i out 1a/div i out =0a to 1a/ sec t(10 sec/div) i out =0a to 1a/ sec t(10 sec/div) downloaded from: http:///
7/ 24 bd3540nuv bd3541nuv ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 06.jun.2016 rev.002 tsz02201-0j2j0a601130-1-2 figure 9. transient response (0 a to 1.0a) c out =22 f, c fb =1000pf figure 10. transient response (1.0a to 0a) c out =100 f, c fb =1000pf figure 11. transient r es ponse (1.0a to 0a) c out =47 f, c fb =1000pf figure 12. transient response (1.0 a to 0a) c out =22 f, c fb =1000pf typical waveforms C continued v out 50mv/div i out 1a/div 1.0a 59mv 42mv 1.0a i out 1a/div v out 50mv/div 51mv 1.0a i out 1a/div v out 50mv/div 57mv 1.0a i out 1a/div v out 50mv/div i out =1a to 0 a/ sec t(100 sec/div) i out =1a to 0 a/ sec t(100 sec/div) i out =0a to 1a/ se c t(10 sec/div) i out =1a to 0 a/ sec t(100 sec/div) downloaded from: http:///
8/ 24 bd3540nuv bd3541nuv ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 06.jun.2016 rev.002 tsz02201-0j2j0a601130-1-2 typical waveforms C continued bd3540nuv figure 13. waveform at output start figure 14. waveform at output off figure 15. input sequence figure 16. input sequence v en 2v/div v n rcs 2v/div v out 1v/div v en 2v/div v n rcs 2v/div v out 1v/div v cc v en v in v out v cc to v in to v en v cc v en v in v out v cc to v en to v in t( 20 0 sec/div) t(1msec/div) downloaded from: http:///
9/ 24 bd3540nuv bd3541nuv ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 06.jun.2016 rev.002 tsz02201-0j2j0a601130-1-2 typical waveforms C continued figure 17. input sequence figure 18. input sequence figure 19. input sequence figure 20. input sequence v in to v cc to v en v cc v en v in v out v in to v en to v cc v cc v en v in v out v cc v en v in v out v en to v in to v cc v cc v en v in v out v en to v cc to v in downloaded from: http:///
10 / 24 bd3540nuv bd3541nuv ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 06.jun.2016 rev.002 tsz02201-0j2j0a601130-1-2 typical performance curves 1.15 1.17 1.19 1.21 1.23 1.25 -10 10 30 50 70 90 ta( ) vo(v) figure 21. output volta ge vs temperature (i out =0ma) temperature : ta (c) output voltage : v out (v ) figure 22. circuit current vs temperature 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.65 0.70 -10 10 30 50 70 90 ta( ) icc(ma) 100 temperature : ta (c) circuit current : i cc (ma) figure 24. i in vs temperature 100 temperature : ta (c) i in (ma) figure 23 . i stb vs temperature temperature : ta (c) i stb (a) downloaded from: http:///
11 / 24 bd3540nuv bd3541nuv ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 06.jun.2016 rev.002 tsz02201-0j2j0a601130-1-2 typical performance curves C continued figure 28. enable input bias current vs temperature 100 temperature : ta (c) enable input bias current : i en (a) figure 25. i instb vs temperature temperature : ta (c) 0 5 10 15 20 25 30 - 60 - 30 0 30 60 90 120 150 temperature : ta (c) i instb (a) figure 26. ncrs charge current vs temperature temperature : ta (c) figure 27. i fb vs temperature 100 temperature : ta (c) i fb (na) nrcs charge current : i ncrs (a) 15 16 17 18 19 20 21 22 23 24 25 -10 10 30 50 70 90 temperature : ( ) 100 temperature : ta (c) downloaded from: http:///
12 / 24 bd3540nuv bd3541nuv ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 06.jun.2016 rev.002 tsz02201-0j2j0a601130-1-2 typical performance curves C continued figure 30. on -resistance vs input voltage 1 input voltage 1 : v cc (v) on -resistance : r on (m) figure 29. on -resistance vs temperature (v cc =5v/v out =1.2v) 100 temperature : ta (c) on -resistance : r on (m) downloaded from: http:///
13 / 24 bd3540nuv bd3541nuv ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 06.jun.2016 rev.002 tsz02201-0j2j0a601130-1-2 timing chart en on/off vcc on/off tracking sequence 1.7v output 1.2v output (r 1 =3.9k, r 2 =3.3k) tracking sequence 1.7v output 1.2v output ratio-metric sequence nrcs fb out out r 2 r 1 3.3k 1.2v 3.9k dc/dc 1.7v in vcc en nrcs out t startup 0.65v (typ) 37.5s (typ@ c=100pf) v out x 0.9v (typ) pg v out x 0.9v (typ) in vcc en nrcs out t hysteresis uvlo startup 0.65v (typ) 37.5 s (typ@100pf) pg downloaded from: http:///
14 / 24 bd3540nuv bd3541nuv ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 06.jun.2016 rev.002 tsz02201-0j2j0a601130-1-2 application information 1. evaluation board bd354xnuv evaluation board standard component list component rating manufacturer product name component rating manufacturer product name u1 - rohm bd354xnuv c 2 22 f kyocera cm32x5r226m10a c 1 1f murata grm188b11a105kd c 13 1000pf murata grm188b11h102kd c 10 0.01f murata grm188b11h103kd r 1 3.9k rohm mcr03ezpf3301 c 11 100pf murata grm188b11h101kd r 2 3.3k rohm mcr03ezpf3901 r 8 0 - jumper r 4 100k rohm mcr03ezpf c 5 22f kyocera cm32x5r226m10a bd354xnuv evaluation board layout.(top vie w) (2nd layer and 3rd layer are gnd line.) bd354xnuv evaluation board schematic top layer bottom layer silkscreen bd354xnuv in out out r 1 c 10 c 6 c 5 r 3 r 5 r 7 c 11 c 4 c 7 c 3 c 2 c 12 c 1 vin c 9 r 6 r 2 c 13 r 4 vpg v cc v cc r 8 v cc vin_s vo vo vo_s downloaded from: http:///
15 / 24 bd3540nuv bd3541nuv ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 06.jun.2016 rev.002 tsz02201-0j2j0a601130-1-2 2. recommended circuit example component recommended value programming notes and precautions r 1 /r 2 3.9k/3.3k ic output voltage can be set with a configuration formula using the v alues for the internal reference output voltage (v fb ) and the output voltage resistors (r 1 , r 2 ). select resistance values that will avoid the impact of the v ref current (100n a) . the recommended total resistance value is 1 0k . c 3 22f to assure output voltage stability, make sure the out pi ns and the gnd pin are connected. output capacitors play a role in loop gain ph ase compensation and in minimizing output fluctuation during rapid changes in lo ad level. insufficient capacitance may cause oscillation, while high equivalent series reis istance (esr) will exacerbate output voltage fluctuation under rapid load change condi tions. while a 22f ceramic capacitor is recomended, actual stability is highly dep endent on temperature and load conditions. also, note that connecting different types of capa citors in series may result in insufficient total phase compensation, thus causing oscilla tion. in light of this information, please confirm operation across a variety of temperature and load conditions. c 1 /c 2 1f/22f input capacitors reduce the output impedance of the voltage s upply source connected to the (vcc, in) input pins. if the impedance of this power supply were to increase, input voltage (v cc , v in ) could become unstable, leading to oscillation or dec reased ripple rejection ability. while a low-esr 1f / 22f capacitor with minimal susceptibility to temperature is recommended, stability is highly dependen t on the input power supply characteristics and the substrate wiring pattern. in light o f this information, please confirm operation across a variety of temperature and load condit ions. c 4 0.01f the non rush current on startup (nrcs) function is built into the ic to pr event rush current from going through the load (in to o ut ) and affecting output capacitors at power supply start-up. constant current comes from the nrcs pin when en is high or the uvlo function is deactivated. the temporary reference voltage is proportional to time, due to the current charge of the nrcs pin capacitor, and output v oltage start-up is proportional to this reference voltage. capacitors with low s usceptibility to temperature are recommended, in order to ensure a stable soft-start time. c 5 1000pf this component is employed when the c 3 capacitor causes, or may cause, oscillation. it provides more precise internal phase correction. c 6 100pf this capacitor is to set pg pin output delay time.100pf is reco mmended. see description of blocks. r 5 100k this is pull-up resist or of open drain pin. 100k is recommended. r 4 several k to several 10k it is recommended that a resistance (several k to several 10k) be put in r 4 , in case negative voltage is applied in en pin. 1 2 3 4 10 9 8 7 vo (1.2v) c 3 r 2 r 1 fb c 4 gnd v cc c 1 en c 2 v in r4 c 5 6 5 v cc r 5 c 6 downloaded from: http:///
16 / 24 bd3540nuv bd3541nuv ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 06.jun.2016 rev.002 tsz02201-0j2j0a601130-1-2 3. reference landing pattern (unit : mm) lead pitch e lead pitch mie landing length l2 landing pitch b2 0.65 2.50 0.40 0.35 central pad length central pad pitch d3 e3 3.00 1.90 (note) it is recommended to design suitable for the actual application. mie d3 e3 e b2 l2 downloaded from: http:///
17 / 24 bd3540nuv bd3541nuv ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 06.jun.2016 rev.002 tsz02201-0j2j0a601130-1-2 4. po wer dissipation in thermal design consider the temperature range wherein th e ic is guaranteed to operate and apply appropriate margins. the temperature conditions that need to be conside red are listed below: (1) ambient temperature ta can be no higher than 100 c . (2) chip junction temperature (tj) can be no higher than 150 c . chip junction temperature can be determined as follows: calculation based on ambient temperature (ta) w aj ta tj ? ? ? ? ? j -a:vson010v3030 178.6 c /w 1-layer substrate (copper foil density 0.2%) 98.4 c /w 1-layer substrate (copper foil density 7%) 41.3 c /w 2-layer substrate (copper foil density 65%) substrate size: 70 mm x 70 mm x 1.6mm 3 (substrate with thermal via) it is recommended to layout the via for heat radiation in the gnd pattern of reverse (of ic) when there is the gnd pattern in the inner layer (in using multiplayer substrate). this package is so small (size: 3.0mm x 3.0mm) that it is not available to layout the via in the bottom of ic. spreading th e pattern and being increased the number of via as shown in the figure below), enable to achieve superior heat radiation characteristic. (this figure is an image only. it is recommended that the via size and the number is designed sui table for the actual situation.). most of the heat loss in bd354xnuv occurs at the output n-chan nel fet. power loss is determined by the total in -out voltage and output current. be sure to confirm the system input and output voltage and the output current conditions in relation to the heat dissipation characteri stics of in and out in the design. bearing in mind that heat dissipation may vary substantially depending on the sub strate employed (due to the power package incorporated in the bd354xnuv) make sure to factor conditions such as substrate size in to the thermal design. power consumption (w) = input voltage (v in )- output voltage (v out ) x i out (ave) example ) where v in =1.7v, v o ut =1.2v, i out (ave) = 1a, ? ? ? ? ? ? ? ? ? ? ? ? w a v v w n consumptio power 5.0 0.1 2.1 7.1 ? ? ? ? downloaded from: http:///
18 / 24 bd3540nuv bd3541nuv ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 06.jun.2016 rev.002 tsz02201-0j2j0a601130-1-2 vson010v3030 i/o equivalent circuits (1) substrate (copper foil area: 0 mm 2 1 -layer) j -a=178.6c/w (2) substrate (copper foil area : 6.28mm 2 4-layer) j -a=98.4c/w (3) substrate (copper foil area : 5505mm 2 4-layer) j -a=41.3c/w vcc out out 50k 10 k 1k nrcs vcc 1k 1k 1k 1k 1k vcc in 1k vcc fb 1k 40 0k en power dissipation [pd] [w] 0 25 75 100 125 150 50 ambient temperature [ta] 1.0 0 3.0 2.0 (1) 0.70w (2) 1.27w (3) 3.03w pgdly 1k 1k 1k 1k 1k vcc 50 pg downloaded from: http:///
19 / 24 bd3540nuv bd3541nuv ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 06.jun.2016 rev.002 tsz02201-0j2j0a601130-1-2 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the grou nd and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all pow er supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. gr ound voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small- signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short an d thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding th is absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expe cted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current ma y flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one powe r supply. therefore, give special consideration to power co upling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comple tely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins du ring assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos tran sistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spec ified, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
20 / 24 bd3540nuv bd3541nuv ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 06.jun.2016 rev.002 tsz02201-0j2j0a601130-1-2 operational notes C continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate la yers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p- n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physic al damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) should be avoided. figure 31. example of monolithic ic structure 13. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 14. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevent s heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the ratin g is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit t hat will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal o peration. note that the tsd circuit operates in a situation that exceeds th e absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set des ign or for any purpose other than protecting the ic from heat damage. 15. output voltage resistance setting (r 1 , r 2 ) output voltage resistance is adjusted with resistor r 1 and r 2 . this ic is calculated as v fb x (r 1 +r 2 ) / r 1 . total 10k is recommended so that the output voltage is not affected by the v fb bias current. 16. output capacitors (c 3 ) to en sure output voltage stability, make sure that the out pin a nd the gnd pins are connected. output capacitors play a role in loop gain phase compensation and in preventing output fluctuation during rapid changes in load level. insufficient capacitance may cause oscillation, while hi gh equivalent series resistance (esr) will exacerbate output voltage fluctuation under rapid load change conditions. w hile a 47f ceramic capacitor is recommended, actual stability is highly dependent on temperature and load co nditions. also, note that connecting different types of capacitors in series may result in insufficient total pha se compensation, thus causing oscillation. in light of th is information, please confirm operation across a variety of temperature a nd load conditions. 17. input capacitors setting (c 1 , c 2 ) input capacitors reduce the impedance of the voltage suppl y source connected to the (vcc, in) input pins. if the impedance of this power supply were to increase, input vo ltage (vcc, in) could become unstable, leading to oscillation or decreased ripple rejection ability. stability highly depends on the input power supply characteristic a nd the substrate wiring pattern. please confirm operation across a variety o f temperature and load conditions. tsd on temperature [ c ] (typ) hysteresis temperature [ c ] (typ) 175 15 n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
21 / 24 bd3540nuv bd3541nuv ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 06.jun.2016 rev.002 tsz02201-0j2j0a601130-1-2 operational notes C continued 18. nrcs pin capacitors setting (c nrcs ) the non rush current on startup (nrcs) function is built in the ic to preve nt rush current from going through the load (in to o ut ) and affecting output capacitors at power supply start-up. the constant current comes from the nrcs pin when en is high or the uvlo function is deactivated. the temp orary reference voltage is proportional to time, due to the current charge of the nrcs pin capacitor, and o utput voltage start-up is proportional to this reference voltage. to obtain a stable nrcs delay time, capacitors with low susceptibility to temperature are recommended. 19. input pins (v cc , in, en) this ic s en pin, in pin, and vcc pin are isolated, and the uvlo function is built in the vcc pin to prevent under voltage lockout. it does not depend on the input pin ord er. output voltage starts up when vcc and en reach the threshold voltage. however, note that when putting in in pin lastl y, out may result in overshooting. 20. heat sink (fin) since the heat sink (fin) is connected to with the sub, short it t o the gnd. it is possible to minimize the thermal resistance by properly soldering it to substrate. 21. add a protection diode when a large inductance compone nt is connected to the output terminal, and reverse-polari ty power is possible at start-up or in output off condition. (example) output pin downloaded from: http:///
22 / 24 bd3540nuv bd3541nuv ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 06.jun.2016 rev.002 tsz02201-0j2j0a601130-1-2 ordering information b d 3 5 4 x n u v e 2 part number 3540 3541 package nuv : vson010v3030 packaging and forming specification e2 : embossed tape and reel (sop8) marking diagram ? bd3540nuv ? bd3541nuv vson010v3030 (top view) 5 4 0 part number marking lot number 1pin mark bd3 vson010v3030 (top view) 5 4 1 part number marking lot number 1pin mark bd3 downloaded from: http:///
23 / 24 bd3540nuv bd3541nuv ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 06.jun.2016 rev.002 tsz02201-0j2j0a601130-1-2 physical dimension, tape and reel information package name vson010v3030 downloaded from: http:///
24 / 24 bd3540nuv bd3541nuv ? 20 16 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 06.jun.2016 rev.002 tsz02201-0j2j0a601130-1-2 revision history date revision changes 05.oct.2015 001 new release 06.jun.2016 002 revise misprint p. 1/24 key specifications output voltage range typical application circuit , block diagram p.2/24 pin descriptions 9.nrcs description of blocks 4.current limit , 7.in p.3/24 description of blocks C continued 8.power good , 9.pgdly absolute maximum ratings pg pin input voltage recommended operating conditions output voltage setting range p.4/24 electrical characterristics power good p.6-8/24 typical waveforms p. 13/24 timing chart en on/off, vcc on/off p.14/24 evaluation board layout top view add p.15/24 recommended circuit example c 6 p.16/24 reference landing pattern p.17/24 image figure (via for heat radiation) p.18/24 power dissipation graph , i/o equivalent circuits figure. downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific appl ications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from th e use of any rohms products under any special or extraordinary environments or conditions. if yo u intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contained in this docum ent are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate i f the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or you r customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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