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not for new design - re placed by new tsop 362.., tsop364.. (#82568) tsop352.., tsop354.. www.vishay.com vishay semiconductors rev. 1.6, 03-sep-13 1 document number: 81781 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 ir receiver modules for remote control systems mechanical data pinning: 1 = gnd, 2 = n.c., 3 = v s , 4 = out features ? very low supply current ? photo detector and preamplifier in one package ? internal filter for pcm frequency ? supply voltage range: 2.5 v to 5.5 v ? improved immunity against modulated light sources ? insensitive to supply voltage ripple and noise ? taping available for topview and sideview assembly ? material categorization: for definitions of compliance please see www.vishay.com/doc?99912 description the tsop352.., tsop354.. seri es are miniaturized smd ir receiver modules for infrared remote control systems. pin diode and preamplifier are asse mbled on lead frame, the epoxy package is designed as ir filter. the demodulated output signal can directly be decoded by a microprocessor. the tsop352.. is compatible with all common ir remote control data formats. the tsop354.. is optimized to suppress almost all spurious pulses from energy saving lamps but wi ll also suppress some data signals. this component has not been qualified according to automotive specifications. block diagram application circuit 16797 1 2 3 4 parts table carrier frequency standard applications (a gc2/agc8) very noisy environments (agc4) 30 khz tsop35230 tsop35430 33 khz tsop35233 tsop35433 36 khz tsop35236 tsop35436 38 khz tsop35238 tsop35438 40 khz tsop35240 tsop35440 56 khz TSOP35256 tsop35456 30 k v s out demo - gnd pass agc input pin band dulator control circuit 3 4 1; 2 16839 c 1 ir receiver gnd circuit c r 1 + v s gnd transmitter with tsalxxxx v s v o 17170_5 out r 1 and c 1 are recommended for protection against eos. components should be in the range of 33 < r 1 < 1 k , c 1 > 0.1 f.
not for new design - re placed by new tsop 362.., tsop364.. (#82568) tsop352.., tsop354.. www.vishay.com vishay semiconductors rev. 1.6, 03-sep-13 2 document number: 81781 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 note ? stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. this is a stress ratin g only and functional operation of the device at these or any other cond itions beyond those indicated in the operational sections of t his specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect the device reliability. typical characteristics (t amb = 25 c, unless otherwise specified) fig. 1 - output active low fig. 2 - puls e length and sensitivity in dark ambient absolute maximum ratings parameter test condition symbol value unit supply voltage (pin 3) v s - 0.3 to + 6 v supply current (pin 3) i s 3ma output voltage (pin 4) v o - 0.3 to (v s + 0.3) v output current (pin 4) i o 5ma junction temperature t j 100 c storage temperature range t stg - 40 to + 100 c operating temperature range t amb - 30 to + 85 c power consumption t amb 85 c p tot 10 mw electrical and optical characteristics (t amb = 25 c, unless otherwise specified) parameter test condition symbol min. typ. max. unit supply current (pin 3) e v = 0, v s = 3.3 v i sd 0.27 0.35 0.45 ma e v = 40 klx, sunlight i sh 0.45 ma supply voltage v s 2.5 5.5 v transmission distance e v = 0, test signal see fig. 1, ir diode tsal6200, i f = 250 ma d45m output voltage low (pin 4) i osl = 0.5 ma, e e = 0.7 mw/m 2 , test signal see fig. 1 v osl 100 mv minimum irradiance pulse width tolerance: t pi - 5/f o < t po < t pi + 6/f o , test signal see fig. 1 e e min. 0.15 0.35 mw/m 2 maximum irradiance t pi - 5/f o < t po < t pi + 6/f o , test signal see fig. 1 e e max. 30 w/m 2 directivity angle of half transmission distance ? 1/2 50 deg e e t t pi * t * t pi 10/f 0 is recommended for optimal function v o v oh v ol t 16110 optical test signal (ir diode tsal6200, i f = 0.4 a, 30 pulses, f = f 0 , t = 10 ms) output signal t d 1) t po 2) 1) 7/f 0 < t d < 15/f 0 2) t pi - 5/f 0 < t po < t pi + 6/f 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.1 1 10 10 2 10 3 10 4 10 5 e e - irradiance (mw/m 2 ) t po - output pulse width (ms) 20752 input burst length = 950 nm, optical test signal, fig.1 output pulse width
not for new design - re placed by new tsop 362.., tsop364.. (#82568) tsop352.., tsop354.. www.vishay.com vishay semiconductors rev. 1.6, 03-sep-13 3 document number: 81781 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 fig. 3 - output function fig. 4 - output pulse diagram fig. 5 - frequency dependence of responsivity fig. 6 - sensitivity in bright ambient fig. 7 - sensitivity vs. supply voltage disturbances fig. 8 - sensitivity vs. electric field disturbances e e t v o v oh v ol t 600 s 600 s t = 60 ms t on t off 94 8134 optical test signal output signal , (see fig. 4) 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.1 1 10 100 1000 10 000 e e - irradiance (mw/m 2 ) t on , t off - output pulse width (ms) 20759 = 950 nm, optical test signal, fig. 3 t on t off 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0.7 0.9 1.1 1.3 f/f 0 - relative frequency 16925 f = f 0 5 % f(3 db) = f 0 /10 e /e - rel. responsivity e min. e 0 0.5 1 1.5 2 2.5 3 3.5 4 0.01 0.1 1 10 100 e e - ambient dc irradiance (w/m 2 ) e e min. - threshold irradiance (mw/m 2 ) correlation with ambient light sources: 10 w/m 2 = 1.4 klx (std. illum. a, t = 2855 k) 10 w/m 2 = 8.2 klx (daylight, t = 5900 k) wavelength of ambient illumination: = 950 nm 20757 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1 10 100 1000 vs rms - ac voltage on dc supply voltage (mv) 20753 e e min. - threshold irradiance (mw/m 2 ) f = f o f = 20 khz f = 30 khz f = 100 hz f = 10 khz 0 50 100 150 200 250 300 350 400 450 500 0 500 1000 1500 2000 2500 3000 f - emi frequency (mhz) e - max. field strength (v/m) 20747
not for new design - re placed by new tsop 362.., tsop364.. (#82568) tsop352.., tsop354.. www.vishay.com vishay semiconductors rev. 1.6, 03-sep-13 4 document number: 81781 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 fig. 9 - maximum envelope duty cycle vs. burst length fig. 10 - sensitivity vs. ambient temperature fig. 11 - relative spectral sensitivity vs. wavelength fig. 12 - horizontal directivity fig. 13 - sensitivity vs. supply voltage 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 20 40 60 80 100 120 burst length (number of cycles/burst) max. envelope duty cycle f = 38 khz, e e = 2 mw/m2 tsop352.. tsop354.. 20868 0 0.05 0.1 0.15 0.2 0.25 0.3 - 30 - 10 10 30 50 70 90 t amb - ambient temperature (c) e e min. - threshold irradiance (mw/m 2 ) 20755 0.0 0.2 0.4 0.6 0.8 1.0 1.2 750 850 950 1050 1150 - wavelength (nm) 16919 s ( ) - relative spectral sensitivity rel 16801 0.4 0.2 0 0.2 0.4 0.6 0.6 0.9 0 30 10 20 40 50 60 70 80 1.0 0.8 0.7 d rel - relative transmission distance 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 0.18 0.2 23456 v s - s upply voltage (v) e e min. - s en s itivity (mw/m 2 ) 20756 3.5 4.5 5.5 2.5
not for new design - re placed by new tsop 362.., tsop364.. (#82568) tsop352.., tsop354.. www.vishay.com vishay semiconductors rev. 1.6, 03-sep-13 5 document number: 81781 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 suitable data format the tsop352.., tsop354.. series is designed to suppress spurious output pulses due to noise or disturbance signals. data and disturbance signals can be distinguished by the devices according to carrier frequency, burst length and envelope duty cycle. the data signal should be close to the band-pass center frequency (e.g. 38 khz) and fulfill the conditions in the table below. when a data signal is applied to the tsop352.., tsop354.. in the presence of a disturbance signal, the sensitivity of the receiver is reduced to insure that no spurious pulses are present at the output. some examples of disturbance signals which are suppressed are ? dc light (e.g. from tungsten bulb or sunlight) ? continuous signals at any frequency ? strongly or weakly modula ted noise from fluorescent lamps with electronic ballasts (see figure 14 or figure 15) fig. 14 - ir signal from fluorescent lamp with low modulation fig. 15 - ir signal from fluorescent lamp with high modulation note for data formats with short bursts please see the datash eet for tsop351.., tsop353.. 0101520 time (ms) 16920 ir signal 5 0101520 time (ms) 16921 ir signal 5 tsop352.. tsop354.. minimum burst length 10 cy cles/burst 10 cycles/burst after each burst of length a minimum gap time is required of 10 to 70 cycles 10 cycles 10 to 35 cycles 10 cycles for bursts greater than a minimum gap time in the data stream is needed of 70 cycles > 4 x burst length 35 cycles > 10 x burst length maximum number of continuous short bursts/second 1800 1500 recommended for nec code yes yes recommended for rc5/rc6 code yes yes recommended for sony code yes no recommended for thom son 56 khz code yes yes recommended for mitsubis hi code (38 khz, prebur st 8 ms, 16 bit) yes no recommended for sharp code yes yes suppression of interference from fluorescent lamps most common disturbance signals are suppressed even extreme disturbance signals are suppressed
not for new design - re placed by new tsop 362.., tsop364.. (#82568) tsop352.., tsop354.. www.vishay.com vishay semiconductors rev. 1.6, 03-sep-13 6 document number: 81781 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 package dimensions in millimeters assembly instructions reflow soldering ? reflow soldering must be done within 72 h while stored under a max. tempe rature of 30 c, 60 % rh after opening the dry pack envelope ? set the furnace temperatures for pre-heating and heating in accordance with the reflow temperature profile as shown in the diagram. excercise extreme care to keep the maximum temperature below 260 c. the temperature shown in the profile means th e temperature at the device surface. since there is a temperature difference between the component and the circuit bo ard, it should be verified that the temperature of the device is accurately being measured ? handling after reflow should be done only after the work surface has been cooled off manual soldering ? use a soldering iron of 25 w or less. adjust the temperature of the so ldering iron below 300 c ? finish soldering within 3 s ? handle products only after the temperature has cooled off 2.35 r 1.7 5.51 0.5 0.15 3 x 1.27 = 3.81 2.6 7.5 7.2 4x 1.27 5.3 2.9 4 2.2 pick and place area. tr taping 2.2 3 x 1.27 = 3.81 1.27 0.9 2.8 specifications according to din technical drawings not indicated tolerances 0.3 pick and place area. tt taping footprint (1.5) (1.4) issue: 8; 02.09.09 16776 drawing-no.: 6.544-5341.01-4 a a 0.1 0.1 0.3 0.4 14
not for new design - re placed by new tsop 362.., tsop364.. (#82568) tsop352.., tsop354.. www.vishay.com vishay semiconductors rev. 1.6, 03-sep-13 7 document number: 81781 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 vishay lead (pb)-free reflow solder profile taping version tsop..tt dimensions in millimeters 0 50 100 150 200 250 300 0 50 100 150 200 250 300 t (s) t (c) 255 c 240 c 245 c max. 260 c max. 120 s max. 100 s 217 c max. 20 s max. ramp up 3 c/s max. ramp down 6 c/s max. 2 cycles allowed 19800 16584
not for new design - re placed by new tsop 362.., tsop364.. (#82568) tsop352.., tsop354.. www.vishay.com vishay semiconductors rev. 1.6, 03-sep-13 8 document number: 81781 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 taping version tsop..tr dimensions in millimeters 16585
not for new design - re placed by new tsop 362.., tsop364.. (#82568) tsop352.., tsop354.. www.vishay.com vishay semiconductors rev. 1.6, 03-sep-13 9 document number: 81781 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 reel dimensions in millimeters leader and trailer dimensions in millimeters cover tape peel strength according to din en 60286-3 0.1 n to 1.3 n 300 mm/min. 10 mm/min. 165 to 180 peel angle label standard bar code labels for finished goods the standard bar code labels are product labels and used for identification of goods. th e finished goods are packed in final packing area. the standard packing units are labeled with standard bar code labels be fore transported as finished goods to warehouses. the labels are on each packing unit and contain vishay semicond uctor gmbh specific data. 16734 trailer leader no devices min. 200 min. 400 start end devices 96 11818 no devices
not for new design - re placed by new tsop 362.., tsop364.. (#82568) tsop352.., tsop354.. www.vishay.com vishay semiconductors rev. 1.6, 03-sep-13 10 document number: 81781 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 dry packing the reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. final packing the sealed reel is packed in to a cardboard box. a secondary cardboard box is used for shipping purposes. recommended meth od of storage dry box storage is recommended as soon as the aluminum bag has been opened to preve nt moisture absorption. the following conditions should be observed, if dry boxes are not available: ? storage temperature 10 c to 30 c ? storage humidity 60 % rh max. after more than 72 h under these conditions moisture content will be too high for reflow soldering. in case of moisture absorptio n, the devices will recover to the former condition by drying under the following condition: 192 h at 40 c + 5 c/- 0 c and < 5 % rh (dry air/nitrogen) or 96 h at 60 c + 5 c and < 5 % rh for all device containers or 24 h at 125 c + 5 c not suitable for reel or tubes. an eia jedec ? standard jstd-020 level 4 label is included on all dry bags. eia jedec standard jstd-020 level 4 label is included on all dry bags vishay semiconductor gmbh standard bar code product label (finished goods) plain writting abbreviation length item-description - 18 item-number ino 8 selection-code sel 3 lot-/serial- number batch 10 data-code cod 3 (yww) plant-code ptc 2 quantity qty 8 accepted by acc - packed by pck - mixed code indica tor mixed code - origin xxxxxxx+ company logo long bar code top type length item-number n 8 plant-code n 2 sequence-number x 3 quantity n 8 total length - 21 short bar code bottom type length selection-code x 3 data-code n 3 batch-number x 10 filter - 1 total length - 17 aluminum bag label reel 15973 caution this bag contains moisture-sensitive devices 1. shelf life in sealed bag: 12 months at < 40 c and < 90 % relative humidity (rh) 2. after this bag is opened, devices that will be subjected to soldering reflow or equivalent processing (peak package body temp. 260 c) must be 2a. mounted within 72 hours at factory condition of < 30 c/60 % rh or 2b. stored at < 5 % rh 3. devices require baking befor mounting if: humidity indicator card is > 10 % when read at 23 c 5 c or 2a. or 2b. are not met. 4. if baking is required, devices may be baked for: 192 hours at 40 c + 5 c/- 0 c and < 5 % rh (dry air/nitrogen) or 96 hours at 60 c 5 c and < 5 % rh for all device containers or 24 hours at 125 c 5 c not suitable for reels or tubes bag seal date: (if blank, see barcode label) note: level and body temperature defined by eia jedec standard jstd-020 4 level 22522
not for new design - re placed by new tsop 362.., tsop364.. (#82568) tsop352.., tsop354.. www.vishay.com vishay semiconductors rev. 1.6, 03-sep-13 11 document number: 81781 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 esd precaution proper storage and handling pro cedures should be followed to prevent esd damage to the devices especially when they are removed from the antistatic shielding bag. electro-static sensitive devices warning la bels are on the packaging. vishay semiconductors standard bar code labels the vishay semiconductors st andard bar code labels are printed at final packing areas. the labels are on each packing unit and contain vishay semiconductors specific data. 16962
legal disclaimer notice www.vishay.com vishay revision: 02-oct-12 1 document number: 91000 disclaimer all product, product specifications and data are subject to change without notice to improve reliability, function or design or otherwise. vishay intertechnology, inc., its affiliates, agents, and employee s, and all persons acting on it s or their behalf (collectivel y, vishay), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any o ther disclosure relating to any product. vishay makes no warranty, repres entation or guarantee regarding the suitabilit y of the products for any particular purpose or the continuing production of any product. to the maximum extent permitted by applicable law, vi shay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation specia l, consequential or incidental damages, and (iii) any and all i mplied warranties, including warra nties of fitness for particular purpose, non-infringement and merchantability. statements regarding the suitability of products for certain type s of applications are based on vishays knowledge of typical requirements that are often placed on vishay products in generic applications. such statements are not binding statements about the suitability of products for a particular application. it is the customers responsib ility to validate that a particu lar product with the properties descri bed in the product specification is suitable fo r use in a particular application. parameters provided in datasheets and/or specification s may vary in different applications an d performance may vary over time. all operating parameters, including typical pa rameters, must be validated for each customer application by the customers technical experts. product specifications do not expand or otherwise modify vish ays terms and condit ions of purchase, including but not limited to the warranty expressed therein. except as expressly indicate d in writing, vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the vi shay product could result in personal injury or death. customers using or selling vishay products not expressly indicated for use in such applications do so at their own risk. pleas e contact authorized vishay personnel to ob tain written terms and conditions regarding products designed for such applications. no license, express or implied, by estoppel or otherwise, to any intellectual prope rty rights is granted by this document or by any conduct of vishay. product names and markings noted herein may be trad emarks of their respective owners. material category policy vishay intertechnology, inc. hereby certi fies that all its products that are id entified as rohs-compliant fulfill the definitions and restrictions defined under directive 2011/65/eu of the euro pean parliament and of the council of june 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (eee) - recast, unless otherwis e specified as non-compliant. please note that some vishay documentation may still make reference to rohs directive 2002/95/ ec. we confirm that all the products identified as being compliant to directive 2002 /95/ec conform to directive 2011/65/eu. vishay intertechnology, inc. hereby certifi es that all its products that are identified as ha logen-free follow halogen-free requirements as per jedec js709a stan dards. please note that some vishay documentation may still make reference to the iec 61249-2-21 definition. we co nfirm that all the products identified as being compliant to iec 61249-2-21 conform to jedec js709a standards.

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