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| 1. product profile 1.1 general description planar maximum efficiency general applicatio n (mega) schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a sod882 leadless ultra small surface-mounted device (smd) plastic package. 1.2 features and benefits ? average forward current: i f(av) 100 ma ? reverse voltage: v r 30 v ? low forward voltage: v f 450 mv ? low reverse current: i r 0.5 a ? aec-q101 qualified ? leadless ultra small smd plastic package 1.3 applications ? low current rectification ? high efficiency dc-to-dc conversion ? switch mode power supply (smps) ? reverse polarity protection ? low power consumption applications 1.4 quick reference data [1] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated, mounting pad for cathode 1 cm 2 . [2] pulse test: t p 300 s; ? 0.02. RB520CS30L 100 ma low v f mega schottky barrier rectifier rev. 1 ? 10 march 2011 product data sheet sod882 table 1. quick reference data symbol parameter conditions min typ max unit i f(av) average forward current square wave; = 0.5; f = 20 khz t amb 135 c [1] - - 100 ma t sp 145 c - - 100 ma i r reverse current v r = 10 v - 0.14 0.5 a v r reverse voltage - - 30 v v f forward voltage i f =10ma [2] - 330 450 mv
RB520CS30L all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 10 march 2011 2 of 14 nxp semiconductors RB520CS30L 100 ma low v f mega schottky barrier rectifier 2. pinning information [1] the marking bar indicates the cathode. 3. ordering information 4. marking 5. limiting values table 2. pinning pin description simplified outline graphic symbol 1 cathode [1] 2 anode 2 1 transparent top view sym00 1 12 table 3. ordering information type number package name description version RB520CS30L - leadless ultra small plastic package; 2 terminals; body 1.0 0.6 0.5 mm sod882 table 4. marking codes type number marking code RB520CS30L ap table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v r reverse voltage - 30 v i f(av) average forward current square wave; = 0.5; f = 20 khz t amb 135 c [1] -100ma t sp 145 c-100ma i fsm non-repetitive peak forward current half sine wave; t p 8.3 ms [2] -3a p tot total power dissipation t amb 25 c [4] [3] -315mw [4] [1] -565mw [4] [5] -865mw RB520CS30L all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 10 march 2011 3 of 14 nxp semiconductors RB520CS30L 100 ma low v f mega schottky barrier rectifier [1] device mounted on an fr4 pcb, single-sided c opper, tin-plated, mounting pad for cathode 1 cm 2 . [2] t j =25 c prior to surge. [3] device mounted on an fr4 pcb, single-si ded copper, tin-plated and standard footprint. [4] reflow soldering is the only recommended soldering method. [5] device mounted on a ceramic pcb, al 2 o 3 , standard footprint. 6. thermal characteristics [1] for schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses p r are a significant part of the total power losses. [2] reflow soldering is the only recommended soldering method. [3] device mounted on an fr4 pcb, single-si ded copper, tin-plated and standard footprint. [4] device mounted on an fr4 pcb, single-sided c opper, tin-plated, mounting pad for cathode 1 cm 2 . [5] device mounted on a ceramic pcb, al 2 o 3 , standard footprint. [6] soldering point of cathode tab. t j junction temperature - 150 c t amb ambient temperature ? 65 +150 c t stg storage temperature ? 65 +150 c table 5. limiting values ?continued in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit table 6. thermal characteristics symbol parameter conditions min typ max unit r th(j-a) thermal resistance from junction to ambient in free air [1] [2] [3] - - 395 k/w [4] - - 220 k/w [5] - - 145 k/w r th(j-sp) thermal resistance from junction to solder point [6] --70k/w RB520CS30L all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 10 march 2011 4 of 14 nxp semiconductors RB520CS30L 100 ma low v f mega schottky barrier rectifier fr4 pcb, standard footprint fig 1. transient thermal impedance from junction to am bient as a function of pu lse duration; typical values fr4 pcb, mounting pad for cathode 1 cm 2 fig 2. transient thermal impedance from junction to am bient as a function of pu lse duration; typical values 006aac533 10 ?5 10 10 ?2 10 ?4 10 2 10 ?1 t p (s) 10 ?3 10 3 1 10 2 10 10 3 z th(j-a) (k/w) 1 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.1 0.05 0.02 0.01 0 006aac534 10 ?5 10 10 ?2 10 ?4 10 2 10 ?1 t p (s) 10 ?3 10 3 1 10 2 10 10 3 z th(j-a) (k/w) 1 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.1 0.05 0.02 0.01 0 RB520CS30L all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 10 march 2011 5 of 14 nxp semiconductors RB520CS30L 100 ma low v f mega schottky barrier rectifier 7. characteristics [1] pulse test: t p 300 s; ? 0.02. ceramic pcb, al 2 o 3 , standard footprint fig 3. transient thermal impedance from junction to am bient as a function of pu lse duration; typical values 006aac535 10 ?5 10 10 ?2 10 ?4 10 2 10 ?1 t p (s) 10 ?3 10 3 1 10 2 10 10 3 z th(j-a) (k/w) 1 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.1 0.05 0.02 0.01 0 table 7. characteristics t amb =25 c unless otherwise specified. symbol parameter conditions min typ max unit v f forward voltage [1] i f = 0.1 ma - 210 - mv i f = 1 ma - 270 - mv i f = 10 ma - 330 450 mv i f = 100 ma - 450 - mv i r reverse current v r = 10 v - 0.14 0.5 a c d diode capacitance v r =1v; f=1mhz - 10 - pf RB520CS30L all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 10 march 2011 6 of 14 nxp semiconductors RB520CS30L 100 ma low v f mega schottky barrier rectifier (1) t j = 150 c (2) t j = 125 c (3) t j =85 c (4) t j =25 c (5) t j = ? 40 c (1) t j = 125 c (2) t j =85 c (3) t j =25 c (4) t j = ? 40 c fig 4. forward current as a function of forward voltage; typical values fig 5. reverse current as a function of reverse voltage; typical values f=1mhz; t amb =25 c fig 6. diode capacitance as a function of reverse voltage; typical values 006aac536 10 ?3 10 ?2 10 ?1 1 i f (a) 10 ?4 v f (v) 0 0.8 0.6 0.2 0.4 (1) (2) (3) (4) (5) 006aac537 v r (v) 030 20 10 10 ?3 10 ?4 10 ?5 10 ?6 10 ?7 10 ?8 10 ?9 i r (a) 10 ?10 (1) (2) (3) (4) 006aac538 v r (v) 030 20 10 10 5 15 20 c d (pf) 0 RB520CS30L all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 10 march 2011 7 of 14 nxp semiconductors RB520CS30L 100 ma low v f mega schottky barrier rectifier t j = 150 c (1) =0.1 (2) =0.2 (3) =0.5 (4) =1 t j = 125 c (1) =1; dc (2) = 0.9; f = 20 khz (3) = 0.8; f = 20 khz (4) = 0.5; f = 20 khz fig 7. average forward power dissipation as a function of average forward current; typical values fig 8. average reverse power dissipation as a function of reverse voltage; typical values fr4 pcb, standard footprint t j = 150 c (1) =1; dc (2) = 0.5; f = 20 khz (3) = 0.2; f = 20 khz (4) = 0.1; f = 20 khz fr4 pcb, mounting pad for cathode 1 cm 2 t j = 150 c (1) =1; dc (2) = 0.5; f = 20 khz (3) = 0.2; f = 20 khz (4) = 0.1; f = 20 khz fig 9. average forward current as a function of ambient temperature; typical values fig 10. average forward current as a function of ambient temperature; typical values i f(av) (a) 0.00 0.15 0.10 0.05 006aac539 0.02 0.04 0.06 p f(av) (w) 0.00 (1) (2) (3) (4) 006aac540 v r (v) 030 20 10 0.004 0.006 0.002 0.008 0.010 p r(av) (w) 0.000 (3) (4) (1) (2) t amb (c) 0 50 100 150 175 125 75 25 006aac541 0.05 0.10 0.15 i f(av) (a) 0.00 (1) (2) (3) (4) t amb (c) 0 50 100 150 175 125 75 25 006aac542 0.05 0.10 0.15 i f(av) (a) 0.00 (1) (2) (3) (4) RB520CS30L all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 10 march 2011 8 of 14 nxp semiconductors RB520CS30L 100 ma low v f mega schottky barrier rectifier 8. test information the current ratings for the ty pical waveforms as shown in figure 9 , 10 and 11 are calculated according to the equations: with i m defined as peak current, at dc, and with i rms defined as rms current. 8.1 quality information this product has been qualified in accordance with the automotive electronics council (aec) standard q101 - stress test qualificat ion for discrete semiconductors , and is suitable for use in automotive applications. t j = 150 c (1) =1; dc (2) = 0.5; f = 20 khz (3) = 0.2; f = 20 khz (4) = 0.1; f = 20 khz fig 11. average forward current as a function of solder point temperature; typical values t sp (c) 0 50 100 150 175 125 75 25 006aac543 0.05 0.10 0.15 i f(av) (a) 0.00 (1) (2) (3) (4) fig 12. duty cycle definition t 1 t 2 p t 006aaa812 duty cycle = t 1 t 2 i fav () i m = i rms i fav () = i rms i m = RB520CS30L all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 10 march 2011 9 of 14 nxp semiconductors RB520CS30L 100 ma low v f mega schottky barrier rectifier 9. package outline 10. packing information [1] for further information and the avai lability of packing methods, see section 14 . fig 13. package outline sod882 03-04-17 dimensions in mm 0.55 0.47 0.65 0.62 0.55 0.50 0.46 cathode marking on top side 1.02 0.95 0.30 0.22 0.30 0.22 2 1 table 8. packing methods the indicated -xxx are the last thre e digits of the 12nc ordering code. [1] type number package description packing quantity 10 000 RB520CS30L sod882 2 mm pitch, 8 mm tape and reel -315 RB520CS30L all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 10 march 2011 10 of 14 nxp semiconductors RB520CS30L 100 ma low v f mega schottky barrier rectifier 11. soldering reflow soldering is the only recommended soldering method. fig 14. reflow soldering footprint sod882 solder lands solder resist occupied area solder paste sod882_ fr 0.9 0.3 (2 ) r0.05 (8 ) 0.6 (2 ) 0.7 (2 ) 0.4 (2 ) 1.3 0.5 (2 ) 0.8 (2 ) 0.7 dimensions in mm RB520CS30L all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 10 march 2011 11 of 14 nxp semiconductors RB520CS30L 100 ma low v f mega schottky barrier rectifier 12. revision history table 9. revision history document id release date data sheet status change notice supersedes RB520CS30L v.1 20110310 product data sheet - - RB520CS30L all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 10 march 2011 12 of 14 nxp semiconductors RB520CS30L 100 ma low v f mega schottky barrier rectifier 13. legal information 13.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 13.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 13.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification. RB520CS30L all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 1 ? 10 march 2011 13 of 14 nxp semiconductors RB520CS30L 100 ma low v f mega schottky barrier rectifier quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. 13.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 14. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com nxp semiconductors RB520CS30L 100 ma low v f mega schottky barrier rectifier ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 10 march 2011 document identifier: RB520CS30L please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 15. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 8.1 quality information . . . . . . . . . . . . . . . . . . . . . . 8 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 10 packing information . . . . . . . . . . . . . . . . . . . . . 9 11 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12 revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 13 legal information. . . . . . . . . . . . . . . . . . . . . . . 12 13.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 13.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 13.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 13.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13 14 contact information. . . . . . . . . . . . . . . . . . . . . 13 15 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 |
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