1 six channel sic mosfet driver gate driver for 1200v sic mosfet power module features ? 6 output channels ? isolated power supply ? direct mount low inductance design ? short circuit protection ? over temperature protection ? under voltage protection for use with cree module ? 45mm, six - pack ccs020m12cm2 ? 45mm, six - pack ccs050m12cm2 applications ? driver for sic mosfet modules in two - level, three - phase inverter applications ? dc bus voltage up to 10 0 0v dc absolute maximum ratings symbol parameter value unit test conditions note v s power supply voltage 16 v vs ramp rate >50v/sec v ih input signal voltage high 5 v v il input signal voltage low 0 v i o.pk output peak current 9 (2) a rg limited p o_avg ouput power per gate 1.2 w f max max. switching frequency 2 50 khz vg=+20/ - 5, rg=10? v ds max. drain to source voltage 1200 v v isol input to output isolation voltage 1200 v dv/dt rate of change of output to input voltage 50,000 v/s w weight 223 g mtbf mean time between failure 1.5 10 6 h t op operating temperature - 35 to 85 oc t stg storage temperature - 40 to 85 oc part number package marking cgd15fb45p 1 pcba cgd15fb45p 1 CGD15FB45P1 rev - , 10/2015
2 characteristics symbol parameter value unit test conditions notes min typ max v s supply voltage 14 15.0 16 v v i input signal voltage on/off 5/0 v i so supply current (no load) supply current (max.) supply current (max.) 230 ma 25c 460 780 f=100khz, 25c f=250khz, 25c v it+ input threshold voltage high 3.5 v v it - input threshold voltage low 1.5 v r in input resistance 48 k ? c io coupling capacitance 30 pf t don turn on propogation delay 300 ns time from when input pin goes high until driver output goes high fig. 3 , 4 t doff turn off propogation delay 300 ns time from when input pin goes low until driver output goes low fig. 3 , 4 t rout output voltage rise time 65 ns v out time from 10% to 90% with r g = 0ohms, c load = 40,000pf fig. 5 t fout output voltage fall time 50 ns v out time from 90% to 10% with r g = 0ohms, c load = 40,000pf fig. 5 r gon turn - on gate resistor 10 ? r goff turn - off gate resistor 10 ? v gateon gate voltage at turn - on +20 v v gateoff gate voltage at turn - off - 5 v t sc short circuit response time 2.34 s total time from when short circuit current begins flowing until it is interrupted v ds,trip v ds monitoring threshold 4.7 v v ds value that causes the driver to trip on overcurrent t flt_dly fault delay time 425 ns time from when desat pin=9v until the gate output begins turning off t flt_sig transmission delay of fault state 2.25 s time delay from desat pin=9v until fault status pin is pulled low t err pulse width for resetting fault 800 ns time reset pin must be held low to reset driver test voltage (60hz/1min), primary to secondary 4000 v test voltage (60hz/1min), secondary to secondary 4000 v creepage distance, primary to secondary 9.0 mm creepage distance, secondary to secondary 7.0 mm clearance distance, primary to secondary 6.0 mm clearance distance, secondary to secondary 7.0 mm CGD15FB45P1 rev - , 10/2015
3 figure 1. driver overview figure 2. block diagram note: default gate resistor for r g is 10 ? for gate on and off. the user can control the gate turn on and off speed by changing rg to a lower value and gain better mosfet switching efficiency. the user can also control the gate turn - on and off speed independently by populating rg.off and d1. cs is made up of 3x 2.2nf, 1.2kv film capacitors. CGD15FB45P1 rev - , 10/2015
4 x1 C signal interface v in v out t don 50 % 50% timing diagram v in v out t doff 50% 50 % timing diagram turn -on propogation delay turn -off propogation delay figure 3 . propagation delays in+ out v in v out cgd15 hb62p1 figure 4 . propagation delay test circuit 1 pwm_upper_a (5v logic) 2 common 3 pwm_lower_a (5v logic) 4 5 pwm_upper_b (5v logic) 6 7 pwm_lower_b (5v logic) 8 9 pwm_upper_c (5v logic) 10 11 pwm_lower_c (5v logic) 12 13 /rst (normally hi) 14 15 rdy (normally hi) 16 17 desat fault (normally low) 18 19 over_temp_flt (normally low) 20 21 pwr in (vs) 22 23 24 25 26 led status indicators l1 red led, illuminated when phase a upper switch has a desat fault. l2 red led, illuminated when phase a lower switch has a desat fault. l3 red led, illuminated when phase b upper switch has a desat fault. l4 red led, illuminated when phase b lower switch has a desat fault. l5 red led, illuminated when phase c upper switch has a desat fault. l6 red led, illuminated when phase c lower switch has a desat fault. l7 green led, illuminated when power is present and all faults are clear. l8 red led, illuminated when there is an over temp fault. CGD15FB45P1 CGD15FB45P1 rev - , 10/2015
5 90% 10% t rout 90% 10% t fout v out v out figure 5. output voltage rise and fall times fault handling each of the six gate drive channels is protected by a desaturation (desat) circuit. in the event of a short circuit, the voltage across the mosfet (v ds ) rises until it hits a threshold which causes the desat circuit to drive all six gate drive channels to the ir off state. pin 17 of the x1 signal connector toggles high when a desat event occurs. there will also be a red led (l1 - l6) illuminated for the gate drive channel (s) that activated the desaturation protection. once the fault is cleared , the circuit can be reset with the onboard reset button or remotely by driving pin 13 of the x1 connector to common. there is an overtemperature protection circuit that turns off all the gates in the event an overtemperature is detected. the overtemperature circuit read s the value of the six pack modules onboard temperature sensor . when the sensor reaches a value corresponding to 115 c, the overtemperature circuit is activated and all six gate drive channels are driven to their low state. pin 19 of the x1 con nector is toggled high when an overtemperature fault occurs . typical application CGD15FB45P1 rev - , 10/2015
6 mechanical instructions designed to directly mount to cree 45 mm style power modules , the 6 - ch gate driver also has several other mounting holes to secure the assembly. attach the gate driver board to the power module via the 4x module screw holes (see diagram below) using the rec o m m ended hardware in table 1. then solder the 28x solder pins via the solder pin holes to electrically connect the driver board to the power module. the solder ing tip must not exceed 260 o c and contact with the solder per pin must not exceed 10 seconds. the solder joints should be in accordance with ipc a 610 rev d (or later) C class 3 to ensure an optimal connection between the module and gate driver board. the module plus driver board assembly must be further supported by securing the assembly to standoffs via the 7 x mounting holes shown in the figure below. table 1 hardware list ref description hardware locations t orque module screw holes 2. 5mm clear a n ce holes for mounting screws to secure the module to the printed circuit board assembly. m2.5 x 4mm 4x 0.5 nm mounting holes 4.3 mm clear a n ce holes for screws to secure the circuit assembly to stand - offs for additional support. 6 - 32 x 5/6 zinc plated pan head screw /w internal tooth washer. 9x 0.9 nm access holes 10 mm clearance hole to provide access to the screw that secure the module to the heatsink. n/a 2x n/a solder pin holes 1 .6 mm plated holes for solder pins from power module. solder pins from power module 28x n/a power terminals 6 mm holes to secure power cables. ? or 6mm hardware 7x CGD15FB45P1 rev - , 10/2015
7 7 mechanical drawing (units in inches) [mm] this product has not been designed or tested for use in, and is not intended for use in, applications implanted into the human body nor in applications in which failure of the product could lead to death, personal injury or property damage, including but not limited to equipment used in the operation of nuclear facilities, life-support machines, cardiac defbrillators or similar emergency medical equipment, aircraft navigation or communication or control systems or air traffc control systems. copyright ? 2015 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree and the cree logo are registered trademarks and z-rec and z-fet are trademarks of cree, inc. CGD15FB45P1 rev - , 10/2015 cree, inc. 4600 silicon drive durham, nc 27703 usa tel: +1.919.313.5300 fax: +1.919.313.5451 www.cree.com/power
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