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  ? semiconductor components industries, llc, 2015 february, 2015 ? rev. 0 1 publication order number: hbl1010/d hbl1010 1-channel esd protector product description the hbl1010 provides robust esd protection for sensitive parts that may be subjected to electrostatic discharge (esd). the tiny form factor means it can be used in very confined spaces. the electrical ?back?to?back zener? configuration provides symmetrical esd protection in cases where nodes with ac signals are present. this device is designed and characterized to safely dissipate esd strikes of at least 8 kv, according to the mil?std?883 (method 3015) specification for human body model (hbm) esd. features ? compact die protects from esd discharges ? almost no conduction at signal amplitudes less than 4 v ? esd protection to over 8 kv contact discharge per mil_std_883 international esd standard ? these devices are pb?free and are rohs compliant applications ? led lighting ? modules ? interface circuits table 1. ordering information ? part numbering information ordering part number topside metal back metal bg thickness inking? shipping method HBL1010RP gold?tin (ausn) none (si substrate) 4 mils no die on tape in ring?pack note: contact your sales representative for other ordering options. www. onsemi.com electrical schematic ausn (gold?tin) on topside (signal node) ausn (gold?tin) on topside (reference node) silicon substrate on backside
hbl1010 www. onsemi.com 2 specifications table 2. operating conditions parameter rating units operating temperature range ?40 to +130 c storage temperature range ?55 to +130 c table 3. electrical operating characteristics symbol parameter conditions min typ max units i leak leakage current v = 4 v, t = 25 c 0.1 1  a v = 7 v, t = 25 c 10 100  a v bd breakdown voltage t = 25 c at 20.0 ma 7.3 8 8.9 v v esd esd voltage rating contact discharge per human body model, mil?std?883 (method 3015) t = 25 c (note 1) 8 kv c t capacitance t = 25 c 18 pf temp coefficient of bv 20 ma 1.0 mv/k product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 1. per the standard, 3 positive and 3 negative strikes are applied, one second apart. mechanical details table 4. mechanical specifications (note 2) symbol value unit composition silicon wafer, p+ doped length (sawn) 500  m width (sawn) 200  m thickness 4 mils top pad length 150  m top pad width 140  m top pad spacing 100  m top pad composition ausn (gold?tin) top pad thickness 24 10  m back metal (underside) none (silicon substrate) 2. dimensions are typical values if tolerances are not specified. 200 um 500 um 100 um 150 um 50 um 30 um 140 um
hbl1010 www. onsemi.com 3 on semiconductor and the are registered trademarks of semiconductor components industries, llc (scillc) or its subsidia ries in the united states and/or other countries. scillc owns the rights to a number of pa tents, trademarks, copyrights, trade secret s, and other intellectual property. a listin g of scillc?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any product s herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any part icular purpose, nor does sci llc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typi cal? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating param eters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgic al implant into the body, or other applications intended to s upport or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer s hall indemnify and hold scillc and its officers , employees, subsidiaries, affiliates, and dist ributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufac ture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 hbl1010/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative


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