tnpv e3 www.vishay.com vishay draloric revision: 24-apr-15 1 document number: 28881 for technical questions, contact: thinfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 high voltage thin film flat chip resistors tnpv e3 precision thin film flat chip resistors are the perfect choice for most fields of modern electronics where the highest reliability and stability at high operating voltages are of major concern. typical applic ations include industrial and automotive inverters, voltage measurement systems as implemented in battery manage ment systems, and test and measuring equipment. features ? high operating voltage u max. up to 1000 v ? low voltage coefficient < 1 ppm/v ? excellent overall stability at different environmental conditions 0.05 % ? (1000 h rated power at 70 c) ? superior moisture resist ivity (85 c; 85 % rh) ? aec-q200 qualification under preparation ? sulfur resistance verified according to astm b 809 ? material categorization: fo r definitions of compliance please see www.vishay.com/doc?99912 applications ? industrial and automotive inverters ? battery management system ? test and measuring equipment ? notes (1) size not specified in en 140401-801. (2) please refer to application information below. (3) application-specific safety requirements may set limitat ions to the applicability of the specified voltage. application information the power dissipation on the re sistor generates a tempe rature rise against the local ambi ent, depending on the heat flow support of the printed circuit board (therma l resistance). the rated di ssipation applies only if the permitted film temperature is not exceeded. furthermore, a high level of ambient temperature or of po wer dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain the reliability of the assembly. these resistors do not feature a lifetime limitation when operated within the limi ts of rated dissipati on, permissible operatin g voltage, and permissible film te mperature. however, the resistance typically increases due to the resistor's film temperature over operating time, generally known as drif t. the drift may exceed the stability requirements of an individual application cir cuit and thereby limits the functional lifetime. the designer may estimate the performance of the particular resistor application or set certain load and temperature limits in order to maintain a desired stability. technical specifications description tnpv1206 e3 tnpv1210 e3 imperial size 1206 1210 (1) metric size code rr3216m rr3225m (1) resistance range 160 k ? to 2 m ? 121 k ? to 3.01 m ? resistance tolerance 1 %; 0.5 %; 0.1 % temperature coefficient 50 ppm/k ; 25 ppm/k; 15 ppm/k; 10 ppm/k voltage coefficient | c | < 1 ppm/v rated dissipation, p 70 (2) 0.25 w 0.33 w maximum operating voltage, u max. ac rms or dc (3) 700 v 1000 v permissible film temperature, ? f max. (2) 155 c operating temperat ure range -55 c to 125 c (155 c)
tnpv e3 www.vishay.com vishay draloric revision: 24-apr-15 2 document number: 28881 for technical questions, contact: thinfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 note (1) 1000 pieces packaging is availa ble only for precision resist ors with tolerance 0.1 %. note ? products can be ordered using either the part number or the product description. maximum resistance change at rated dissipation operation mode standard rated dissipation, p 70 tnpv1206 e3 0.25 w tnpv1210 e3 0.33 w applied maximum film temperature, ? f max. 125 c max. resistance change at p 70 for resistance range ? r / r , after: tnpv1206 e3 160 k ? to 2 m ? tnpv1210 e3 121 k ? to 3.01 m ? 1000 h ? 0.05 % 8000 h ? 0.10 % 225 000 h ? 0.30 % temperature coefficient and resistance range type/size tcr tolerance resistance e-series tnpv1206 e3 50 ppm/k 1 % 160 k ? to 2.0 m ? e24; e96 25 ppm/k 0.5 % e24; e192 0.1 % 15 ppm/k 0.1 % 10 ppm/k 0.1 % tnpv1210 e3 50 ppm/k 1 % 121 k ? to 3.01 m ? e24; e96 25 ppm/k 0.5 % e24; e192 0.1 % 121 k ? to 2.13 m ? 15 ppm/k 0.1 % 10 ppm/k 0.1 % packaging type/size code quantity packaging style width pitch reel diameter tnpv1206 e3 tnpv1210 e3 e52 = en 1000 (1) paper tape acc. iec 60286-3 type 1a 8 mm 4 mm 180 mm / 7" et1 = ea 5000 et6 = ec 20 000 330 mm / 13" part number and product description part number: tnpv12061m24deea type/size resistance tolerance tcr packaging special tnpv1206 tnpv1210 r = decimal k = thousand m = million (4 digits) b = 0.1 % d = 0.5 % f = 1.0 % h = 50 ppm/k e = 25 ppm/k x = 15 ppm/k y = 10 ppm/k ea ec en up to 2 digits blank = standard product description: tnpv1206 1m24 0.5 % t-9 et1 e3 tnpv1206 1m24 0.5 % t-9 et1 e3 type/size resistance tolerance tcr packaging lead (pb)-free tnpv1206 tnpv1210 examples: 1m24 = 1.24 m ? 560k = 560 k ? 0.1 % 0.5 % 1.0 % t-2 = 50 ppm/k t-9 = 25 ppm/k t-10 = 15 ppm/k t-13 = 10 ppm/k et1 et6 e52 e3 = pure tin termination finish npv12061m t 4deea 2
tnpv e3 www.vishay.com vishay draloric revision: 24-apr-15 3 document number: 28881 for technical questions, contact: thinfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 description production is strictly controll ed and follows an extensive set of instructions establishe d for reproducibility. a homogeneous film of special me tal alloy is deposited on a high grade ceramic substrate (ai 2 o 3 ) and conditioned to achieve the desired temperature coefficient. specially designed inner contacts are deposited on both sides. a special laser is used to achiev e the target value by smoothly cutting a meander groove in the resistive layer without damaging the ceramics. the resistor elements are covered by a unique protective coating designed for electrical, mechanical and climatic protection. the terminations receive a final pure ti n on nickel plating. the result of the determined production is verified by an extensive testing procedure and optical inspection performed on 100 % of the indi vidual chip resistors. this includes full screening for the elimination of products with a potential risk of early life failures according to en 140401-801, 2.1.2.2. only accepted products are laid directly into the paper tape in accordance with iec 60286-3 (1) . assembly the resistors are suitable fo r processing on automatic smd assembly systems. they are suitable for automatic soldering using wave, reflow or vapor phase as shown in iec 61760-1 (1) . the encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, es ters and aqueous solutions. the suitability of conformal coatings, potting compounds, and their processes, if applied, shall be qualified by appropriate means to ensure th e long-term stability of the whole system. the resistors are rohs-compliant, the pure tin plating provides compatibility with lead (pb)-free and lead-containing soldering proc esses. the immunity of the plating against tin whisker gr owth has been proven under extensive testing. all products comply with the iec 62474 , material declaration for products of and for the electrotechnical industry. the dedicated database (2) , that lists declarable substances, ensures full compliance with the following directives: ? 2000/53/ec end of vehicle life directive (elv) and annex ii (elv ii) ? 2011/65/eu restriction of the use of hazardous substances directive (rohs) ? 2012/19/eu waste electrical and electronic equipment directive (weee) the resistors are halogen-free according to jedec ? js709a definition. solderability is specified for 2 years after production or re-qualification. the permitted storage time is 20 years. ? related products for products with ultra preci sion specification see the datasheet: ? tnpu e3 - ultra precision thin film flat chip resistors ( www.vishay.com/doc?28779 ) for products with high stability specification see the datasheet: ? tnpw e3 - high stability thin film flat chip resistors ( www.vishay.com/doc?28758 ) note (1) the quoted iec standards are also released as en st andards with the same number and identical contents. (2) iec 62474 database can be found at http://std.iec.ch/iec62474
tnpv e3 www.vishay.com vishay draloric revision: 24-apr-15 4 document number: 28881 for technical questions, contact: thinfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 functional performance note ? the solid line is based on iec/en reference test conditions which is considered as standard mode. however, above that the maxi mum permissible film temperature is 155 c (dashed line). note ? the permissible operating voltage u max. equals the rated voltage . for ambient temperatures above 70 c power derating must be considered. -55 rate d power in % am b ient temperature in c derating -25 0 25 50 75 100 125 150 175 100 120 80 60 40 20 0 en 70 121k 160k 100k permissi b le operatin g volta g e in v resistance value in nominal operatin g volta g e 1m 10m 1000 1200 800 600 400 200 0 tnpv1210 e3 tnpv1206 e3 p 70 x r
tnpv e3 www.vishay.com vishay draloric revision: 24-apr-15 5 document number: 28881 for technical questions, contact: thinfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 0.1 1 10 10 100 1m 10m 100m 1 10 permissi b le pulse power p i, max. in w maximum pulse loa d p i, max. s in g le pulses pulse duration t i in s tnpv 1210 e3 tnpv 1206 e3 con d itions: p 0, n 1000 and u i u i, max. < < 100 1000 10 100 1m 10m 100m 1 10 permissi b le pulse volta g e u i, max. in v maximum pulse volta g e u i, max. pulse duration t i in s con d itions: p i p i, max. < tnpv 1210 e3 tnpv 1206 e3
tnpv e3 www.vishay.com vishay draloric revision: 24-apr-15 6 document number: 28881 for technical questions, contact: thinfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 test and requirements all tests are carried out in accordance with the following specifications: en 60115-1, generic specification en 60115-8 (successor of en 140400), sectional specification en 140401-801, detail specification iec 60068-2-xx, test methods the parameters stated in the test procedures and requirements table are based on the required tests and permitted limits of en 140401-801. the table presents only the most important tests, for th e full test schedule refer to the documents listed above. however, some additional tests and a number of improvements against those minimum requirements have been included. ? the testing also covers most of the requirements specified by eia / eca-703 and jis-c-5201-1. the tests are carried out under standard atmospheric conditions in accordance with iec 60068-1, 4.3, where upon the following values are applied: temperature: 15 c to 35 c relative humidity: 45 % to 75 % air pressure: 86 kpa to 106 kpa (860 mbar to 1060 mbar) a climatic category lct / uct / 56 is applied, defined by the lower category temperature (lct), the upper category temperature (uct), and the du ration of exposure in the damp heat, steady st ate test (56 days). the components are mounted for testing on printed circuit boards in accordance with en 60115-8, 2.4.2, unless otherwise specified. ? test procedures and requirements en 60115-1 ? clause iec 60068-2 (1) test method test procedure requirements permissible change ( ? r ) stability for product type: tnpv1206 e3 tnpv1210 e3 4.5 - resistance - 1 %; 0.5 %; 0.1 % 4.8.4.2 - temperature coefficient at (20 / -55 / 20) c and (20 / 125 / 20) c 50 ppm/k; 25 ppm/k; 15 ppm/k; 10 ppm/k 4.25.1 - endurance at 70 c u = u max. ; 1.5 h on; 0.5 h off; 70 c; 1000 h (0.05 % r ) 70 c; 8000 h (0.1 % r ) 4.25.3 - endurance at upper category temperature 125 c; 1000 h (0.05 % r ) 155 c; 1000 h (0.1 % r ) 4.24 78 (cab) damp heat, steady state (40 2) c; 56 days; (93 3) % rh; u = 0.1 x u max. (0.1 % r ) 4.19 14 (na) rapid change of temperature 30 min at lct and 30 min at uct; lct = -55 c; uct = 125 c; 1000 cycles (0.1 % r ) 4.13 - short time overload u = 2 x u max. ; 5 s (0.05 % r ) 4.27 - single pulse high voltage overload severity no. 4: u = 2 x u max. ; 10 pulses 10 s/700 s (0.1 % r ) 4.39 - periodic electric overload u = 2 x u max. ; 0.1 s on; 2.5 s off; 1000 cycles (0.1 % r ) 4.22 6 (fc) vibration endurance by sweeping; 10 hz to 2000 hz; no resonance; amplitude ? 1.5 mm or ? 200 m/s 2 ; 7.5 h (0.05 % r )
tnpv e3 www.vishay.com vishay draloric revision: 24-apr-15 7 document number: 28881 for technical questions, contact: thinfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 note (1) the quoted iec standards are also released as en st andards with the same number and identical contents. 4.38 - electrostatic discharge (human body model) iec 61340-3-1 (1) ; 3 pos. + 3 neg. discharges tnpv1206e3: 6 kv tnpv1210e3: 8 kv (0.5 % r ) 4.17.2 58 (td) solderability solder bath method; snpb40; non-activated flux (215 3) c; (3 0.3) s good tinning ( ? 95 % covered); no visible damage solder bath method; snag3cu0.5 or snag3.5; non-activated flux (235 3) c; (2 0.2) s 4.18.2 58 (td) resistance to soldering heat solder bath method; (260 5) c; (10 1) s (0.02 % r ) reflow method 2 (ir/forced gas convection); (260 5) c; (10 1) s 4.29 45 (xa) component solvent resistance isopropyl alco hol; 50 c; method 2 no visible damage 4.30 45 (xa) solvent resistance of marking isopropyl alcohol; 50 c; method 1, toothbrush no visible damage 4.32 21 (ue 3 ) shear (adhesion) 45 n no visible damage 4.33 21 (ue 1 ) substrate bending depth 2 mm, 3 times (0.05 % r ) no visible damage, no open circuit in bent position 4.35 - flammability iec 60695-11-5 (1) , needle flame test; 10 s no burning after 30 s 4.37 67 (cy) damp heat, steady state, accelerated (85 2) c; (85 5) % rh; u = 0.3 x u max. ; 1000 h (0.25 % r ) test procedures and requirements en 60115-1 ? clause iec 60068-2 (1) test method test procedure requirements permissible change ( ? r ) stability for product type: tnpv1206 e3 tnpv1210 e3
tnpv e3 www.vishay.com vishay draloric revision: 24-apr-15 8 document number: 28881 for technical questions, contact: thinfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 dimensions solder pad dimensions note ? utilization of the full specified operating voltage may require special considerations on the creepage and clearance distance between conductors at different potential levels. dimensions and mass type h (mm) l (mm) w (mm) t t /t b (mm) mass (mg) tnpv1206 e3 0.55 0.10 3.2 0.15 1.6 0.15 0.5 0.25 10 tnpv1210 e3 0.60 0.15 3.2 0.15 2.45 0.15 0.5 0.25 16 recommended solder pad dimensions type reflow soldering wave soldering y (mm) x (mm) g (mm) y (mm) x (mm) g (mm) tnpv1206 e3 0.9 1.7 2.0 1.1 1.7 2.3 tnpv1210 e3 0.9 2.5 2.0 1.1 2.5 2.3 h t t l w t b g x y
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