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rev. a07 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specifications su bject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. no.16 nan-ke 9 th rd, science-based industrial park, tainan, 741, ta iwan, r.o.c. tel : +886-6-5051268 / fax : +886-6-5053381 / email : sales@gtop-tech.com / web : www.gtop-tech.com globaltop technology inc. FGPMMOPA6B gps module data sheet revision: a07 data sheet FGPMMOPA6B i s a 66 - channel gps engine board, antenna module with mtk chipset that is fully pin compatible with fgpmm opa6
2 2 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 version history title : globaltop FGPMMOPA6B datasheet subtitle : gps module doc type : datasheet doc id : gr9903 - ds000 e revision date description a00 2009-07-10 first release a01 2009-07-23 add rohs compliant a02 2010-03-23 add packing and handling section, plus smt and soldering cautions a03 2010-04-30 page 10: reference design circuit page 17: modify for rmc magnetic variation data a04 2010-06-11 page 7: recommend pcb layout pad page 26: cautionary note on smt production a05 2010-11-29 new layout page 8: add recommended pcb pad layout page 31: add more cautions on reflow-soldering a06 2011-05-13 update company contact information firmware customization services add application description about 3d-fix pin (pin 5 ) notice : sbas only support under 5hz a07 2011-07-05 page15: update usb parameter and condition of dc characteristics
3 3 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 table of contents 1. functional description .......................... ................................................... .............................. 4 1.1 overview ...................................... ................................................... .............................. 4 1.2 highlights and features ....................... ................................................... ...................... 4 1.3 system block diagram........................... ................................................... ..................... 5 2. specifications ................................. ................................................... .................................... 6 2.1 mechanical dimension .......................... ................................................... .................... 6 2.2 recommended pcb pad layout .................... ................................................... ............. 8 2.3 pin configuration ............................. ................................................... ........................ 10 2.4 pin assignment ................................ ................................................... ........................ 10 2.5 description of i/o pin ........................ ................................................... ...................... 11 2.6 specification list ............................ ................................................... .......................... 13 2.7 dc characteristics ............................ ................................................... ........................ 15 3. protocols ...................................... ................................................... ..................................... 16 3.1 nmea output sentences ......................... ................................................... ................ 16 3.2 mtk nmea command protocols .................... ................................................... ......... 21 3.3 firmware customization services ............... ................................................... ............. 22 4. reference design ................................ ................................................... ............................... 23 4.1 reference design circuit ...................... ................................................... .................... 23 5. packing and handling ........................... ................................................... .............................. 24 5.1 moisture sensitivity .......................... ................................................... ....................... 24 5.2 packing ....................................... ................................................... .............................. 25 5.3 storage and floor life guideline .............. ................................................... ................ 27 5.4 drying ........................................ ................................................... ............................... 27 5.5 esd handling .................................. ................................................... .......................... 28 6. reflow soldering temperature profile ........... ................................................... ..................... 29 6.1 smt reflow soldering temperature profile ...... ................................................... ....... 29 6.2 cautions on reflow soldering with patch antenna .................................................. .. 30 6.3 manual soldering .............................. ................................................... ....................... 33 7. contact information ............................ ................................................... ............................... 33
4 4 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 1. functional description 1.1 overview the FGPMMOPA6B is an ultra-compact pot (patch on to p) gps module. this pot gps receiver provides a solution that is high in position and sp eed accuracy performances, with high sensitivity and tracking capabilities in urban conditions. the gps chipset inside the module is powered by mediatek inc., the world's leading digital media so lution provider and the largest fab-less ic company in taiwan. the module can support up to 66 channels, and is designed for small-form- factor device. it is suitable for every gps-related application, such as: fleet management/asset tracking lbs (location base service) and avl system security system hand-held device for personal positioning and trave l navigation 1.2 highlights and features mediatek mt3329 single chip l1 frequency, c/a code, 66 channels support up 210 prn channels jammer detection and reduction multi-path detection and compensation dimension: 16mm x 16mm x 6mm patch antenna size: 15mm x 15mm x 4mm high sensitivity: up to -165 dbm tracking, superior urban performances1 position accuracy: o without aid: 3m 2d-rms o dgps (sbas(waas,egnos,msas)):2.5m 2d-rms 2 low power consumption: 48ma @ acquisition, 37ma @ t racking low shut-down power consumption: 15ua, typical dgps(waas/egnos/msas/gagan) support (default: enabl e) max. update rate: up to 10hz (configurable by firmw are) usb interface support without extra bridge ic fcc e911 compliance and agps support (offline mode : epo valid up to 14 days ) rohs compliant 1 reference to gps chipset specification 2: sbas can only be enabled when update rate is le ss than or equal to 5hz.
5 5 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 1.3 system block diagram
6 6 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 2. specifications 2.1 mechanical dimension dimension: (unit: mm, tolerance: +/- 0.1mm)
7 7 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7
8 8 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 pin 1 footprint top view pcb bottom view no traces and vias are allowed to pass the area 2.2 recommended pcb pad layout (unit: mm, tolerance: 0.1mm) unit: mm
9 9 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 note: if cant place one hole on pcb for the antenna pad, dont let any trace and vias pass this area. note: place one hole (diameter =3.0mm) under this module for the antenna pad. antenna pad
1 1 0 0 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 2.3 pin configuration top view 2.4 pin assignment pin name i/o description 1 vcc pi main dc power input 2 enable i high activ e, or keep floating for normal working 3 gnd p ground 4 vbackup pi backup power input 5 3d - fix o 3d - fix indicator 6 dplus i/o usb port d+ 7 dminus i/o usb port d - 8 gnd p ground 9 tx o serial data output of nmea 10 rx i serial data input for firmware update
1 1 1 1 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 2.5 description of i/o pin vcc (pin1) the main dc power supply of the module, the voltage should be kept between from 3.2v to 5.0v. the vcc ripple must be controlled under 50mv pp (typical: 3.3v) enable (pin2) keep open or pull high to power on. pull low to shu tdown the module. enable (high): 1.8v<= v enable <=vcc disable (low): 0v<= v enable <=0.25v gnd (pin3) ground vbackup (pin4) this is the power for gps chipset to keep rtc runni ng when main power is removed. the voltage should be kept between 2.0v~4.3v. (typical: 3.0v) the pin must be connected for normal operation.
1 1 2 2 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 3d-fix (pin5) the 3d-fix is assigned as a fix flag output. the ti ming behavior of this pin can be configured by custom firmware for different applications (example : waking up host mcu). if not used, keep floating. before 2d fix the pin should continuously output one-second high- level with one-second low-level signal. after 2d or 3d fix the pin should continuously output low-level signal . dplus (pin6) usb port dplus signal dminus (pin7) usb port dminus signal gnd (pin8) ground tx (pin9) this is the uart transmitter of the module. it outp uts the gps information for application. rx (pin10) this is the uart receiver of the module. it is used to receive software commands and firmware update. 1s 1s low
1 1 3 3 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 2.6 specification list general chipset mtk mt3329 frequency l1, 1575.42mhz c/a code 1.023 mhz channels 66 channels sbas waas, egnos,msas ,gagan supported(default: enable) datum wgs84(default), tokyo - m, tokyo - a, user define cpu arm7ej - s dimensions length/width/height 16*16*6 mm weight 6g performance characteristics position accuracy without aid: 3m 2d - rms dgps(sbas(waas,egnos,msas)):2.5m 2d - rms velocity accuracy without aid:0.1 m/s dgps (sbas ):0.05m/s acceleration accuracy without aid:0.1 m/s 2 dgps (sbas ):0.05m/s 2 timing accuracy 100 ns rms sensitivity 1 acquisition: - 148dbm (cold start) reacquisition: - 160dbm tracking: - 165dbm update rate 1hz (default) acquisition (open sky, stationary) reacqu isition time 1 less than 1 second hot start 1 1.0s (typical) warm start 1 34s (typical) cold start 1 35s (typical) 1 reference to gps chipset specification
1 1 4 4 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 dynamic altitude maximum 18,000m velocity maximum 515m/s acceleration maximum 4g i/o signal output 8 data bits, no parity, 1 stop bit available baud rates default: 4800 bps (4800/9600/38400/57600/115200 bps by customization) protocols nmea 0183 v3.01 (default: gga,gsa,gsv,rmc,vtg) mtk nmea command data output interface usb interface logo certi fied usb 2.0 full - speed compatible uart interface ttl level serial port environment operating temperature - 40 c to 85 c storage temperature - 50 c to 90 c operating humidity 5% to 95% (no condensing) mounting smd type ,10 pin
1 1 5 5 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 2.7 dc characteristics parameter condition min. typ. max. unit operation supply voltage 3.2 3.3 5.0 v operation supply ripple voltage 50 mvpp backup battery voltage 2.0 3.0 4.3 v rx ttl h level vcc=3. 2 ~5.0 v 2.1 2.8 v rx ttl l level vcc=3. 2~5.0 v 0 0.9 v tx ttl h level vcc=3. 2~5.0 v 2.1 2.8 v tx ttl l level vcc=3. 2~5.0 v 0 0.8 v usb d ifferential 1 vcc=3. 2~5.0 v (d+) - (d - ) >200 m v d ifferential 0 vcc=3. 2~5.0 v (d - ) - (d+) >200 m v power consumption @ 3.3v , 1hz update rate acquisitio n 43 48 53 ma tracking 32 37 42 ma backup power consumption@ 3.0v 25c 10 ua shut - down power consumption (via enable pin) 25c 15 ua
1 1 6 6 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 3. protocols 3.1 nmea output sentences table-1 a list of each of the nmea output sentences specif ically developed and defined by mtk for use within mtk products table-1: nmea output sentence option description gga time, position and fix type data. gsa gps receiver operating mode, active satellites used in the position solution and dop values. gsv the number of gps satellites in view satellite id n umbers, elevation, azimuth, and snr values. rmc time, date, position, course and speed data. recomm ended minimum navigation information. vtg course and speed information relative to the ground .
1 1 7 7 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 ggaglobal positioning system fixed data. time, posi tion and fix related data table-2 contains the values for the following example $gpgga,064951.000,2307.1256,n,12016.4438,e,1,8,0.95 ,39.9,m,17.8,m,,*65 table - 2: gga data format name example units description message id $gpgga gga protocol header utc time 064951.000 hhmmss.sss latitude 2307.1256 ddmm.mmmm n/s indicator n n=north or s=south longitude 12016.4438 dddmm.mmmm e/w indicator e e=east or w=west position fix indicator 1 see table - 3 satell ites used 8 range 0 to 14 hdop 0.95 horizontal dilution of precision msl altitude 39.9 meters ante nna altitude above/below mean - s e a level units m meters units of antenna altitude geoidal separation 17.8 meters units m meters units of geoid separat ion age of diff. corr. second null fields when dgps is not used checksum *65 end of message termination table-3: position fix indicator value description 0 fix not available 1 gps fix 2 differential gps fix
1 1 8 8 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 gsagnss dop and active satellites table-4 contains the values for the following example $gpgsa,a,3,29,21,26,15,18,09,06,10,,,,,2.32,0.95,2. 11*00 table-4: gsa data format name example units description message id $gpgsa gsa protocol header mode 1 a see table-5 mode 2 3 see table-6 satellite used 29 sv on channel 1 satellite used 21 sv on channel 2 .... . . .... satellite used sv on channel 12 pdop 2.32 position dilution of precision hdop 0.95 horizontal dilution of precision vdop 2.11 vertical dilution of precision checksum *00 end of message termination table-5: mode 1 value description m manualforced to operate in 2d or 3d mode a 2d automaticallowed to automatically switch 2d/3d table-6: mode 2 value description 1 fix not available 2 2d ( 4 svs used) 3 3d ( R 4 svs used)
1 1 9 9 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 gsvgnss satellites in view table-7 contains the values for the following example $gpgsv,3,1,09,29,36,029,42,21,46,314,43,26,44,020,4 3,15,21,321,39*7d $gpgsv,3,2,09,18,26,314,40,09,57,170,44,06,20,229,3 7,10,26,084,37*77 $gpgsv,3,3,09,07,,,26*73 table-7: gsv data format name example units description message id $gpgsv gsv protocol header number of messages 3 range 1 to 3 (depending on the number of satellites tracked, multiple messages of gsv data may be required.) message number1 1 range 1 to 3 satellites in view 09 satellite id 29 channel 1 (range 1 to 32) elevation 36 degrees channel 1 (maximum 90) azimuth 029 degrees channel 1 (true, range 0 to 359) snr (c/no) 42 dbhz range 0 to 99, (null when not tracking) .... . . .... satellite id 15 channel 4 (range 1 to 32) elevation 21 degrees channel 4 (maximum 90) azimuth 321 degrees channel 4 (true, range 0 to 359) snr (c/no) 39 dbhz range 0 to 99, (null when not tracking) checksum *7d end of message termination
2 2 0 0 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 rmcrecommended minimum navigation information table-8 contains the values for the following example $gprmc,064951.000,a,2307.1256,n,12016.4438,e,0.03,1 65.48,260406, 3.05,w,a*55 table-8: rmc data format name example units description message id $gprmc rmc protocol header utc time 064951.000 hhmmss.sss status a a=data valid or v=data not valid latitude 2307.1256 ddmm.mmmm n/s indicator n n=north or s=south longitude 12016.4438 dddmm.mmmm e/w indicator e e=east or w=west speed over ground 0.03 knots course over ground 165.48 degrees true date 260406 ddmmyy magnetic variation 3.05,w degrees e=east or w=west (need globaltop customization service) mode a a= autonomous mode d= differential mode e= estimated mode checksum *55 end of message termination
2 2 1 1 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 vtgcourse and speed information relative to the gr ound table-9 contains the values for the following example : $gpvtg,165.48,t,,m,0.03,n,0.06,k,a*37 table-9: vtg data format name example units description message id $gpvtg vtg protocol header course 165.48 degrees measured heading reference t true course degrees measured heading reference m magnetic (need globaltop customization service) speed 0.03 knots measured horizontal speed units n knots speed 0.06 km/hr measured horizontal speed units k kilometers per hour mode a a= autonomous mode d= differential mode e= estimated mode checksum *06 end of message termination 3.2 mtk nmea command protocols the complete mtk nmea command list document is avai lable by request. contact globaltop for more details. packet type : 103 pmtk_cmd_cold_start packet meaning: cold start dont use time, position, almanacs and ephemeris da ta at re-start. example: $pmtk103*30
2 2 2 2 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 3.3 firmware customization services globaltop also offers flexible, value-adding gps fi rmware customization services that maximizes the over system efficiencies and power consumptions. la test functions like binary mode, 1-sentence output, geo-fencing and last position retention, pl ease see our website at www.gtop-tech.com under products / gps modules / software services fo r more details. note: not all firmware customization services liste d below are supported by gmm-u5j. please contact globaltop sales or technical support for mo re details.
2 2 3 3 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 4. reference design this chapter introduces the reference schematic des ign for the best performance. additional tips and cautions on design are well doc umented on application note, which is available upon request. 4.1 reference design circuit usb interface uart interface
2 2 4 4 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 5. packing and handling gps modules, like any other smd devices, are sensit ive to moisture, electrostatic discharge, and temperature. by following the standards outlined in this document for globaltop gps module storage and handling, it is possible to reduce the chances of them being damaged during production set-up. this document will go through the basics on how globaltop packages its modules to ensure they arrive at their destination without any damage s and deterioration to performance quality, as well as some cautionary notes before going through the surface mount process. please read the sections ii to v carefully to avoid damages permanent damages due to moisture intake gps receiver modules contain highly sensitive elect ronic circuits and are electronic sensitive devices and improper handling without esd protectio ns may lead to permanent damages to the modules. please read section vi for more detail s. 5.1 moisture sensitivity globaltop gps modules are moisture sensitive, and m ust be pre-baked before going through the solder reflow process. it is important to know that : globaltop gps modules must complete solder reflow p rocess in 72 hours after pre-baking. this maximum time is otherwise known as floor life if the waiting time has exceeded 72 hours, it is po ssible for the module to suffer damages during the solder reflow process such as cracks and delaminati on of the smd pads due to excess moisture pressure.
2 2 5 5 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 5.2 packing globaltop gps modules are packed in such a way to e nsure the product arrives to smd factory floor without any damages. gps modules are placed individually on to the packa ging tray. the trays will then be stacked and packaged together. included are: 1. two packs of desiccant for moisture absorption 2. one moisture level color coded card for relative hu midity percentage. each package is then placed inside an antistatic ba g (or pe bag) that prevents the modules from being damaged by electrostatic discharge. figure 1: one pack of gps modules each bag is then carefully placed inside two levels of cardboard carton boxes for maximum protection. figure 2: box protection
2 2 6 6 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 the moisture color coded card provides an insight t o the relative humidity percentage (rh). when the gps modules are taken out, it should be around or lower than 30% rh level. outside each electrostatic bag is a caution label f or moisture sensitive device. figure 3: example of moisture color coded card and caution label
2 2 7 7 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 5.3 storage and floor life guideline since globaltop modules must undergo solder-reflow process in 72 hours after it has gone through pre-baking procedure, therefore if it is not used b y then, it is recommended to store the gps modules in dry places such as dry cabinet. the approximate shelf life for globaltop gps module s packages is 6 months from the bag seal date, when store in a non-condensing storage environment (<30c/60% rh) it is important to note that it is a required proce ss for globaltop gps modules to undergo pre-baking procedures, regardless of the storage co ndition. 5.4 drying because the vapor pressures of moisture inside the gps modules increase greatly when it is exposed to high temperature of solder reflow, in order to p revent internal delaminating, cracking of the devices, or the popcorn phenomenon, it is a necessary requirement for globaltop gps module to undergo pre-baking procedure before any high temper ature or solder reflow process. the recommendation baking time for globaltop gps mod ule is as follows: 60c for 8 to 12 hours once baked, the modules floor life will be reset , and has additional 72 hours in normal factory condition to undergo solder reflow process. please limit the number of times the gps modules un dergoes baking processes as repeated baking process has an effect of reducing the wettin g effectiveness of the smd pad contacts. this applies to all smt devices. oxidation risk: baking smd packages may cause oxida tion and/or intermetallic growth of the terminations, which if excessive can result in solderability problems during board assembly. the temperature and time for baking smd p ackages are therefore limited by solderability considerations. the cumulative bake t ime at a temperature greater than 90c and up to 125c shall not exceed 96 hours. bake tem peratures higher than 125c are now allowed.
2 2 8 8 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 5.5 esd handling please carefully follow the following precautions t o prevent severe damage to gps modules. globaltop gps modules are sensitive to electrostati c discharges, and thus are electrostatic sensitive devices (esd). careful handling of the gps modules a nd in particular to its patch antenna (if included) and rf_in pin, must follow the standard esd safety practices: unless there is a galvanic coupling between the loc al gnd and the pcb gnd, then the first point of contact when handling the pcb shall always be between the local gnd and pcb gnd. before working with rf_in pin, please make sure the gnd is connected when working with rf_in pin, do not contact any cha rges capacitors or materials that can easily develop or store charges such as patch anten na, coax cable, soldering iron. please do not touch the mounted patch antenna to pr event electrostatic discharge from the rf input when soldering rf_in pin, please make sure to use a n esd safe soldering iron (tip).
2 2 9 9 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 6. reflow soldering temperature profile the following reflow temperature profile was evalua ted by globaltop and has been proven to be reliable qualitatively. please contact us beforehan d if you plan to solder this component using a deviated temperature profile as it may cause signif icant damage to our module and your device. all the information in this sheet can only be used only for pb-free manufacturing process. 6.1 smt reflow soldering temperature profile (reference only) reflow condition (following jedec-020c) average ramp-up rate (217c to peak): 3c/sec. max. preheat: 150 ~ 200c, 60 ~ 180 seconds temperature maintained above 217c: 60~150 seconds time within 5c of actual peak temperature: 20 ~ 40 seconds peak temperature: 250 +0/-5c ramp-down rate: 6c/sec. max. time 25c to peak temperature: 8 minutes max. cycle interval: 5 minutes
3 3 0 0 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 6.2 cautions on reflow soldering with patch antenna details suggestions notes 1 before proceeding with the reflow - soldering process, the gps module must be pre-baked. pre - bake time: 6 hours @ 605c or 4 hours @ 705c the maximum tolerated temperature for the tray is 100c. after the pre-baking process, please make sure the temperature is sufficiently cooled down to 35c or below in order to prevent any tray deformation. 2 because pcba (along with the patch antenna) is highly endothermic during the reflow- soldering process, extra care must be paid to the gps module's solder joint to see if there are any signs of cold weld(ing) or false welding. the parameters of the reflow temperature must be set accordingly to modules reflow- soldering temperature profile. double check to see if the surrounding components around the gps module are displaying symptoms of cold weld(ing) or false welding. 3 special attentions are needed for pcba board during reflow-soldering to see if there are any symptoms of bending or deformation to the pcba board, possibility due to the weight of the module. if so, this will cause concerns at the latter half of the production process. a loading carrier fixture must be used with pcba if the reflow soldering process is using rail conveyors for the production. if there is any bending or deformation to the pcba board, this might causes the pcba to collide into one another during the unloading process. 4 before the pcba is going through the reflow-soldering process, the production operators must check by eyesight to see if there are positional offset to the module, because it will be difficult to readjust after the module has gone through reflow-soldering process. the operators must check by eyesight and readjust the position before reflow-soldering process. if the operator is planning to readjust the module position, please do not touch the patch antenna while the module is hot in order to prevent rotational offset between the patch antenna and module.
3 3 1 1 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 details suggestions notes 5 before handling the pcba, they must be cooled to 35c or below after they have gone through the reflow-soldering process, in order to prevent positional shift that might occur when the module is still hot. 1 . can use electric fans behind the reflow machine to cool them down. 2. cooling the pcba can prevent the module from shifting due to fluid effect. it is very easy to cause positional offset to the module and its patch antenna when handling the pcba under high temperature. 6 1. when separating the pcba panel into individual pieces using the v- cut process, special attentions are needed to ensure there are sufficient gap between patch antennas so the patch antennas are not in contact with one another. 2. if v-cut process is not available and the pieces must be separated manually, please make sure the operators are not using excess force which may cause rotational offset to the patch antennas. 1. the blade and the patch antenna must have a distance gap greater than 0.6mm. 2. do not use patch antenna as the leverage point when separating the panels by hand. 1. test must be performed first to determine if v-cut process is going to be used. there must be enough space to ensure the blade and patch antenna do not touch one another. 2. an uneven amount of manual force applied to the separation will likely to cause positional shift in patch antenna and module. 7 when separating panel into individual pieces during latter half of the production process, special attentions are needed to ensure the patch antennas do not come in contact with one another in order to prevent chipped corners or positional shifts. use tray to separate individual pieces. it is possible to chip corner and/or cause a shift in position if patch antennas come in contact with each other.
3 3 2 2 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 other cautionary notes on reflow-soldering process: 1. module must be pre-baked before going through smt solder reflow process. 2. the usage of solder paste should follow first in f irst out principle. opened solder paste needs to be monitored and recorded in a timely fash ion (can refer to ipqc for related documentation and examples). 3. temperature and humidity must be controlled in smt production line and storage area. temperature of 23c, 605% rh humidity is recommend ed. (please refer to ipqc for related documentation and examples) 4. when performing solder paste printing, please notic e if the amount of solder paste is in excess or insufficient, as both conditions may lead to defects such as electrical shortage, empty solder and etc. 5. make sure the vacuum mouthpiece is able to bear the weight of the gps module to prevent positional shift during the loading process. 6. before the pcba is going through the reflow-solderi ng process, the operators should check by eyesight to see if there are positional offset t o the module. 7. the reflow temperature and its profile data must be measured before the smt process and match the levels and guidelines set by ipqc. 8. if smt protection line is running a double-sided pr ocess for pcba, please process gps module during the second pass only to avoid repeate d reflow exposures of the gps module. this is because the patch antenna and its shielding on gps module are endothermic and if the gps module is already processed in the first pa ss, can result in the separation of the patch antenna and pcba during the second pass due t o gravitational pull. please contact globaltop if you must process gps module during the 1 st pass of double-side process. figure 6.2: place gps module right-side up when run ning reflow-solder process, do not invert.
3 3 3 3 this document is the exclusive property of globalto p tech inc. and should not be distributed, reproduc ed, into any other format without prior permission of globaltop tech inc. specificati ons subject to change without prior notice. copyright ? 2011 globaltop technology inc. all righ ts reserved. FGPMMOPA6B data sheet globaltop technology rev. a0 7 6.3 manual soldering soldering iron: bit temperature: under 380c time: under 3 sec. notes: 1. please do not directly touch the soldering pads on the surface of the pcb board, in order to prevent further oxidation 2. the solder paste must be defrosted to room temperat ure before use so it can return to its optimal working temperature. the time required for this procedure is unique and dependent on the properties of the solder paste used. 3. the steel plate must be properly assessed before an d after use, so its measurement stays strictly within the specification set by sop. 4. please watch out for the spacing between soldering joint, as excess solder may cause electrical shortage 5. please exercise with caution and do not use extensi ve amount of flux due to possible siphon effects on neighboring components, which may lead t o electrical shortage. 6. please do not use the heat gun for long periods of time when removing the shielding or inner components of the gps module, as it is very l ikely to cause a shift to the inner components and will leads to electrical shortage. 7. contact information globaltop technology inc. address: no.16 nan-ke 9th rd, science-based industrial park, tainan, 741, taiwan, r.o.c. tel: +886-6-505-1268 fax: +886-6-505-3381 website: www.gtop-tech.com email: sales@gtop-tech.com

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