CPDQR3V3R-HF smd esd protection diode page 1 features - bi-directional esd protection. - surface mount package. - ultra small smd package:0402. - high component density . mechanical data - case: 0402/sod-923 standard package, molded plastic. - t erminals: gold plated, solderable per mil-std-750,method 2026. - marking code: e3 - mounting position: any . - w eight: 0.001 gram(approx.). comchip t echnology co., l td. 0 . 0 4 1 ( 1 . 0 5 ) 0 . 0 3 7 ( 0 . 9 5 ) 0 . 0 2 6 ( 0 . 6 5 ) 0 . 0 2 2 ( 0 . 5 5 ) d i m e n s i o n s i n i n c h e s a n d ( m i l l i m e t e r ) 0 . 0 2 0 ( 0 . 5 0 ) t y p . 0 . 0 2 2 ( 0 . 5 5 ) 0 . 0 1 8 ( 0 . 4 5 ) 0 . 0 1 2 ( 0 . 3 0 ) t y p . rev : a qw -g7044 0 4 0 2 / s o d - 9 2 3 f rohs device halogen free c o m c h i p s m d d i o d e s p e c i a l i s t o electrical characteristics (at t a =25 c unless otherwise noted) symbol t yp parameter min max unit junction capacitance conditions diode breakdown voltage v bd v i r = 1ma leakage current i r ua c t pf v r = 0v ,f =1mhz 5.2 18 1.0 v r = 3.3v esd capability kv storage temperature operation temperature 150 c t stg t j c 150 -55 esd iec 61000-4-2(air) iec 61000-4-2(contact) 1 5 8 reverse stand-off voltage v r wm v 3.3 clamping voltage v v c i pp =1a , tp=8/20us i pp =2a , tp=8/20us 1 5 . 5 18 peak pulse power p pk w tp= 8/20 36
p o w e r r a t i n g , ( % ) f ig . 4 - p o w e r r a ti n g d e r a ti n g c u r v e ambient temperature, ( c ) 2 0 4 0 6 0 8 0 1 0 0 mounting on glass epoxy pcbs c a p a c i t a n c e b e t w e e n t e r m i n a l s , ( p f ) f i g . 2 - c a p a c i t a n c e b e t w e e n t e r m i n a l s c h a r a c t e r i s t i c s reverse voltage, (v) 1 1 13 15 17 21 0 1 2 3 4 fig.3 - clamping voltage vs. peak pulse current c l a m p i n g v o l t a g e , ( v ) peak pulse current, (a) 1 2 1 1 5 1 4 1 3 2 19 0 0 2 5 5 0 1 0 0 1 5 0 7 5 1 2 5 smd esd protection diode c o m c h i p s m d d i o d e s p e c i a l i s t page 2 comchip t echnology co., l td. rev : a qw -g7044 ra ting and characteristic cur ves (CPDQR3V3R-HF) 0 3 1 1 0 w aveform parameters: tr=8us td=20us 1 6 1 7 1 8 1 9 f o r m a c c . i e c 6 1 0 0 0 - 4 - 5 w a v e f i g . 1 - 8 / 2 0 u s p e a k p u l s e c u r r e n t t i m e , ( u s ) 0 % 2 0 % 4 0 % 6 0 % 8 0 % 1 0 0 % 0 5 1 5 2 5 3 0 1 0 2 0 1 2 0 % p e r c e n t a g e o f i p p e - t t d = t i p p / 2 t a = 2 5 c p e a k v a l u r i p p t e s t w a v e f o r m p a r a m e t e r s t f = 8 u s t d = 2 0 u s
o 1 2 0 t railer device leader 10 pitches (min) 10 pitches (min) ....... ....... ....... ....... ....... ....... ....... ....... end start d 1 d 2 d w 1 t c direction of feed reel t aping specification b c d d d 2 d 1 e f p p 0 p 1 t s y m b o l a w w 1 ( m m ) ( i n c h ) 0 . 0 3 0 0 . 0 0 4 0 . 0 4 5 0 . 0 0 4 0 . 0 2 4 0 . 0 0 4 0 . 0 6 1 + 0 . 0 0 4 7 . 0 0 8 0 . 0 4 2 . 3 6 2 m i n . 0 . 5 1 2 0 . 0 0 8 s y m b o l ( m m ) ( i n c h ) 0 . 0 6 9 0 . 0 0 4 0 . 1 3 8 0 . 0 0 2 0 . 1 5 7 0 . 0 0 4 0 . 1 5 7 0 . 0 0 4 0 . 0 7 9 0 . 0 0 4 0 . 0 0 9 0 . 0 0 2 0 . 3 1 5 0 . 0 0 8 0 . 5 3 1 m a x . 0 . 7 5 0 . 1 0 1 . 1 5 0 . 1 0 4 . 0 0 0 . 1 0 1 . 5 5 + 0 . 1 0 3 . 5 0 0 . 0 5 1 . 7 5 0 . 1 0 6 0 . 0 m i n . 1 3 . 0 0 . 2 0 0 . 6 0 0 . 1 0 4 . 0 0 0 . 1 0 2 . 0 0 0 . 1 0 0 . 2 3 0 . 0 5 8 . 0 0 0 . 2 0 1 3 . 5 m a x . 1 7 8 1 0 4 0 2 ( s o d - 9 2 3 f ) 0 4 0 2 ( s o d - 9 2 3 f ) i n d e x h o l e d e f b w p p 0 p 1 a smd esd protection diode c o m c h i p s m d d i o d e s p e c i a l i s t page 3 comchip t echnology co., l td. rev : a qw -g7044
page 4 comchip t echnology co., l td. rev : a qw -g7044 smd esd protection diode c o m c h i p s m d d i o d e s p e c i a l i s t marking code e3 product type marking code suggested p ad layout size (inch) 0.030 (mm) 0.750 0.500 0.700 0.020 0.028 0402/sod-923f 1.250 0.049 e 0.250 0.010 standard packaging case t ype qty per reel (pcs) 5,000 0402/sod-923f reel size (inch) 7 a b c d a c b e d e3 part number marking code CPDQR3V3R-HF
|
