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  1 power transistors 2sb1499, 2sb1499a silicon pnp epitaxial planar type for low-freauency power amplification n features l high forward current transfer ratio h fe which has satisfactory linearity l low collector to emitter saturation voltage v ce(sat) l allowing automatic insertion with radial taping n absolute maximum ratings (t c =25?c) parameter collector to base voltage collector to emitter voltage emitter to base voltage peak collector current collector current collector power dissipation junction temperature storage temperature symbol v cbo v ceo v ebo i cp i c p c t j t stg ratings C60 C80 C60 C80 C5 C8 C4 15 2 150 C55 to +150 unit v v v a a w ?c ?c 2sb1499 2sb1499a 2sb1499 2sb1499a t c =25 c ta=25 c n electrical characteristics (t c =25?c) parameter collector cutoff current collector cutoff current emitter cutoff current collector to emitter voltage forward current transfer ratio base to emitter voltage collector to emitter saturation voltage transition frequency turn-on time storage time fall time symbol i ces i ceo i ebo v ceo h fe1 * h fe2 v be v ce(sat) f t t on t stg t f conditions v ce = C60v, v be = 0 v ce = C80v, v be = 0 v ce = C30v, i b = 0 v ce = C60v, i b = 0 v eb = C5v, i c = 0 i c = C30ma, i b = 0 v ce = C4v, i c = C1a v ce = C4v, i c = C3a v ce = C4v, i c = C3a i c = C4a, i b = C 0.4a v ce = C10v, i c = C 0.1a, f = 10mhz i c = C4a, i b1 = C 0.4a, i b2 = 0.4a min C60 C80 70 15 typ 30 0.2 0.5 0.2 max C400 C400 C700 C700 C1 250 C2 C1.5 unit m a m a ma v v v mhz m s m s m s 2sb1499 2sb1499a 2sb1499 2sb1499a 2sb1499 2sb1499a * h fe1 rank classification rank q p h fe1 70 to 150 120 to 250 unit: mm 1:base 2:collector 3:emitter mt4 type package 1.0 10.0 0.2 0.55 0.1 2.5 0.2 2.5 0.2 4.2 0.2 13.0 0.2 2.5 0.2 18.0 0.5 solder dip 5.0 0.1 2.25 0.2 1.2 0.1 0.65 0.1 0.55 0.1 c1.0 90 c1.0 123 1.05 0.1 0.35 0.1 maintenance/ discontinued please visit following url about latest information. http://panasonic.co.jp/semicon/e-index.html
2 power transistors 2sb1499, 2sb1499a p c ta i c v ce i c v be v ce(sat) i c h fe i c f t i c area of safe operation (aso) r th(t) t 0 160 40 120 80 140 20 100 60 0 20 15 5 10 (1) t c =ta (2) without heat sink (p c =2.0w) (1) (2) ambient temperature ta ( ?c ) collector power dissipation p c ( w ) 0 ?2 ?0 ? ? ? ? 0 ? ? ? ? ? ? t c =25?c ?00ma ?0ma ?0ma ?0ma ?0ma ?0ma ?ma ?ma i b =?20ma collector to emitter voltage v ce ( v ) collector current i c ( a ) 0 ?.0 ?.6 ?0.4 ?.2 ?0.8 0 ?0 ? ? ? ? t c =100?c ?5?c 25?c v ce =?v base to emitter voltage v be ( v ) collector current i c ( a ) ?0.01 ?0.1 ? ?0 ?0.03 ?0.3 ? ?0.01 ?0.03 ?0.1 ?0.3 ? ? ?0 ?0 ?00 i c /i b =10 25?c t c =100?c ?5?c collector current i c ( a ) collector to emitter saturation voltage v ce(sat) ( v ) ?0.01 ?0.1 ? ?0 ?0.03 ?0.3 ? 1 3 10 30 100 300 1000 3000 10000 v ce =?v t c =100?c 25?c ?5?c collector current i c ( a ) forward current transfer ratio h fe ?0.01 ?0.1 ? ?0 ?0.03 ?0.3 ? 1 3 10 30 100 300 1000 3000 10000 v ce =?v f=10mhz t c =25?c collector current i c ( a ) transition frequency f t ( mhz ) ? ?0 ?00 ?000 ? ?0 ?00 ?0.01 ?0.03 ?0.1 ?0.3 ? ? ?0 ?0 ?00 10ms t=1ms i cp 2sb1499a 2sb1499 i c non repetitive pulse t c =25?c dc collector to emitter voltage v ce ( v ) collector current i c ( a ) 10 ? 10 10 ? 10 ? 10 ? 110 3 10 2 10 4 0.1 1 10 100 10000 1000 (1) (2) note: r th was measured at ta=25?c and under natural convection. (1) without heat sink (2) with a 50 50 2mm al heat sink time t ( s ) thermal resistance r th (t) ( ?c/w ) maintenance/ discontinued please visit following url about latest information. http://panasonic.co.jp/semicon/e-index.html
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) the products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod- ucts may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (4) the products and product specifications described in this book are subject to change without notice for modification and/or im- provement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of matsushita electric industrial co., ltd.


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