dhg 30 im 600 pc advanced ns sonic fast recovery diode symbol definition r a t i n g s features / advantages: typ. max. i fsm i r a v 200 i a v f 2.37 r 0.60 k/w v r = 2 1 3 min. 30 t = 10 ms applications: v rrm v 600 50 t vj vc = t vj c =ma 5 package: part number v r = t vj =c i f =a v t c = 95c d = p tot 210 w t c c = t vj 150 c -55 v i rrm = = 600 30 30 t vj = 45c dhg 30 im 600 pc v a 600 v 600 25 25 25 max. repetitive reverse voltage reverse current forward voltage virtual junction temperature total power dissipation max. forward surge current conditions unit 3.18 t vj c =25 c j j unction capacitance v = v; t 125 v f0 v 1.31 t vj = 150c r f 29.2 f = 1 mhz = c 25 m v 2.22 t vj =c i f =a v 30 150 3.11 i f =a 60 i f =a 60 threshold voltage slope resistance for power loss calculation only backside: cathode 12 a t vj =c reverse recovery time a tbd 35 tbd ns (50 hz), sine t rr = 35 ns housing: high performance fast recovery diode low loss and soft recovery single diode to-263 (d2pak) r industry standard outline r epoxy meets ul 94v-0 r rohs compliant r vj i rm max. reverse recovery current i f =a; 35 25 t= c vj -di f =a/s 600 /dt t rr v r =v 400 t vj =c 25 t= c vj a 16 400 pf thermal resistance junction to case thjc rectangular 0.5 planar passivated chips very low leakage current very short recovery time improved thermal behaviour very low irm-values very soft recovery behaviour avalanche voltage rated for reliable operation soft reverse recovery for low emi/rfi low irm reduces: - power dissipation within the diode - turn-on loss in the commutatin g switch antiparallel diode for high frequency switching devices antisaturation diode snubber diode free wheeling diode rectifiers in switch mode power supplies (smps) uninterruptible power supplies (ups) fav average forward current fav ixys reserves the right to change limits, conditions and dimensions. ? 20081031 data according to iec 60747and per diode unless otherwise specified 2008 ixys all rights reserved
dhg 30 im 600 pc advanced i rms a per pin 35 r thch k/w 0.25 t stg c 150 storage temperature -55 weight g 2 symbol definition ratings typ. max. min. conditions rms current thermal resistance case to heatsink unit i is typically limited by: 1. pin-to-chip re sistance; or by 2. current capability of the chip. in case of 1, a common cathode/anode configuration and a non-isol ated backside, the whole current capability can be used by con necting the backside. f c n 60 mounting force with clip 20 ordering delivering mode base qty code key standard part name dhg 30 im 600 pc 503501 tape & reel 800 product marking date code part no. logo order code xxxxxxxxx ixys yww abcd d h g 30 im 600 pc part number diode sonic fast recovery diode extreme fast single diode to-263ab (d2pak) (2) = = = dhg30i600pa dhg30i600ha to-220 to-247 similar part package 1) 1 ) marking on product dhg30iM600PC 600 600 voltage class current rating [a] reverse voltage [v] = = = = rms ixys reserves the right to change limits, conditions and dimensions. ? 20081031 data according to iec 60747and per diode unless otherwise specified 2008 ixys all rights reserved
dhg 30 im 600 pc advanced minmaxminmax a 4.06 4.83 0.160 0.190 a1 b 0.51 0.99 0.020 0.039 b2 1.14 1.40 0.045 0.055 c 0.40 0.74 0.016 0.029 c2 1.14 1.40 0.045 0.029 d 8.38 9.40 0.330 0.370 d1 8.00 8.89 0.315 0.350 e 9.65 10.41 0.380 0.410 e1 6.22 8.13 0.245 0.320 e h 14.61 15.88 0.575 0.625 l 1.78 2.79 0.070 0.110 l1 1.02 1.68 0.040 0.066 l2 1.02 1.52 0.040 0.060 w typ. 0.02 0.040 typ. 0.0008 0.0016 all dimensions conform with and/or are within jedec standard. dim. millimeter inches 2,54 bsc typ. 0.10 typ. 0.004 0,100 bsc outlines to-263 (d2pak) ixys reserves the right to change limits, conditions and dimensions. ? 20081031 data according to iec 60747and per diode unless otherwise specified 2008 ixys all rights reserved
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