page 1 qw -jp013 rev :a comchip t echnology co., l td. features -iec61000-4-2 8kv(contact), 16kv(air). -operating voltage: 5v . mechanical data -case: sot -23 standard package, molded plastic. -t erminals: solderable per mil-std-750d, method 2026. -marking code: e05 -mounting position: any . -w eight: 0.0078 gram (approx.). cpdt -5v0c-hf electrical characteristics (at t a=25c unless otherwise noted) symbol t yp parameter min max unit junction capacitance conditions diode breakdown voltage v bd v i r = 1ma leakage current i l ua 30 c t pf v r =0v ,f =1mhz 6.1 0.1 7.0 25 2.0 v r = 5v esd capability kv 1 6 storage temperature operation temperature 125 o c t stg t j o c 150 -55 esd iec 61000-4-2(air) iec 61000-4-2(contact) 8 -bi-directional esd protection. d i m e n s i o n s i n i n c h e s a n d ( m i l l i m e t e r ) s o t - 2 3 3 1 2 0.1 19(3.00) 0.1 10(2.80) 0.056(1.40) 0.047(1.20) 0.079(2.00) 0.071(1.80) 0.041(1.05) 0.035(0.90) 0.020(0.50) 0.012(0.30) 0.006(0.15) 0.002(0.05) 0.100(2.55) 0.089(2.25) 0.004(0.10) max 0.008(0.20) min smd esd protection diode rohs device halogen free
page 2 comchip t echnology co., l td. rev :a ra ting and characteristic cur ves (cpdt -5v0c-hf) p o w e r r a t i n g ( % ) f ig . 3 - p o w e r r a ti n g d e r a ti n g c u r v e o ambient temperature ( c) 2 0 4 0 6 0 8 0 1 0 0 0 2 5 5 0 7 5 1 0 0 1 2 5 1 5 0 mounting on glass epoxy pcbs c a p a c i t a n c e b e t w e e n t e r m i n a l s ( p f ) f ig . 2 - c a p a c i t a n c e b e t w e e n t e r m i n a l s c h a r a c t e r i s t i c s reverse voltage (v) 10 15 20 25 30 35 0 1 2 3 4 5 r e v e r s e c u r r e n t ( a ) f i g . 1 - r e v e r s e c h a r a c t e r i s t i c s reverse voltage (%) 0 2 0 4 0 6 0 1 0 0 1 0 0 n 1 u 1 0 u 1 0 n 8 0 qw -jp013 smd esd protection diode
page 3 comchip t echnology co., l td. rev :a qw -jp013 b c d d d 2 d 1 e f p p 0 p 1 s o t - 2 3 s y m b o l a w w 1 ( m m ) ( i n c h ) 0 . 1 2 2 0 . 0 0 4 0 . 1 1 2 0 . 0 0 4 0 . 0 5 5 0 . 0 0 4 0 . 0 6 1 0 . 0 0 4 7 . 0 0 8 0 . 0 4 1 . 9 6 9 m i n . 0 . 5 1 2 0 . 0 0 8 s o t - 2 3 s y m b o l ( m m ) ( i n c h ) 0 . 0 6 9 0 . 0 0 4 0 . 1 3 8 0 . 0 0 2 0 . 1 5 7 0 . 0 0 4 0 . 1 5 7 0 . 0 0 4 0 . 0 7 9 0 . 0 0 2 0 . 3 1 5 0 . 0 1 2 0 . 5 6 7 m a x . 3 . 1 0 0 . 1 0 2 . 8 5 0 . 1 0 4 . 0 0 0 . 1 0 1 . 5 5 0 . 1 0 3 . 5 0 0 . 0 5 1 . 7 5 0 . 1 0 5 0 . 0 m i n . 1 3 . 0 0 . 2 0 1 . 4 0 0 . 1 0 4 . 0 0 0 . 1 0 2 . 0 0 0 . 0 5 8 . 0 0 0 . 3 0 1 4 . 4 m a x . 1 7 8 1 smd esd protection diode o 1 2 0 t railer device leader 10 pitches (min) 10 pitches (min) ....... ....... ....... ....... ....... ....... ....... ....... end start d 1 d 2 d w 1 t c direction of feed reel t aping specification i n d e x h o l e d e f b w p p 0 p 1 a
page 4 comchip t echnology co., l td. rev :a qw -jp013 suggested p ad layout marking code a c b size (inch) 0.031 (mm) 0.80 1.90 2.02 0.075 0.080 sot -23 2.82 0.1 1 1 a b c d part number cpdt -5v0c-hf marking code e05 e05 3 1 2 d smd esd protection diode standard packaging c a s e t y p e 3 , 0 0 0 r e e l ( p c s ) reel size (inch) 7 r e e l p a c k s o t - 2 3
|
