motorola semiconductor technical data ? motorola, inc. 2004 order number: MPXV5050Vc6t1 rev 0, 03/2004 high temperature accuracy integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and calibrated motorola's MPXV5050Vc6t1 sensor in tegrates on-chip, bipolar op amp circuitry and thin film resistor networ ks to provide a high output signal and temperature comp ensation. the small form fact or and high reliability of on- chip integration make the motorola pressure sensor a logical and econom- ical choice for the system designer. the MPXV5050Vc6t1 piezor esistive transdu cer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. this sensor com- bines advanced micromachining techniqu es, thin film metallization, and bi- polar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. figure 1 shows a block diagram of the in ternal circuitry integrated on a pressure sensor chip. features ? 2.5% maximum error over 0 to 85 c ? ideally suited for microprocessor or microcontroller-based systems ? temperature compensated from over -40 to +125 c ? patented silicon shear stress strain gauge ? durable thermoplastic ( pps) surface mount package ? easy-to-use chip carrier option ? ideal for automotive and non-automotive applications typical applications ? vacuum pump monitoring figure 1. fully integrated pressure sensor schematic thin film temperature compensation and gain stage #1 gain stage #2 and ground reference shift circuitry sensing element gnd v out v s pins 1, 5, 6, 7, and 8 are no connects integrated pressure sensor -50 kpa to 0 kpa (-7.25 to 0 psi) 0.1 to 4.6 volts output MPXV5050Vc6t1 case 482a MPXV5050Vc6t1 small outline package note: pins 1, 5, 6, 7, and 8 are internal device connections. do not connect to external circuitry or ground. pin 1 is denoted by the notch in the lead. pin number 1 n/c 5 n/c 2 v s 6 n/c 3 gnd 7 n/c 4 v out 8 n/c f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
MPXV5050Vc6t1 2 motorola sensor device data motorola note: exposure beyond the specified limits may cause permanent damage or degradation to the device. notes: 1. device is ratiometric within this specified excitation range. 2. full scale output (v fso ) is defined as the output voltage at the maximum or full rated pressure. 3. full scale span (v fss ) is defined as the algebraic difference between the output vo ltage at full rated pressure and the output voltage at the minimum rated pressure. 4. accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a perc ent of span at 25 c due to all sources of error including the following: ? linearity: output deviation from a straight line relations hip with pressure over the specified pressure range. ? temperature hysteresis: output deviation at any temperature with in the operating temperature range, after the temperature is cy cled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25 c. ? tcspan: output deviation over the temperature range of 0 to 85 c, relative to 25 c. ? tcoffset: output deviation with minimum pressure applied, over the temperature range of 0 to 85 c, relative to 25 c. 5. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. 6. warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 7. offset stability is the product's output deviation when subjected to 1000 cycles of pulsed pressure, temperature cycling with bias test. 8. offset (v off ) is defined as the output voltage at the minimum rated pressure. table 1. maximum ratings (note) parametrics symbol value units maximum pressure (p1 > p2) p max 200 kpa storage temperature t stg -40 to +125 c operating temperature t a -40 to +125 c table 2. operating characteristics (v s = 5.0 vdc, t a = 25 c unless otherwise noted, p1 > p2.) characteristic symbol min typ max unit pressure range p op -50 - 0 kpa supply voltage (1) v s 4.75 5.0 5.25 vdc supply current i o -7.010madc full scale output (2) (0 to 85 c) @ v s = 5.0 volts (p diff = 0 kpa) v fso 4.488 4.6 4.713 vdc full scale span (3) (0 to 85 c) @ v s = 5.0 volts v fss -4.5-vdc accuracy (4) (0 to 85 c) --- 2.5 %v fss sensitivity v/p - 90 - mv/kpa response time (5) t r -1.0-ms warm-up time (6) --20-ms offset stability (7) -- 0.5 - %v fss pressure offset (8) (0 to 85 c) v off 0 0.1 0.213 vdc f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
MPXV5050Vc6t1 motorola motorola sensor device data 3 figure 4 shows the sensor output signal relative to pressure input. typical minimum and maximum output curves are shown for operation over 0 to 85 c tempera- ture range. the output will sa turate outside of the rated pressure range. a fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. the MPXV5050Vc6t1 pressure se nsor operatin g character- istics, internal reliability and qualification tests are based on use of dry air as the pressure media. media other than dry air may have adverse effects on sensor performance and long-term reliability. co ntact the factory for informa- tion regarding media compatib ility in your application. figure 2. cross sectional diagram sop (not to scale) figure 3. typical application circuit (output source current operation) figure 4. output versus absolute pressure transfer function MPXV5050Vc6t1 0 -10 -20 -30 -40 -50 pressure (kpa) 1 2 3 4 5 0 output voltage (v) transfer function MPXV5050Vc series offset (typ) span range (typ) output range (typ) transfer function: v out = v s x (0.018 x p + 0.92) (pe x tm x 0.018 x v s ) v s = 5.0 0.25 vdc pe = 1.25 tm = 1 temperature = 0 to 85 c max min typical f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
MPXV5050Vc6t1 4 motorola sensor device data motorola ordering information - small outline package device type options case no. mpx series order no. packing options marking ported element vacuum, axial port 482a MPXV5050Vc6t1 tape & reel MPXV5050Vc6t1 transfer function (MPXV5050Vc6t1) nominal transfer value: v out v s 0.018 p 0.92 + () = pressureerror tempmulti 0.018 v s () v s 5.0 0.25v = MPXV5050V break points temp multiplier - 40 3 0 to 85 1 125 3 temperature in c 4.0 3.0 2.0 0.0 1.0 -40 -20 0 20 40 60 140 120 100 80 temperature error factor note: the temperature multiplier is a linear response from 0 c to -40 c and from 85 c to 125 c temperature error band -50 0 pressure (in kpa) pressure error (kpa) pressure error (max) -50 kpa to 0 kpa 1.25 kpa error limits for pressure pressure error band -40 -30 -20 -10 MPXV5050V 1.25 -1.25 0 0.75 1.00 -0.75 -1.00 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
MPXV5050Vc6t1 motorola motorola sensor device data 5 minimum recommended footprin t for small outline package surface mount board layout is a critical portion of the total design. the footprint for the semiconductor pack- age must be the correct size to ensure proper solder con- nection interface between the board and the package. with the correct pad geometry, the packages will self- align when subjected to a solder reflow process. it is al- ways recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between sol- der pads, especially on tight tolerances and/or tight lay- outs. 0.660 16.76 0.060 typ 8x 1.52 0.100 typ 8x 2.54 0.100 typ 2.54 0.300 7.62 inch mm figure 5. sop footprint (case 482a) f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
MPXV5050Vc6t1 6 motorola sensor device data motorola package dimensions pin 1 identifier h seating plane -t- w case 482a-01 issue a c m j k v dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 12.70 0.520 0.500 13.21 d 0.96 0.042 0.038 1.07 g 0.100 bsc 2.54 bsc h 0.002 0.010 0.05 0.25 j 0.009 0.011 0.23 0.28 k 0.061 0.071 1.55 1.80 m 0? 7? 0? 7? n 0.444 0.448 11.28 11.38 s 0.709 0.725 18.01 18.41 v 0.245 0.255 6.22 6.48 w 0.115 0.125 2.92 3.17 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5? typical draft. s d 8 pl g 4 5 8 1 s b m 0.25 (0.010) a t -a- -b- n s f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
MPXV5050Vc6t1 motorola motorola sensor device data 7 notes f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
how to reach us: usa/europe/locations not listed: japan: motorola japan ltd.; sps, technical information center motorola literature distribution 3-20-1 mi nami-azabu. minato-ku, tokyo 106-8573, japan p.o. box 5405, denver, colorado 80217 81-3-3440-3569 1-800-521-6274 or 480-768-2130 asia/pacific: motorola semiconductors h.k. ltd.; silicon harbour centre 2 dai king street, tai po industrial estate, tai po, n.t., hong kong 852-26668334 home page: http://motorola.com/semiconductors MPXV5050Vc6t1 information in this document is provided solely to enable system and software implementers to use motorola products. there are no express or implied copyright licenses granted hereunder to desi gn or fabricate any integrated circuits or integrated circuits based on the informa tion in this document. motorola reserves the right to make changes without further notic e to any products herein. motorola makes no warranty, represen tation or guarantee regarding the suitability of its products for any particular purp ose, nor does motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, in cluding without limitation consequential or incidental damages. ?typical? parameters which may be provided in motorola data sheets and/or spec ifications can and do vary in different applications and actual performance may var y over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. motorola does not convey any license under its patent rights nor the rights of others. motorola products are not designed, intended, or authorized for use as compon ents in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the motorola product could create a situation where personal injury or death may occur. should buyer purchase or use motorola products for any such unintended or unauthorized application, buyer shall indemnify and hold motorola and its officers, employees, s ubsidiaries, affiliates, and di stributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of persona l injury or death associated with such unintended or unauthorized use, even if such claim alleges that motorola was negligent regarding the design or manufa cture of the part. motorola and the stylized m logo are registered in the us patent and trademark office. all other product or service names are t he property of their respective owners. ? motorola, inc. 2004 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
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