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  164 power f-mos fets unit: mm 2SK2571 silicon n-channel power f-mos fet  features  avalanche energy capacity guaranteed  high-speed switching  low on-resistance  no secondary breakdown  applications  contactless relay  diving circuit for a solenoid  driving circuit for a motor  control equipment  switching power supply 1: gate 2: drain 3: source top-3e-a1 package  electrical characteristics (t c = 25c) parameter drain to source cut-off current gate to source leakage current drain to source breakdown voltage gate threshold voltage drain to source on-resistance forward transfer admittance diode forward voltage input capacitance (common source) output capacitance (common source) reverse transfer capacitance (common source) turn-on time fall time turn-off time (delay time) thermal resistance between channel and case thermal resistance between channel and atmosphere symbol i dss i gss v dss v th r ds(on) | y fs | v dsf c iss c oss c rss t on t f t d(off) r th(ch-c) r th(ch-a) conditions v ds = 360v, v gs = 0 v gs = 30v, v ds = 0 i d = 1ma, v gs = 0 v ds = 25v, i d = 1ma v gs = 10v, i d = 7a v ds = 25v, i d = 7a i dr = 13a, v gs = 0 v ds = 20v, v gs = 0, f = 1mhz v dd = 150v, i d = 7a v gs = 10v, r l = 21.4 ? min 450 2 5 typ 0.34 8 1700 300 120 110 90 220 max 100 1 5 0.45 ? 2 1.25 41.67 unit a a v v ? s v pf pf pf ns ns ns c/w c/w  absolute maximum ratings (t c = 25c) parameter drain to source breakdown voltage gate to source voltage drain current avalanche energy capacity allowable power dissipation channel temperature storage temperature dc pulse t c = 25c ta = 25c symbol v dss v gss i d i dp eas * p d t ch t stg ratings 450 30 13 26 200 100 3 150 ? 55 to +150 unit v v a a mj w c c * l = 2.4mh, i l = 13a, 1 pulse 15.5 0.5 3.0 0.3 (4.0) 2.0 0.2 1.1 0.1 5.45 0.3 0.7 0.1 5 5 5 5 5 10.9 0.5 1 5 23 (10.0) (1.2) (2.0) solder dip 3.3 0.3 5.5 0.3 (2.0) 26.5 0.5 (23.4) 22.0 0.5 18.6 0.5 (2.0) 3.2 0.1 (4.5)
165 power f-mos fets 2SK2571 area of safe operation (aso) p d ? ta ias ? l-load i d ? v gs v th ? t c r ds(on) ? i d v ds ? v gs | y fs | ? i d c iss , c oss , c rss ? v ds 10 1 11010 2 10 3 10 1 10 2 10 1 non repetitive pulse t c =25 ? c t=1ms 10ms 100ms dc i d i dp drain to source voltage v ds ( v ) drain current i d ( a ) 0 160 40 120 80 140 20 100 60 0 120 100 80 60 40 20 (1) t c =ta (2) without heat sink p d =3.0w (1) (2) ambient temperature ta ( ? c ) allowable power dissipation p d ( w ) 10 1 11010 2 10 1 10 2 10 1 e=200mj t c =25 ? c l-load ( mh ) avalanche current ias ( a ) 010 8 26 4 0 30 25 20 15 10 5 v ds =25v t c =25 ? c gate to source voltage v gs ( v ) drain current i d ( a ) 0 150 125 100 25 75 50 0 6 5 4 3 2 1 v ds =25v i d =1ma case temperature t c ( ? c ) gate threshold voltage v th ( v ) 025 20 515 10 0 1.2 1.0 0.8 0.6 0.4 0.2 t c =25 ? c v gs =10v 15v drain current i d ( a ) drain to source on-resistance r ds(on) ( ? ) 030 25 20 515 10 0 35 30 10 25 20 5 15 t c =25 ? c i d =26a 13a 6.5a 3.25a gate to source voltage v gs ( v ) drain to source voltage v ds ( v ) 025 20 515 10 0 20 15 5 10 v ds =25v t c =25 ? c drain current i d ( a ) forward transfer admittance |y fs | ( s ) 0 250 200 50 150 100 10 10000 1000 100 30 300 3000 f=1mhz t c =25 ? c c iss c oss c rss drain to source voltage v ds ( v ) input capacitance ( common source ) , output capacitance ( common source ) , reverse transfer capacitance ( common source ) c iss ,c oss ,c rss ( pf )
166 power f-mos fets 2SK2571 t on , t f , t d(off) ? i d v ds , v gs ? q g r th(t) ? t 0 100 80 20 60 40 0 300 250 200 150 100 50 0 12 10 8 6 4 2 i d =13a v ds v gs gate to source voltage v gs ( v ) gate charge amount q g ( nc ) drain to source voltage v ds ( v ) 10 3 10 2 10 2 1 10 1 10 10 3 10 2 10 1 1 10 10 2 note: r th was measured at ta=25 ? c and under natural convection. (1) without heat sink (2) with a 100 100 2mm al heat sink (1) (2) time t ( s ) thermal resistance r th (t) ( ? c/w ) 020 10 8 26 4 0 300 250 200 150 100 50 v dd =150 v gs =10v t c =25 ? c t d(off) t on t f drain current i d ( a ) switching time t on ,t f ,t d(off) ( ns )
please read the following notes before using the datasheets a. these materials are intended as a reference to assist customers with the selection of panasonic semiconductor products best suited to their applications. due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. b. panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. therefore, panasonic will not assume any liability for any damages arising from any errors etc. that may ap- pear in this material. c. these materials are solely intended for a customer's individual use. therefore, without the prior written approval of panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the internet or in any other way, is prohibited. request for your special attention and precautions in using the technical information and semiconductors described in this material (1) an export permit needs to be obtained from the competent authorities of the japanese govern- ment if any of the products or technologies described in this material and controlled under the "foreign exchange and foreign trade law" is to be exported or taken out of japan. (2) the technical information described in this material is limited to showing representative character- istics and applied circuit examples of the products. it does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) the products described in this material are intended to be used for standard applications or gen- eral electronic equipment (such as office equipment, communications equipment, measuring in- struments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (4) the products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. at the final stage of your design, purchas- ing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the guaranteed values, in particular those of maxi- mum rating, the range of operating power supply voltage and heat radiation characteristics. other- wise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) when using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) no part of this material may be reprinted or reproduced by any means without written permission from our company. 2001 mar


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