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| 1989 data sheet bipolar analog integrated circuit m pc393 low power dual comparators description the m pc393 is a dual comparator which is designed to operate from a single power supply over a wide range of voltage. operation from split power supplies is also possible and the power supply current drain is very low. further advantage, the input common-mode voltage in- cludes ground, even though operated from a single power supply voltage. document no. g11766ej3v0ds00 (3rd edition) (previous no. ic-1971) date published april 1997 n printed in japan features ? common-mode input voltage range includes v C ? wide supply voltage range 2 v to 32 v (single) 1 v to 16 v (split) ? low supply current ? open collector output equivalent circuit (1/2 circuit) pin configuration (top view) the mark shows major revised points. the information in this document is subject to change without notice. ordering inforamtion part number package m pC393C 8-pin plastic dip (300 mil) m pc393g2 8-pin plastic sop (225 mil) m pc393ha 9-pin plastic slim sip 100 a 100 a m m v + v out q 8 q 7 q 6 q 5 q 2 q 1 q 3 q 4 i n i i + out 1 i1 i n1 i v 1 2 3 4 8 7 6 5 v out 2 i i + i2 n2 pC393C, 393g2 1 123456789 v + 1 i1 i n1 i v i n2 i i2 2 v out out ? 1 pc393ha 2 + 2 m m + + +
m pc393 2 absolute maximum ratings (t a = 25 c) parameter symbol ratings unit voltage between v + and v C note 1 v + Cv C C0.3 to +36 v differential input voltage v id 36 v input voltage note 2 v i v C C0.3 to v C +36 v output voltage note 3 v o v C C0.3 to v C +36 v power dissipation c package note 4 p t 350 mw g2 package note 5 440 mw ha package note 4 350 mw output short circuit duration note 6 indefinite sec operating ambient temperature t a C20 to +80 c storage temperature t stg C55 to + 125 c notes 1. reverse connection of supply voltage can cause destruction. 2. the input voltage should be allowed to input without damage or destruction independent of the magnitude of v + . either input signal should not be allowed to go negative by more than 0.3 v. the normal operation will establish when any input is within the common mode input voltage range of electrical characteristics. 3. this specification is the voltage which should be allowed to supply to the output terminal from external without damage or destruction independent of the magnitude of v + . even during the transition period of supply voltage, power on/off etc., this specification should be kept. 4. thermal derating factor is C5.0 mw/ c when operating ambient temperature is higher than 55 c. 5. thermal derating factor is C4.4 mw/ c when operating ambient temperature is higher than 25 c. 6. short circuits from the output to v + can cause destruction. pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, note 4 and note 5. recommended operating conditions parameter symbol min. typ. max. unit supply voltage (split) v 1 16 v supply voltage (v C = gnd) v + +2 +32 v m pc393 3 electrical characteristics (t a = 25 c, v + = 5 v, v C = gnd) parameter symbol conditions min. typ. max. unit input offset voltage v io v o = 1.4 v, v ref = 1.4 v, r s = 0 w 2 5mv input offset current i io v o = 1.4 v 5 50 na input bias current i b v o = 1.4 v 25 250 na voltage gain a v r l = 15 k w 200 v/mv supply current i cc r l = , i o = 0 a, both comparators 0.6 1 ma common mode lnput voltage range v icm 0v + C1.5 v output saturation voltage v ol v in (C) = 1 v, v in (+) = 0 v, i o sink = 4 ma 0.2 0.4 v output sink current i o sink v in (C) = 1 v, v in (+) = 0 v, v o 1.5 v 6 16 ma output leakage current i o leak v in (+) = 1 v, v in (C) = 0 v, v o = 5 v 0.1 na response time r l = 5.1 k w , v rl = 5 v 1.3 m s m pc393 4 + r l out 1, 7 4 8 v in v ref 2, 6 3, 5 v + v ref : v to v + ?.5 (v) v + v rl v in r 1 r 2 v ref out r l + comparator with hysteresis circuit application circuit example threshold voltage v th (high) = v ref + (v rl ?v ref ) v th (low) = v ref ? (v ref ?v ol ) ( v rl > v ref > v ol ) r 1 r l + r 2 + r 1 r 1 r 1 + r 2 m pc393 5 typical performance characteristics (t a = 25 c, typ.) 3 2 1 0 ? ? 0 input offset voltage 40 20 ?0 ?0 ? 60 80 v + = +5 v v = gnd t a - operating ambient temperature - ? v io - input offset voltage - mv v ol - output saturation voltage - v 50 40 30 20 10 0 10203040 i b - input bias current - na t a = 0 ? t a = 25 ? t a = 70 ? v + - supply voltage - v (v = gnd) input bias current 10 1 0.1 0.01 0.001 0.01 0.1 1 10 100 t a = 70 ? t a = 25 ? t a = 0 ? output saturation voltage i o sink - output sink current - ma 500 0 t a - operating ambient temperature - ? p t - total dissipation - mw power dissipation 400 300 200 100 20 40 60 80 100 393g2 393c, 1.0 0 supply current 0.8 0.6 0.4 10 40 t a = 0 ? t a = 25 ? t a = 70 ? r l = 20 30 393ha i o = 0a i cc - supply current - ma v + - supply voltage - v (v = gnd) m pc393 6 5 4 3 2 1 0 0 ?0 ?00 0 0.5 1.0 1.5 2.0 t - time - s m response time for various input overdrives i response time for various input overdrives ii v in - input voltage - mv v o - output voltage - v t - time - s m v in - input voltage - mv v o - output voltage - v +5 v 5.1 k w v o v in t a = 25 ? 5.0 mv input overdrive 20 mv 100 mv 5 4 3 2 1 0 100 50 0 0 0.5 1.0 1.5 2.0 +5 v v o 5.1 k w v in t a = 25 ? 5 mv 20 mv + + 100 mv input overdrive m pc393 7 8pin plastic dip (300 mil) item millimeters inches notes 1) each lead centerline is located within 0.25 mm (0.01 inch) of its true position (t.p.) at maximum material condition. p8c-100-300b,c-1 n 0.25 0.01 p 0.9 min. 0.035 min. r 0~15 0~15 a 10.16 max. 0.400 max. b 1.27 max. 0.050 max. f 1.4 min. 0.055 min. g 3.2?.3 0.126?.012 j 5.08 max. 0.200 max. k 7.62 (t.p.) 0.300 (t.p.) c 2.54 (t.p.) 0.100 (t.p.) d 0.50?.10 0.020 +0.004 ?.005 h 0.51 min. 0.020 min. i 4.31 max. 0.170 max. l 6.4 0.252 m 0.25 0.010 +0.004 ?.003 +0.10 ?.05 2) ltem "k" to center of leads when formed parallel. 14 85 m a r m p i j h g f dn c b l k package drawings m pc393 8 8 pin plastic sop (225 mil) a m c d f note each lead centerline is located within 0.12 mm (0.005 inch) of its true position (t.p.) at maximum material condition. 85 1 4 m e g b p h i j k l n detail of lead end item millimeters inches a b c e f g h i j 5.37 max. 1.27 (t.p.) 1.8 max. 1.49 6.5?.3 0.78 max. 0.12 1.1 4.4 m 0.1?.1 n 0.212 max. 0.031 max. 0.004?.004 0.071 max. 0.059 0.256?.012 0.173 0.043 0.005 0.050 (t.p.) s8gm-50-225b-4 p3 3 +7 d 0.40 0.016 +0.10 ?.05 k 0.15 0.006 +0.10 ?.05 l 0.6?.2 0.024 0.10 ? +7 ? 0.004 +0.008 ?.009 +0.004 ?.002 +0.004 ?.003 m pc393 9 note each lead centerline is located within 0.25 mm (0.01 inch) of its true position (t.p.) at maximum material condition. 9 pin plastic slim sip p9ha-254b-1 item millimeters inches a c f g h j k m n q 22.86 max. 0.5?.1 1.27 max. 0.51 min. 5.08 max. 1.1 min. u v 3.2?.5 0.25 5.75 max. 2.8?.2 1.5 max. y 0.25 2.54 0.900 max. 0.043 min. 0.010 0.100 0.050 max. 0.020 min. 0.200 max. 0.11 0.227 max. 0.059 max. 0.01 0.126?.02 +0.004 ?.003 0.02 +0.10 ?.05 +0.004 ?.005 +0.009 ?.008 1.1 min. z 0.043 min. k f g m c z h j v u 19 q n y m a m pc393 10 recommended soldering conditions when soldering this product, it is highly recommended to observe the conditions as shown below. if other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. for more details, refer to our document semiconductor device mounting technology manual (c10535e) . type of surface mount device m pc393g2: 8-pin plastic sop (225 mil) process conditions symbol infrared ray reflow peak temperature: 230 c or below (package surface temperature), ir30-00-1 reflow time: 30 seconds or less (at 210 c or higher), maximum number of reflow processes: 1 time. vapor phase soldering peak temperature: 215 c or below (package surface temperature), vp15-00-1 reflow time: 40 seconds or less (at 200 c or higher), maximum number of reflow processes: 1 time. wave soldering solder temperature: 260 c or below, flow time: 10 seconds or less, ws60-00-1 maximum number of flow processes: 1 time, pre-heating temperature: 120 c or below (package surface temperature). partial heating method pin temperature: 300 c or below, C heat time: 3 seconds or less (per each side of the device). caution apply only one kind of soldering condition to a device, except for partial heating method, or the device will be damaged by heat stress. type of through-hold device m pC393C : 8-pin plastic dip (300 mil) m pd393ha : 9-pin plastic slim sip process conditions wave soldering solder temperature: 260 c or below, (only to leads) flow time: 10 seconds or less. partial heating method pin temperature: 300 c or below, heat time: 3 seconds or less (per each lead.) caution for through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. m pc393 11 reference documents quality grades on nec semiconductor devices c11531e semiconductor device mounting technology manual c10535e ic package manual c10943x guide to quality assuarance for semiconductor devices mei-1202 semiconductors selection guide x10679e nec semiconductor device reliability/ iei-1212 quality control system - standard linear ic m pc393 2 [memo] no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec corporation. nec corporation assumes no responsibility for any errors which may appear in this document. nec corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. no license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec corporation or others. while nec corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. to minimize risks of damage or injury to persons or property arising from a defect in an nec semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. nec devices are classified into the following three quality grades: "standard", "special", and "specific". the specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. the recommended applications of a device depend on its quality grade, as indicated below. customers must check the quality grade of each device before using it in a particular application. standard: computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots special: transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) specific: aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. the quality grade of nec devices is "standard" unless otherwise specified in nec's data sheets or data books. if customers intend to use nec devices for applications other than those specified for standard quality grade, they should contact an nec sales representative in advance. anti-radioactive design is not implemented in this product. m4 96.5 the application circuits and their parameters are for reference only and are not intended for use in actual design-ins. |
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