gdz5v1lp3 - gdz8v2lp3 document number: ds35065 rev. 12 - 2 1 of 4 www.diodes.com february 2012 ? diodes incorporated gdz5v1lp3 - gdz8v2lp3 advance information ultra-small leadless surface mount zener diode features ? ultra-small leadless surface mount package (0.6 x 0.3mm) ? ultra-low profile package (0.3mm) ? ideally suited for automated assembly processes ? low leakage current, suitable for battery-powered applications ? lead free by design/rohs compliant (note 1) ? halogen and antimony free "green" device (notes 2 & 3) ? qualified to aec-q101 standards for high reliability mechanical data ? case: x3-dfn0603-2 ? case material: molded plastic, ?green? molding compound. ul flammability classification rating 94v-0 ? moisture sensitivity: level 1 per j-std-020 ? terminal connections: cathode bar ? terminals: finish ? matte tin over copper leadframe. solderable per mil-std-202, method 208 ? weight: 0.2 mg (approximate) ordering information (note 4) part number case packaging (type number)-7* x3-dfn0603-2 10,000/tape & reel *add ?-7? to the appropriate type number in electrical char acteristics table. example: 6.2v zener = gdz6v2lp3-7. notes: 1. fully eu directive 2002/95/ec (r ohs) & 2011/65/eu (rohs 2) compliant. no purposely added lead. halogen and antimony f ree 2. halogen and antimony free "green? products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm to tal br + cl) and <1000ppm antimony compounds. 3. diodes inc.'s "green" policy can be found on our website at http://www.diodes.com. 4. for packaging details, go to our website at http://www.diodes.com. marking information xx = product type marking code (see electrical characteristics table) line denotes cathode side top view bottom view
gdz5v1lp3 - gdz8v2lp3 document number: ds35065 rev. 12 - 2 2 of 4 www.diodes.com february 2012 ? diodes incorporated gdz5v1lp3 - gdz8v2lp3 advance information thermal characteristics characteristic symbol value unit power dissipation (note 5) t a = 25c p d 250 mw thermal resistance, junction to ambient air (note 5) t a = 25c r ja 500 c/w operating and storage temperature range t j, t stg -55 to +150 c electrical characteristics @t a = 25c unless otherwise specified type number marking code zener voltage range (note 6) maximum reverse current (note 6) v z @ i zt i zt i r @ v r nom (v) min (v) max (v) ma ua v gdz5v1lp3 km 5.1 4.840 5.370 5 0.2 2.0 gdz5v6lp3 kn 5.6 5.310 5.920 5 1.0 2.5 gdz6v0lp3 kw 6.0 5.676 6.324 5 1.0 2.8 gdz6v2lp3 ko, ks 6.2 5.860 6.530 5 1.0 3.0 gdz6v8lp3 kt 6.8 6.470 7.140 5 0.5 3.5 GDZ7V5LP3 kq 7.5 7.060 7.840 5 0.5 4.0 gdz8v2lp3 kx 8.2 7.760 8.640 5 0.5 5.0 notes: 5. device mounted on fr-4 pcb with minimum recommended pad layout, as shown in diodes incorporated?s suggested pad layou t document, which can be found on our website at http://www.diodes.com. 6. short duration pulse test used to minimize self-heating effect. 0 0.05 0.10 0.15 0.20 0.25 0.30 0 25 50 75 100 125 150 t , ambient temperature (c) fig. 1 power derating curve a p , p o we r dissi p a t i o n (w) d note 5 0.2 0.4 0.6 0.8 1.0 1.2 i , ins t an t ane o u s f o r wa r d c u r r en t (ma) f 0.01 0.1 1 10 100 1,000 v , instantaneous forward voltage (v) fig. 2 typical forward characteristics f
gdz5v1lp3 - gdz8v2lp3 document number: ds35065 rev. 12 - 2 3 of 4 www.diodes.com february 2012 ? diodes incorporated gdz5v1lp3 - gdz8v2lp3 advance information 0 5 10 15 20 0246810 v , zener voltage (v) fig. 3 typical zener breakdown characteristics z i , zener current (ma) z 8v2lp3 5v1lp3 7v5lp3 6v2lp3 6v8lp3 1 10 100 1.5 2 2.5 v , instantaneous reverse voltage (v) fig. 4 typical reverse characteristics - gdz5v1lp3 r i, ins t an t ane o u s r eve r se c u r r en t (na) r 0 5 10 15 20 01 2345 v , reverse voltage (v) r fig. 5 typical total capacitance c , t o t al c a p a c i t a n c e (pf) t f = 1mhz package outline dimensions x3-dfn0603-2 dim min max typ a 0.27 0.35 0.30 a1 0.00 0.03 0.02 b 0.19 0.29 0.24 d 0.595 0.645 0.62 e 0.295 0.345 0.32 e - - 0.355 l 0.14 0.24 0.19 all dimensions in mm l (2x) e b (2x) d a1 (2x) a e
gdz5v1lp3 - gdz8v2lp3 document number: ds35065 rev. 12 - 2 4 of 4 www.diodes.com february 2012 ? diodes incorporated gdz5v1lp3 - gdz8v2lp3 advance information suggested pad layout important notice diodes incorporated makes no warranty of any kind, express or implied, with regards to this document, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose (and their equivalents under the laws of any jurisdiction). diodes incorporated and its subsidiaries rese rve the right to make modifications, enhanc ements, improvements, corrections or ot her changes without further notice to this document and any product descri bed herein. diodes incorporated does not assume any liability arising out of the application or use of this document or an y product described herein; neither does di odes incorporated convey any license under its patent or trademark rights, nor the rights of others. any customer or us er of this document or products described herein in such applica tions shall assume all risks of such use and will agree to hold diodes incorporated and all the companies whose products are represented on diodes incorporated website, harmless against all damages. diodes incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthoriz ed sales channel. should customers purchase or use diodes inco rporated products for any unintended or una uthorized application, customers shall i ndemnify and hold diodes incorporated and its representativ es harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death a ssociated with such unintended or unauthorized application. products described herein may be covered by one or more united states, international or foreign patents pending. product names and markings noted herein may also be covered by one or more united states, international or foreign trademarks. life support diodes incorporated products are specifically not authorized for use as critical component s in life support devices or systems without the express written approval of the chief executive offi cer of diodes incorporated. as used herein: a. life support devices or syst ems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. b. a critical component is any component in a life support devic e or system whose failure to perform can be reasonably expect ed to cause the failure of the life support device or to affect its safety or effectiveness. customers represent that they have all necessary expertise in the safety and regulatory ramifi cations of their life support dev ices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-rel ated requirements concerning the ir products and any use of diodes incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or s ystems-related information or support that may be provided by diodes incorporated. further, customers must fully indemnify diodes incorporate d and its representatives against any damages arisi ng out of the use of diodes incorporated pr oducts in such safety-critical, life suppor t devices or systems. copyright ? 2012, diodes incorporated www.diodes.com dimensions value (in mm) c 0.355 x 0.230 y 0.300 z 0.610 z y (2x) x (2x) c
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