tsm2311 20v p-channel mosfet 1/6 version: b11 sot - 23 features advance trench process technology high density cell design for ultra low on-resistan ce application load switch pa switch ordering information part no. package packing tsm2311cx rf sot-23 3kpcs / 7 reel tsm2311cx rfg sot-23 3kpcs / 7 reel note: g denotes halogen free product. absolute maximum rating (ta = 25 o c unless otherwise noted) parameter symbol limit unit drain-source voltage v ds -20 v gate-source voltage v gs 8 v continuous drain current, v gs @ 4.5v. i d -4 a pulsed drain current, v gs @ 4.5v i dm -20 a continuous source current (diode conduction) a,b i s -0.72 a maximum power dissipation ta = 25 o c p d 0.9 w ta = 75 o c 0.57 operating junction temperature t j +150 o c operating junction and storage temperature range t j , t stg - 55 to +150 o c thermal performance parameter symbol limit unit lead temperature (1/8 from case) t l 5 s junction to ambient thermal resistance (pcb mounted ) r ? ja 250 o c/w notes: a. pulse width limited by the maximum junction temp erature b. surface mounted on fr4 board, t 5 sec. c. surface mounted on fr4 board, product summary v ds (v) r ds(on) (m ) i d (a) -20 55 @ v gs = -4.5v -4.0 85 @ v gs = -2.5v -2.5 pin definition : 1. gate 2. source 3. drain block diagram p-channel mosfet
tsm2311 20v p-channel mosfet 2/6 version: b11 electrical specifications (ta = 25 o c unless otherwise noted) parameter conditions symbol min typ max unit static drain-source breakdown voltage v gs = 0v, i d = -250ua bv dss -20 -- -- v gate threshold voltage v ds = v gs , i d = -250a v gs(th) -0.6 -- -1.4 v gate body leakage v gs = 8v, v ds = 0v i gss -- -- 100 na zero gate voltage drain current v ds = -16v, v gs = 0v i dss -- -- -1.0 a on-state drain current a v ds -10v, v gs = -5v i d(on) -6 -- -- a drain-source on-state resistance a v gs = -4.5v, i d = -4a r ds(on) -- 45 55 m v gs = -2.5v, i d = -2.5a -- 75 85 forward transconductance a v ds = -5v, i d = -4a g fs -- 9 -- s diode forward voltage i s = -0.75a, v gs = 0v v sd -- - 0.8 -1.2 v dynamic b total gate charge v ds = -6v, i d = -4a, v gs = -4.5v q g -- 6 9 nc gate-source charge q gs -- 1.4 -- gate-drain charge q gd -- 1.9 -- input capacitance v ds = -6v, v gs = 0v, f = 1.0mhz c iss -- 640 -- pf output capacitance c oss -- 180 -- reverse transfer capacitance c rss -- 90 -- switching c turn-on delay time v dd = -6v, r l = 6 , i d = -1a, v gen = -4.5v, r g = 6 t d(on) -- 22 35 ns turn-on rise time t r -- 35 55 turn-off delay time t d(off) -- 45 70 turn-off fall time t f -- 25 50 notes: a. pulse test: pw 300s, duty cycle 2% b. for design aid only, not subject to production t esting. b. switching time is essentially independent of ope rating temperature.
tsm2311 20v p-channel mosfet 3/6 version: b11 electrical characteristics curve (ta = 25 o c, unless otherwise noted) output characteristics transfer characteristics on-resistance vs. drain current gate charge on-resistance vs. junction temperature source-drain diode forward voltage
tsm2311 20v p-channel mosfet 4/6 version: b11 electrical characteristics curve (ta = 25 o c, unless otherwise noted) on-resistance vs. gate-source voltage threshold voltage single pulse power normalized thermal transient impedance, junction-to -ambient
tsm2311 20v p-channel mosfet 5/6 version: b11 sot-23 mechanical drawing marking diagram 11 = device code y = year code m = month code ( a =jan, b =feb, c =mar, d =apl, e =may, f =jun, g =jul, h =aug, i =sep, j =oct, k =nov, l =dec) = month code for halogen free product ( o =jan, p =feb, q =mar, r =apl, s =may, t =jun, u =jul, v =aug, w =sep, x =oct, y =nov, z =dec) l = lot code sot-23 dimension dim millimeters inches min max min max. a 0.95 bsc 0.037 bsc a1 1.9 bsc 0.074 bsc b 2.60 3.00 0.102 0.118 c 1.40 1.70 0.055 0.067 d 2.80 3.10 0.110 0.122 e 1.00 1.30 0.039 0.051 f 0.00 0.10 0.000 0.004 g 0.35 0.50 0.014 0.020 h 0.10 0.20 0.004 0.008 i 0.30 0.60 0.012 0.024 j 5o 10o 5o 10o
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