data sheet doc. no : qw0905-LDBK42743-J rev. : a date : 22 - oct. -2005 tower type led lamps LDBK42743-J ligitek electronics co.,ltd. property of ligitek only
25.0min 1.0min 2.54typ 0.5 typ 1.5max 3.62 + - 2.95 2.35 2.92 3.86 30 0 -30 50%75% 0 25% 25% -60 100%75% 50% 100% 60 note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation package dimensions ligitek electronics co.,ltd. property of ligitek only LDBK42743-J part no. page 1/4
-30 ~ +100 -20 ~ +80 2/4 page unit ma ma mw v " " # a dbk ratings 100 120 1000 50 ir 30 ligitek electronics co.,ltd. property of ligitek only 30 viewing angle 2 $ 1/2 (deg) max 260 " for 5 sec max (2mm from body) min. 900 20 typ. 3.5 forward voltage @ ma(v) max. 4.0 dominant wave length % dnm spectral halfwidth &% nm 30 typ. luminous intensity @20ma(mcd) 1600 part no. parameter power dissipation storage temperature reverse current @5v operating temperature electrostatic discharge( * ) forward current peak forward current duty 1/10@10khz soldering temperature emitted blue part no LDBK42743-J material ingan/gan lens color note : 1.the forward voltage data did not including ! 0.1v testing tolerance. 2. the luminous intensity data did not including ! 15% testing tolerance. absolute maximum ratings at ta=25 " i fp pd i f tstg t opr tsol esd symbol typical electrical & optical characteristics (ta=25 " ) water clear LDBK42743-J 470 static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. *
fig.5 relative intensity vs. wavelength typical electro-optical characteristics curve ligitek electronics co.,ltd. property of ligitek only 1.03.04.0 0 1 1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 450 0.0 400500550 0.5 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 20 ambient temperature( ) ambient temperature( ) 0 -20 -40 0.8 0 -40-20 100 80 60 40 20 0.0 60100 80 40 fig.4 relative intensity vs. temperature 2.5 1.0 0.9 1.1 1.5 1.0 2.0 fig.3 forward voltage vs. temperature 1.2 3.0 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a f o r w a r d c u r r e n t ( m a ) forward current(ma) forward voltage(v) 2.05.0110 0.0 0.5 1.0 1.5 2.0 1001000 fig.2 relative intensity vs. forward current fig.1 forward current vs. forward voltage 2.5 3.0 1 10 100 1000 dbk chip part no. page3/4 LDBK42743-J
part no. page 4/4 ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description test condition test item reliability test: 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. low temperature storage test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. solder resistance test thermal shock test high temperature high humidity test 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hous. this test intended to see soldering well performed or not. LDBK42743-J
|
