doc. no : qw0905-la218b/xgx rev. : a date : 22 - feb - 2005 led array data sheet la218b/xgx ligitek electronics co.,ltd. property of ligitek only
ligitek electronics co.,ltd. property of ligitek only note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without not ice. lg2340-1 package dimensions part no. la218b/xgx page 1/4 25.0min 3.0 1.0min 0.5 typ 2.54typ 1.5max 5.0 0.3 ?? 0.5 typ. 5.08 2.54 3.50.5 2.54typ. + - 4.45 15.25 9.390.5 13.95 x g x
green diffused lens color note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. absolute maximum ratings at ta=25 j i fp pd i f ir tstg t opr tsol symbol typical electrical & optical characteristics (ta=25 j ) material part no gap la218b/xgx green emitted power dissipation storage temperature soldering temperature reverse current @5v operating temperature forward current peak forward current duty 1/10@10khz parameter ligitek electronics co.,ltd. property of ligitek only typ. luminous intensity @10ma(mcd) spectral halfwidth ??f nm peak wave length f pnm forward voltage @20ma(v) 565 max. min. min. viewing angle 2 c 1/2 (deg) mw 100 -40 ~ +100 max 260 j for 5 sec max (2mm from body) -40 ~ +85 10 j j g a ratings 120 30 g ma ma unit page 2/4 30 2.6 1.7 8.0 20 80 part no. la218b/xgx
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( j ) relative intensity@20ma wavelength (nm) forward voltage@20ma normalize @25 j fig.4 relative intensity vs. temperature ambient temperature( j ) relative intensity@20ma normalize @25 j typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) page forward current(ma) fig.2 relative intensity vs. forward current relative intensity normalize @20ma ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 500 550 600 650 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip 3/4 part no. la218b/xgx
ligitek electronics co.,ltd. property of ligitek only mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec solderability test this test intended to see soldering well performed or not. mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 jis c 7021: b-12 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 the purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. high temperature storage test 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles 1.ta=65 j? 5 j 2.rh=90 %~95% 3.t=240hrs ? 2hrs 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. thermal shock test solder resistance test high temperature high humidity test low temperature storage test the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hous. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. test condition 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) reliability test: test item operating life test this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. description reference standard page 4/4 part no. la218b/xgx
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