doc. no : qw0905-la46b/eg-s9-pf rev. : a date : 18 - apr.- 2007 data sheet ligitek electronics co.,ltd. property of ligitek only led array la46b/eg-s9-pf pb lead-free parts
note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. leg3392/r2-pf part no. la46b/eg-s9-pf package dimensions page 1/6 ligitek electronics co.,ltd. property of ligitek only 10.5 0.5 8.6 7.6 0.5 typ 18.0min 1 2 3 2.54typ 2.54typ 2.0min 2.0min 1.5max 5.9 5.0 g 2 1 3 e 1.anode orange 2.common cathode 3.anode green 0.5 typ 6.3 0.5 1 2 3 7.6 7.6 1.anode orange 2.common cathode 3.anode green e + - + g 2.54typ 2.0min 2.54typ 7.25 0.5 9.5 7.1 2 3 1 2.0min 5.0
-40 ~ +100 tstg storage temperature viewing angle 2 1/2 (deg) spectral halfwidth nm peak wave length pnm material part no la46b/eg-s9-pf note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. 565 gap green orange emitted gaasp/gap white diffused 635 lens 70 20 8.0 2.6 1.7 30 20 typ. 451.72.68.0 min.max.min. 70 typical electrical & optical characteristics (ta=25 ) color luminous intensity @10ma(mcd) forward voltage @20ma(v) page 2/6 forward current absolute maximum ratings at ta=25 power dissipation reverse current @5v operating temperature peak forward current duty 1/10@10khz 30 ma i f t opr ir pd i fp -40 ~ +85 10 a 100 120 mw ma parameter e symbol ratings g unit ligitek electronics co.,ltd. property of ligitek only 30 120 100 10 part no. la46b/eg-s9-pf
1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a 0.0 0.5 wavelength (nm) 550600650 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 -20 -40 0.8 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 -20 ambient temperature( ) 80 60 40 20 0-40 100 0.0 80 60 02040100 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 100 f o r w a r d c u r r e n t ( m a ) 0.1 1.0 10 1.0 1000 e chip r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 0.5 forward voltage(v) 2.03.04.05.01.0 0.0 1.5 1.0 2.0 2.5 forward current(ma) 101001000 fig.2 relative intensity vs. forward current 3.0 ligitek electronics co.,ltd. property of ligitek only 700750 page 3/6 part no. la46b/eg-s9-pf
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip page 4/6 part no. la46b/eg-s9-pf
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) 120 25 time(sec) 150 50 100 preheat 0 60 seconds max 2 /sec max 0 260 temp( c) 5 /sec max 260 c3sec max page 5/6 soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to case) 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. part no. la46b/eg-s9-pf
1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=230 5 2.dwell time=5 1sec 1.t.sol=260 5 2.dwell time= 10 1sec. solderability test solder resistance test thermal shock test high temperature high humidity test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to see soldering well performed or not. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 the purpose of this test is the resistance of the device under tropical for hours. mil-std-202:103b jis c 7021: b-11 test condition 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature storage test low temperature storage test operating life test reliability test: test item this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. mil-std-883:1008 jis c 7021: b-10 the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. jis c 7021: b-12 description reference standard page 6/6 ligitek electronics co.,ltd. property of ligitek only part no. la46b/eg-s9-pf
|