lead-free parts pb super bright round type led lamps doc. no : qw0905-LSR13741-PF rev : a date : 19 - dec. - 2006 data sheet LSR13741-PF ligitek electronics co.,ltd. property of ligitek only
+ - 25.0min 1.5max 1.0min note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation 2.54typ 0.5 typ 7.6 8.6 5.9 5.0 ligitek electronics co.,ltd. property of ligitek only part no. LSR13741-PF package dimensions page 1/5
viewing angle 2 1/2 (deg) color lens note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. red transparent part no LSR13741-PF emitted gaalas red material 1.5 min. forward voltage @20ma(v) 66020 peak wave length pnm spectral halfwidth nm typ. min. max. 2.4 50 90 56 luminous intensity @20ma(mcd) page 2/5 ligitek electronics co.,ltd. property of ligitek only typical electrical & optical characteristics (ta=25 ) reverse current @5v operating temperature storage temperature 10 -40 ~ +85 -40 ~ +100 t opr tstg ir a symbol absolute maximum ratings at ta=25 peak forward current duty 1/10@10khz forward current power dissipation parameter sr ratings 30 100 100 i f i fp pd ma ma mw unit part no. LSR13741-PF
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 600650700750 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -4040 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 sr chip page 3/5 part no. LSR13741-PF
page 4/5 dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only 150 time(sec) 5 /sec max 260 c3sec max temp( c) 260 120 100 50 2 /sec max 0 0 25 preheat 60 seconds max part no. LSR13741-PF note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above.
5/5 page ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 description test condition 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. test item high temperature storage test operating life test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs the purpose of this test is the resistance of the device under tropical for hours. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. low temperature storage test high temperature high humidity test thermal shock test solder resistance test the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. reliability test: mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.t.sol=230 5 2.dwell time=5 1sec this test intended to see soldering well performed or not. solderability test mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. part no. LSR13741-PF
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