data sheet doc. no : qw0905-LVG3131 rev. : a date : 06 - jun - 2005 ligitek electronics co.,ltd. property of ligitek only super bright round t ype led lamps LVG3131
note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation ligitek electronics co.,ltd. property of ligitek only part no. LVG3131 package dimensions page 1/4 25.0min 0.5 typ 1.0min 2.54typ 1.5max 7.65 4.75 x 30 x 0 x 60 x 50% 75% 25% 0 25% 100% -30 x -60 x 50% 75% 100%
storage temperature tstg -40 ~ +100 j green note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. typical electrical & optical characteristics (ta=25 j ) emitted material part no LVG3131 gap soldering temperature spectral halfwidth ??f nm peak wave length f pnm viewing angle 2 c 1/2 (deg) min. green transparent lens 565 30 200 typ. max. 1.7 2.6 120 min. 30 max 260 j for 5 sec max (2mm from body) forward voltage @20ma(v) color tsol luminous intensity @20ma(mcd) absolute maximum ratings at ta=25 j part no. LVG3131 forward current peak forward current duty 1/10@10khz power dissipation reverse current @5v operating temperature parameter page 2/4 vg 10 100 120 30 -40 ~ +85 ratings i f t opr ir pd i fp symbol ma j g a mw ma unit ligitek electronics co.,ltd. property of ligitek only
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( j ) relative intensity@20ma wavelength (nm) forward voltage@20ma normalize @25 j fig.4 relative intensity vs. temperature ambient temperature( j ) relative intensity@20ma normalize @25 j typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) forward current(ma) fig.2 relative intensity vs. forward current relative intensity normalize @20ma ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 500 550 600 650 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 vg chip 3.5 page 3/4 part no. LVG3131
thermal shock test solder resistance test solderability test high temperature high humidity test mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202:103b jis c 7021: b-11 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hous. 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. 1.ta=65 j? 5 j 2.rh=90 %~95 % 3.t=240hrs ? 2hrs part no. LVG3131 low temperature storage test test item operating life test high temperature storage test reliability test: jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 reference standard ligitek electronics co.,ltd. property of ligitek only the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) test condition this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. description page 4/4
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