2008-09-04 1 esd5v3u2u... ultra-low capacitance esd diode array ? esd / transient protection of high-speed data lines exceeding iec61000-4-2 (esd): 20 kv (air / contact) iec61000-4-4 (eft): 40 a (5/50 ns) iec61000-4-5 (surge): 3 a (8/20 s) ? max. working voltage: 5.3 v ? extremely low capacitance: down to 0.2 pf ? very low clamping voltage: 12 v typ. ? extremely low forward clamping voltage: 4 v typ. ? very low reverse current: < 1 na typ. ? pb-free (rohs compliant) package ? qualified according aec q101 applications ? usb 2.0, 10/100/1000 ethernet, firewire, dvi hdmi, s-ata ? mobile communication ? consumer products (stb, mp3; dvd, dsc...) ? lcd displays, camera ? notebooks and destop computers, peripherals ESD5V3U2U-03F esd5v3u2u-03lrh 2 1 3 type package configuration marking ESD5V3U2U-03F esd5v3u2u-03lrh tsfp-3 tslp-3-7 2 lines, uni-directional* 2 lines, uni-directional* z1 z1 * or 1 line, bi-directional between pins 1 and 2, if pin 3 is not connected
2008-09-04 2 esd5v3u2u... maximum ratings at t a = 25c, unless otherwise specified parameter symbol value unit esd contact/ air discharge 1) v esd 20 kv peak pulse current ( t p = 8 / 20 s) 2) i pp 3 a operating temperature range t o p -40...125 c storage temperature t st g -65...150 electrical characteristics at t a = 25c, unless otherwise specified parameter symbol values unit min. typ. max. characteristics - reverse working voltage v rwm - - 5.3 v breakdown voltage i (br) = 1 ma, from pin 1 to 3 v (br) 6 - - reverse current v r = 5.3 v, from pin 1 to 3 i r - < 1 50 na clamping voltage i pp = 1 a, t p = 8/20s 2) , from 1/2 to 3 i pp = 3 a, t p = 8/20s 2) , from 1/2 to 3 v cl - - 10 12 13 15 v forward clamping voltage i pp = 1 a, t p = 8/20s 2) , from 3 to 1/2 i pp = 3 a, t p = 8/20s 2) , from 3 to 1/2 v fc - - 2 4 4 6 line capacitance, v r = 0 v, f = 1 mhz from pin 1/2 to 3 3) from pin 1 to 2, pin 3 not connected c t - - 0.4 0.2 0.6 0.4 pf 1 v esd according to iec61000-4-2 2 i pp according to iec61000-4-5 3 total capacitance line to ground
2008-09-04 3 esd5v3u2u... clamping voltage , v cl = ? ( i pp ) t p = 8 / 20 s, from pin 1/2 to 3 0 1 2 a 4 i pp 6 7 8 9 10 11 v 13 v cl forward clamping voltage v fc = ? ( i pp ) t p = 8 / 20 s, from pin 3 to 1/2 0 1 2 3 a 5 i pp 0 1 2 3 4 v 6 v fc reverse current i r = ? ( t a ) v r = parameter, from pin 1/2 to 3 25 50 75 100 c 150 t a -11 10 -10 10 -9 10 -8 10 -7 10 -6 10 a i r diode capacitance c t = ? (v r ) f = 1mhz, from pin 1/2 to 3 0 1 2 3 v 5 v r 0 0.1 0.2 0.3 0.4 pf 0.6 c t
2008-09-04 4 esd5v3u2u... line capacitance c t = ? (f) v r = parameter, from pin 1/2 to 3 0 500 1000 1500 2000 mhz 3000 f 0 0.1 0.2 0.3 0.4 pf 0.6 c t vr=0v vr=5.3v line capacitance c t = ?( t a ) v r = 0 v, f = 1 mhz -50 -25 0 25 50 c 100 t a 0 0.1 0.2 0.3 0.4 0.5 pf 0.7 c t 0 v 5.3 v
2008-09-04 5 esd5v3u2u... application example esd5v3u2u... 2 lines, uni-directional esd sensitive device i/o i/o 2 protected high-speed i/o data lines connector the protection diode should be placed very close to the location where the esd or other transients can occur to keep loops and inductances as small as possible. pin 3 should be connected directly to a ground plane on the board . 0.4 pf typ. 2 3 1 application example esd5v3u2u... 1 line, bi-directional esd sensitive device i/o i/o 1 protected high-speed i/o data lines connector the protection diode should be placed very close to the location where the esd or other transients can occur to keep loops and inductances as small as possible. pin 3 should not be connected on the board. 0.2 pf typ. 2 3 1
2008-09-04 6 esd5v3u2u... package tsfp-3 4 package outline foot print marking layout (example) standard packing reel ?180 mm = 3.000 pieces/reel reel ?330 mm = 10.000 pieces/reel 0.05 0.2 3 0.05 1.2 12 10? max. 0.05 0.8 1.2 0.05 0.04 0.55 0.05 0.2 0.05 0.15 0.05 0.2 0.4 0.05 0.4 0.05 0.4 0.45 1.05 0.4 0.4 bcr847bf type code pin 1 0.2 1.35 0.3 0.7 1.2 1.5 8 pin 1 manufacturer
2008-09-04 7 esd5v3u2u... package tslp-3-7 2 3 1 reel ?180 mm = 15.000 pieces/reel for board assembly information please refer to infineon website "packages" package outline foot print marking layout standard packing stencil apertures copper solder mask 0.275 0.2 0.315 0.945 0.45 0.17 0.355 0.2 0.35 0.225 1 0.6 0.225 0.15 0.35 0.3 r0.1 1 2 0.05 0.35 0.035 2 x 0.15 1) bottom view 0.035 0.5 1) 0.05 0.6 3 0.05 0.65 0.035 2x 0.25 1) 0.035 0.25 1) 1 0.05 +0.01 0.39 -0.03 pin 1 marking 0.05 max. top view 1) dimension applies to plated terminal 2) only for diodes, cathode marking on pin 3 cathode 2) marking type code pin 1 marking type code cathode marking only for diodes, cathode marking on pin 3 standard only for diodes, cathode marking on pin 3 standard 0.76 4 1.16 0.5 cathode marking 8 0.76 4 1.16 pin 1 marking 8
2008-09-04 8 esd5v3u2u... edition 2006-02-01 published by infineon technologies ag 81726 mnchen, germany ? infineon technologies ag 2007. all rights reserved. attention please! the information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (?beschaffenheitsgarantie?). with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices please contact your nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements components may contain dangerous substances. for information on the types in question please contact your nearest infineon technologies office. infineon technologies components may only be used in life-support devices or systems with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
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