Part Number Hot Search : 
69308 HFH13N80 1T350 32251 BPC1002 10LTN44I BH7867FS PE45127
Product Description
Full Text Search
 

To Download ESD1P0RFW Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 ESD1P0RF...
RF ESD Protection Diodes * ESD / transient protection of RF antenna / interfaces or ultra high speed data lines acc. to: IEC61000-4-2 (ESD): 20 kV (contact) IEC61000-4-4 (EFT): 40 A (5/50 ns) IEC61000-4-5 (surge): 10 A (8/20 s) * Ultra low capacitance of 1 pF typ. (0.5 pF per diode) * Low clamping voltage * Pb-free (ROHS compliant) package Applications in anti-parallel configuration * For low RF signal levels without superimposed DC voltage: e.g. GPS, WLAN, Bluetooth Applications in rail-to-rail configuration * For high RF signal levels or low RF signal levels with superimposed DC voltage: e.g. HDMI, S-ATA, Gbit Ethernet
ESD1P0RFW
3
ESD1P0RFS
6 5 4
D3 D4
D1
D2 D1 D2
1
2
1
2
3
Type ESD1P0RFS ESD1P0RFW
Package SOT363 SOT323
Configuration 2 channels 1 channel
Marking E6s E6s
1
2010-12-20
ESD1P0RF...
Maximum Ratings at TA = 25C, unless otherwise specified Parameter ESD contact discharge1) Peak pulse current (tp = 8 / 20 s)2) Operating temperature range Storage temperature Symbol VESD I pp T op T stg Value 20 10 -55...150 -65...150 Unit kV A C
Electrical Characteristics at TA = 25C, unless otherwise specified Symbol Values Parameter min. Characteristics Reverse working voltage3) Reverse current VR = 70 V Forward clamping voltage2) IPP = 3 A, tp = 8/20 s IPP = 10 A, tp = 8/20 s Line capacitance4) VR = 0 V, f = 1 MHz VR = 0 V, f = 1 MHz, for Application example 4 Series inductance (per diode) SOT323 SOT363
1V
Unit max. 70 100 V nA V
typ. -
VRWM IR VFC
-
CT LS -
4 12 1 0.5 1.4 1.6
7 15 pF 1.5 0.75 nH -
ESD according to IEC61000-4-2, only valid in anti-parallel or rail-to-rail connection. Please refer to the application examples. 2I pp according to IEC61000-4-5, only valid in anti-parallel or rail-to-rail connection.
3Only
Please refer to the application examples. valid in rail-to-rail configuration VCC VRWM capacitance line to ground (2 diodes in parallel)
4Total
2
ESD1P0RF...
Forward clamping voltage VFC = (IPP) tp = 8 / 20 s
12
V
Reverse current IR = (VR) TA = Parameter
in rail-to-rail configuration
10 -5 A
125C
10 9
10 -6
85C
10
-7
V FC
8
IR
7 6 5 4 3 2 1 0 1 2 3 4 5 6 7 8
A
10 -8
25C
10 -9
10 -10
10 -11
-40C
10
10 -12 0
10
20
30
40
50
V
70
Ipp
VR
Forward current IF = (VF)
T A = Parameter
in anti-parallel configuration
100
A
Line capacitance CT = (f) VR = 0 V
3
pF
60 40 20
-40C 125C 85C 25C
IF
0 -20 -40 -60 -80 -100 -600
mV 25C 85C 125C
CT
2
-40C
1.5
1
0.5
-400
-200
0
200
600
0 0
500
1000
MHz
2000
VF
f
3
ESD1P0RF...
Insertion loss |S21|2 = (f) VR = 0 V, line to ground, Z = 50
0
dB
-0.25
IL
-0.375 -0.5 -0.625 -0.75 0
250
500
750 1000 1250 1500 MHz
2000
f
4
ESD1P0RF...
1. Application example ESD1P0RFW 1 channel, anti-parallel configuration
1 protected signal line, superimposed DC voltage up to VF (diode forward voltage) 3
I/O
ESD sensitive circuit
Line capacitance to ground = 1 pF 1 2
The protection diode should be placed very close to the location where the ESD or other transients can occur to keep loops and inductances as small as possible. Pins 1 and 2 should be connected in parallel directly to a ground plane on the board.
2. Application example ESD1P0RFW 1 channel, rail-to-rail configuration
+Vcc 1 protected signal line, superimposed DC voltage up to +Vcc (voltage supply) ESD sensitive circuit Pin 2 should be connected to the positive supply voltage and pin 1 should be connected directly to a ground plane on the board. Clamped input voltage at I/O port is limited to Vcc + VF at positive transients and 0V VF at negative transients (VF ... diode forward voltage drop).
I/O
3
Line capacitance to ground = 1 pF
1
2
5
6
Package SOT323
ESD1P0RF...
Package Outline
2 0.2 0.3 +0.1 -0.05 3
1.25 0.1 2.1 0.1
0.9 0.1 3x 0.1
M
0.1 MAX. 0.1 A
1 0.65 0.65
2
0.1 MIN.
0.15 +0.1 -0.05 0.2
M
A
Foot Print
0.6
0.8
0.65 0.65
Marking Layout (Example)
Manufacturer
1.6
2005, June Date code (YM)
Pin 1
BCR108W Type code
Standard Packing
Reel o180 mm = 3.000 Pieces/Reel Reel o330 mm = 10.000 Pieces/Reel
4 0.2
Pin 1
2.15
2.3
8
1.1
7
Package SOT363
ESD1P0RF...
Package Outline
2 0.2 0.2 -0.05
+0.1
0.9 0.1 6x 0.1 4
1.25 0.1 2.1 0.1
M
0.1 MAX. 0.1 A
6
5
Pin 1 marking
1
2
3
0.1 MIN.
0.65 0.65 0.2
M
0.15 +0.1 -0.05 A
Foot Print
0.3
0.9 0.7
0.65 0.65
Marking Layout (Example)
Small variations in positioning of Date code, Type code and Manufacture are possible.
1.6
Manufacturer
2005, June Date code (Year/Month)
Pin 1 marking Laser marking
BCR108S Type code
Standard Packing
Reel o180 mm = 3.000 Pieces/Reel Reel o330 mm = 10.000 Pieces/Reel For symmetric types no defined Pin 1 orientation in reel.
4
0.2
2.3 8
Pin 1 marking
2.15
1.1
8
ESD1P0RF...
Edition 2006-02-01 Published by Infineon Technologies AG 81726 Munchen, Germany (c) Infineon Technologies AG 2007. All Rights Reserved.
Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
9


▲Up To Search▲   

 
Price & Availability of ESD1P0RFW

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X