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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC3215TB
5 V, SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER
DESCRIPTION
The PC3215TB is a silicon monolithic IC designed as wideband amplifier. systems required wideband operation from HF to L band. This IC is manufactured using NEC's 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. The package is 6-pin super minimold suitable for surface mount. The PC3215TB is suitable to
FEATURES
* Wideband response * Noise figure * Power gain * Supply voltage : fu = 2.9 GHz TYP. @3 dB bandwidth : NF = 2.3 dB TYP. @f = 1.5 GHz : GP = 20.5 dB TYP. @f = 1.5 GHz : VCC = 4.5 to 5.5 V
* High-density surface mounting: 6-pin super minimold package
APPLICATION
* Systems required wideband operation from HF to L band
ORDERING INFORMATION
Part Number Package 6-pin super minimold Marking C3H Supplying Form Embossed tape 8 mm wide. 1, 2, 3 pins face the perforation side of the tape. Qty 3 kpcs/reel.
PC3215TB-E3
Remark
To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: PC3215TB)
Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. P14765EJ2V0DS00 (2nd edition) Date Published August 2000 N CP(K) Printed in Japan
The mark
shows major revised points.
(c)
2000
PC3215TB
PIN CONNECTIONS
(Top View) 3 (Bottom View) 4 4 3
Pin No. 1 2
Pin Name INPUT GND GND OUTPUT GND VCC
C3H
2
5
5
2
3 4
1
6
6
1
5 6
PRODUCT LINE-UP OF 5V-BIAS SILICON MMIC WIDEBAND AMPLIFIERS (TA = +25C, VCC = 5.0 V, ZS = ZL = 50 )
fu (GHz) 2.9 PO (sat) (dBm) +1.0 GP (dB) 13 NF (dB) 5.0 @f = 1 GHz 4.5 @f = 1 GHz 3.4 @f = 1.5 GHz 2.3 @f = 1.5 GHz ICC (mA) 12
Part No.
Package 6-pin minimold 6-pin super minimold
Marking C1G
PC2711T PC2711TB PC2712T PC2712TB PC3210TB PC3215TB
2.6
+3.0
20
12
6-pin minimold 6-pin super minimold
C1H
2.3
+3.5
20
15
6-pin super minimold
C2X
2.9
+3.5
20.5
14
6-pin super minimold
C3H
Remark Caution
Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. The package size distinguishes between minimold and super minimold.
2
Data Sheet P14765EJ2V0DS00
PC3215TB
PIN EXPLANATION
Applied Voltage (V) Pin Voltage Note (V) 0.82
Pin No. 1
Pin Name
Function and Applications
Internal Equivalent Circuit
INPUT
Signal input pin. A internal matching circuit, configured with resistors, enables 50 connection over a wideband. A multifeedback circuit is designed to cancel the deviations of hFE and resistance. This pin must be coupled to signal source with capacitor for DC cut. Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference. Signal output pin. A internal matching circuit, configured with resistors, enables 50 connection over a wideband. This pin must be coupled to next stage with capacitor for DC cut. Power supply pin. This pin should be externally equipped with bypass capacitor to minimize ground impedance.
VCC 6 4 OUT IN 1
2 3 5
GND
0
4
OUTPUT
3.8
2 GND
5
3 GND
6
VCC
4.5 to 5.5
Note Pin voltage is measured at VCC = 5.0 V
Data Sheet P14765EJ2V0DS00
3
PC3215TB
ABSOLUTE MAXIMUM RATINGS
Parameter Supply Voltage Circuit Current Input Power Power Dissipation Operating Ambient Temperature Storage Temperature Symbol VCC ICC Pin PD TA Tstg TA = +25C TA = +25C TA = +25C TA = +85C
Note
Conditions
Ratings 6.0 30 +10 270 -40 to +85 -55 to +150
Unit V mA dBm mW C C
Note Mounted on 50 x 50 x 1.6-mm epoxy glass PWB, with copper patterning on both sides.
RECOMMENDED OPERATING CONDITIONS
Parameter Supply Voltage Operating Ambient Temperature Input Power Input Frequency Symbol VCC TA Pin fin MIN. 4.5 -40 - 0.1 TYP. 5.0 +25 - - MAX. 5.5 +85 0 2.9 Unit V C dBm GHz
ELECTRICAL CHARACTERISTICS (TA = +25C, VCC = 5.0 V, ZS = ZL = 50 )
Parameter Circuit Current Power Gain Noise Figure Upper Limit Operating Frequency Isolation Input Return Loss Output Return Loss 1 dB Compression Point Symbol ICC GP NF fu Test Conditions No input signals f = 1.5 GHz, Pin = -30 dBm f = 1.5 GHz 3 dB down below from gain at f = 0.1 GHz f = 1.5 GHz, Pin = -30 dBm f = 1.5 GHz, Pin = -30 dBm f = 1.5 GHz, Pin = -30 dBm MIN. 10.5 18.5 - 2.5 TYP. 14.0 20.5 2.3 2.9 MAX. 17.5 - 3.0 - Unit mA dB dB GHz
ISL RLin RLout P-1
39 10 6.5 -4
44 15 9.5 -1.5
- - - -
dB dB dB dBm
STANDARD CHARACTERISTICS (TA = +25C, VCC = 5.0 V, ZS = ZL = 50 )
Parameter Saturated Output Power Output Intercept Point Gain Flatness Symbol PO(sat) OIP3 GP Pin = 0 dBm f1 = 1.5 GHz, f2 = 1.501 GHz f = 0.1 to 2.15 GHz Test Conditions Reference Values +3.5 +10 1.0 Unit dBm dBm dB
4
Data Sheet P14765EJ2V0DS00
PC3215TB
TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25C)
CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE 20 No input signal
Circuit Current ICC (mA) Circuit Current ICC (mA)
CIRCUIT CURRENT vs. SUPPLY VOLTAGE 20
No input signal VCC = 5 V 15
15
10
10
5 TA = -40C TA = +25C TA = +85C 0 1 3 4 Supply Voltage VCC (V) 2 5 6
5
0
0 -50
0 +75 +100 +25 +50 -25 Operating Ambient Temperature TA (C)
INSERTION POWER GAIN vs. FREQUENCY 25
Insertion Power Gain GP (dB) Insertion Power Gain GP (dB)
INSERTION POWER GAIN vs. FREQUENCY 25
20
20
15
15
10 Pin = -30 dBm VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V 0.3 1.0 Frequency fin (GHz) 3.0
10 VCC = 5 V Pin = -30 dBm TA = -40C TA = +25C TA = +85C 0.3 1.0 Frequency fin (GHz) 3.0
5 0 0.1
5
0 0.1
NOISE FIGURE vs. FREQUENCY 5 VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V
Noise Figure NF (dB)
NOISE FIGURE vs. FREQUENCY VCC = 5 V TA = -40C TA = +25C 4 TA = +85C 3 5
Noise Figure NF (dB)
4
3
2
2
1
1
0 0.1
0.3 1.0 Frequency fin (GHz)
3.0
0 0.1
0.3 1.0 Frequency fin (GHz)
3.0
Data Sheet P14765EJ2V0DS00
5
PC3215TB
ISOLATION vs. FREQUENCY Pin = -30 dBm VCC = 4.5 V VCC = 5.0 V -10 VCC = 5.5 V
Isolation ISL (dB)
ISOLATION vs. FREQUENCY VCC = 5 V Pin = -30 dBm TA = -40C -10 TA = +25C TA = +85C -20 0
0
-20
Isolation ISL (dB)
-30
-30
-40 -50 0.1
-40
0.3 1.0 Frequency fin (GHz)
3.0
-50 0.1
0.3 1.0 Frequency fin (GHz)
3.0
INPUT RETURN LOSS vs. FREQUENCY 0
Input Return Loss RLin (dB) Input Return Loss RLin (dB)
INPUT RETURN LOSS vs. FREQUENCY 0
-10
-10
-20
-20
-30 Pin = -30 dBm VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V 0.3 1.0 Frequency fin (GHz) 3.0
-30 VCC = 5 V Pin = -30 dBm TA = -40C TA = +25C TA = +85C 0.3 1.0 Frequency fin (GHz) 3.0
-40
-40
-50 0.1
-50 0.1
OUTPUT RETURN LOSS vs. FREQUENCY 0
Output Return Loss RLout (dB) Output Return Loss RLout (dB)
OUTPUT RETURN LOSS vs. FREQUENCY 0
-10
-10
-20
-20
-30 -40 Pin = -30 dBm VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V -50 0.1 0.3
-30 VCC = 5 V Pin = -30 dBm TA = -40C TA = +25C TA = +85C 0.3 1.0 Frequency fin (GHz) 3.0
-40
1.0 Frequency fin (GHz)
3.0
-50 0.1
6
Data Sheet P14765EJ2V0DS00
PC3215TB
OUTPUT POWER vs. INPUT POWER +10 +10 OUTPUT POWER vs. INPUT POWER
Output Power Pout (dBm)
0
Output Power Pout (dBm)
0
-10
-10
-20
-30 -40
fin = 1 GHz VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V +10 -30 -20 -10 0 Input Power Pin (dBm)
-20
-30 -40
VCC = 5 V fin = 1 GHz TA = -40C TA = +25C TA = +85C +10 -10 0 -30 -20 Input Power Pin (dBm)
OUTPUT POWER vs. INPUT POWER +10
Output Power Pout (dBm)
OUTPUT POWER vs. INPUT POWER +10
Output Power Pout (dBm)
0
0
-10
-10
-20
-30 -40
fin = 1.5 GHz VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V +10 -30 -20 -10 0 Input Power Pin (dBm)
-20
-30 -40
VCC = 5 V fin = 1.5 GHz TA = -40C TA = +25C TA = +85C +10 -30 -20 -10 0 Input Power Pin (dBm)
Data Sheet P14765EJ2V0DS00
7
PC3215TB
OUTPUT POWER vs. INPUT POWER +10 +10 OUTPUT POWER vs. INPUT POWER
Output Power Pout (dBm)
0
Output Power Pout (dBm)
0
-10
-10
-20
-30 -40
fin = 2.15 GHz VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V +10 -30 -20 -10 0 Input Power Pin (dBm)
-20
-30 -40
VCC = 5 V fin = 2.15 GHz TA = -40C TA = +25C TA = +85C +10 -30 -20 -10 0 Input Power Pin (dBm)
OUTPUT POWER vs. INPUT POWER +10 +10
OUTPUT POWER vs. INPUT POWER
Output Power Pout (dBm)
0
Output Power Pout (dBm)
0
-10
-10
-20
-30 -40
fin = 2.4 GHz VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V +10 -30 -20 -10 0 Input Power Pin (dBm)
-20
-30 -40
VCC = 5 V fin = 2.4 GHz TA = -40C TA = +25C TA = +85C +10 -30 -20 -10 0 Input Power Pin (dBm)
8
Data Sheet P14765EJ2V0DS00
PC3215TB
OUTPUT POWER OF EACH TONE vs. INPUT POWER OF EACH TONE Output Power of Each Tone PO(each) (dBm) Output Power of Each Tone PO(each) (dBm) +20 +20 OUTPUT POWER OF EACH TONE vs. INPUT POWER OF EACH TONE
0
0
-20 -40
-20 -40
-60
-80 -40 -35 -30 -25 -20 -15 -10 -5 0 Input Power of Each Tone Pin(each) (dBm) OUTPUT POWER OF EACH TONE vs. INPUT POWER OF EACH TONE
VCC = 5 V f1 = 1 000 MHz f2 = 1 001 MHz
-60
-80 -40 -35 -30 -25 -20 -15 -10 -5 0 Input Power of Each Tone Pin(each) (dBm) OUTPUT POWER OF EACH TONE vs. INPUT POWER OF EACH TONE
VCC = 5 V f1 = 1 500 MHz f2 = 1 501 MHz
Output Power of Each Tone PO(each) (dBm)
+20
Output Power of Each Tone PO(each) (dBm)
+20
0
0
-20 -40
-20 -40
-60
-80 -40 -35 -30 -25 -20 -15 -10 -5 0 Input Power of Each Tone Pin(each) (dBm)
VCC = 5 V f1 = 2 150 MHz f2 = 2 151 MHz
-60
-80 -40 -35 -30 -25 -20 -15 -10 -5 0 Input Power of Each Tone Pin(each) (dBm)
VCC = 5 V f1 = 2 400 MHz f2 = 2 401 MHz
Remark
The graphs indicate nominal characteristics.
Data Sheet P14765EJ2V0DS00
9
PC3215TB
S-PARAMETERS (TA = +25C, VCC = 5 V)
S11-FREQUENCY
START STOP
0.100000000 GHz 3.100000000 GHz
S22-FREQUENCY
START STOP
0.100000000 GHz 3.100000000 GHz
Data Sheet P14765EJ2V0DS00
10
PC3215TB
TYPICAL S-PARAMETER VALUES (TA = +25C)
VCC = 5.0 V, ICC = 16 mA FREQUENCY MHz 100.0000 200.0000 300.0000 400.0000 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 1100.0000 1200.0000 1300.0000 1400.0000 1500.0000 1600.0000 1700.0000 1800.0000 1900.0000 2000.0000 2100.0000 2200.0000 2300.0000 2400.0000 2500.0000 2600.0000 2700.0000 2800.0000 2900.0000 3000.0000 3100.0000 MAG. 0.207 0.190 0.186 0.192 0.200 0.201 0.204 0.206 0.210 0.212 0.218 0.217 0.221 0.228 0.233 0.238 0.244 0.246 0.248 0.246 0.241 0.236 0.229 0.219 0.215 0.213 0.221 0.234 0.253 0.264 0.283 S11 ANG. 174.1 173.1 174.3 173.8 174.5 173.0 173.0 172.4 172.7 171.4 169.4 168.4 165.9 164.7 162.3 159.5 157.2 153.9 150.6 147.4 144.9 142.2 142.2 143.5 145.7 149.3 150.1 151.3 152.1 150.7 148.7 MAG. 10.788 10.714 10.565 10.359 10.225 10.116 10.116 10.122 10.186 10.182 10.208 10.296 10.248 10.438 10.369 10.554 10.492 10.483 10.408 10.405 10.267 10.039 9.896 9.684 9.348 9.068 8.673 8.437 8.080 7.791 7.458 S21 ANG. -4.6 -9.8 -14.3 -18.3 -21.7 -24.9 -28.0 -31.1 -34.5 -37.7 -41.6 -45.6 -49.7 -53.9 -58.0 -62.7 -67.2 -72.2 -76.9 -82.2 -87.2 -92.7 -97.7 -102.4 -107.5 -112.0 -116.6 -121.1 -124.9 -129.4 -132.7 MAG. 0.013 0.013 0.013 0.014 0.013 0.013 0.011 0.011 0.011 0.009 0.011 0.009 0.006 0.008 0.006 0.005 0.004 0.003 0.004 0.007 0.008 0.011 0.012 0.014 0.015 0.018 0.017 0.020 0.021 0.020 0.022 S12 ANG. 6.3 -0.5 2.7 4.7 5.3 2.1 1.6 12.9 5.1 4.1 4.9 11.0 20.5 1.6 25.7 31.6 48.5 87.2 93.4 114.5 115.4 124.0 121.6 124.9 117.8 117.3 114.4 114.0 111.6 112.5 113.7 MAG. 0.285 0.282 0.283 0.285 0.286 0.286 0.288 0.289 0.290 0.295 0.299 0.300 0.299 0.307 0.310 0.316 0.317 0.318 0.323 0.323 0.319 0.312 0.306 0.292 0.279 0.270 0.256 0.248 0.237 0.232 0.229 S22 ANG. -3.3 -3.7 -4.6 -6.2 -7.6 -8.8 -10.4 -11.7 -13.5 -14.9 -16.8 -18.0 -20.2 -23.1 -24.8 -27.5 -30.5 -33.3 -36.9 -40.6 -44.9 -48.9 -52.6 -56.3 -59.3 -61.7 -63.7 -65.1 -67.3 -68.0 -70.2 3.38 3.39 3.37 3.92 3.96 3.69 3.91 4.17 3.99 4.28 4.19 4.65 5.78 6.97 6.80 11.54 11.75 13.52 8.46 7.46 6.20 4.50 4.12 3.40 3.42 3.02 3.17 2.85 2.98 2.90 3.02 K
Data Sheet P14765EJ2V0DS00
11
PC3215TB
TEST CIRCUIT
VCC 1 000 pF C3
6 50 IN 1 000 pF C1 1 4 C2 1 000 pF 50 OUT
2, 3, 5
EXAMPLE OF APPLICATION CIRCUIT
VCC 1 000 pF 1 000 pF
6 50 IN 1 000 pF 1 4 1 000 pF 1 000 pF 50 to 200 2, 3, 5 Please connect these component to stabilize operation. 1
6 4 1 000 pF 50 OUT
2, 3, 5
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
Capacitors for VCC, input and output pins 1 000 pF capacitors are recommendable as bypass capacitor for VCC pin and coupling capacitors for input/output pins. Bypass capacitor for VCC pin is intended to minimize VCC pin's ground impedance. Therefore, stable bias can be supplied against VCC fluctuation. Coupling capacitors for input/output pins are intended to minimize RF serial impedance and cut DC. To get flat gain from 100 MHz up, 1 000 pF capacitors are assembled on the test circuit. [Actually, 1 000 pF capacitors give flat gain at least 10 MHz. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 2 200 pF. Because the coupling capacitors are determined by the equation of C = 1/(2 fZs).]
12
Data Sheet P14765EJ2V0DS00
PC3215TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
AMP-2
Top View 3 2 1
IN C
5 4
OUT C
C
3H
6
Mounting direction VCC C
COMPONENT LIST
Value C 1 000 pF
Notes 1. 30 x 30 x 0.4 mm double sided copper clad polyimide board. 2. Back side: GND pattern 3. Solder plated on pattern 4. : Through holes
Data Sheet P14765EJ2V0DS00
13
PC3215TB
PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm)
2.10.1 1.250.1
2.00.2
1.3
0.65
0.65
0.1 MIN.
0.90.1
0.7
14
Data Sheet P14765EJ2V0DS00
0 to 0.1
0.15 +0.1 -0 .05
0.2+0.1 -0.05
PC3215TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). (3) Keep the track length of the ground pins as short as possible. (4) A low pass filter must be attached to VCC line.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative.
Soldering Method Infrared Reflow
Soldering Conditions Package peak temperature: 235C or below Time: 30 seconds or less (at 210C) Note Count: 3, Exposure limit: None Package peak temperature: 215C or below Time: 40 seconds or less (at 200C) Note Count: 3, Exposure limit: None Soldering bath temperature: 260C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None Pin temperature: 300C Time: 3 seconds or less (per side of device) Note Exposure limit: None
Recommended Condition Symbol IR35-00-3
VPS
VP15-00-3
Wave Soldering
WS60-00-1
Partial Heating
-
Note After opening the dry pack, keep it in a place below 25C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Data Sheet P14765EJ2V0DS00
15
PC3215TB
* The information in this document is current as of August, 2000. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).
M8E 00. 4

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