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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DUAL COLOR LED LAMPS Pb Lead-Free Parts LSRFUG2692-AS-PF DATA SHEET DOC. NO : REV. DATE : QW0905- LSRFUG2692-AS-PF-0808 A : 14 - Jul. - 2009 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSRFUG2692-AS-PF Page 1/6 Package Dimensions 2.9 3.1 3.3 1.5 MAX 4.3 6.450.5 UG SRF 0.5 TYP 18.0MIN 1 2 3 1 2.0MIN 2 3 1.ANODE GREEN 2.COMMON CATHODE 3.ANODE RED 2.0MIN 2.54TYP 2.54TYP Note : 1.All dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 0 -30 30 -60 60 100% 75% 50% 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSRFUG2692-AS-PF Page 2/6 Absolute Maximum Ratings at Ta=25 Absolute Maximum Ratings Parameter Symbol Red Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge( * ) Operating Temperature Storage Temperature IF IFP PD Ir ESD Topr Tstg 25 75 65 10 2000 -40 ~ +85 -40 ~ +100 Green 25 75 65 10 mA mA mW UNIT A V Static the anti-electrosatic *glove isElectricity or power surge will damageLED.LED. Use of a conductive wrist band or must be properly recommended when handing these All devices, equipment and machinery grounded. Typical Electrical & Optical Characteristics (Ta=25 ) PART NO MATERIAL Emitted AlGaInP Red COLOR Dominant wave length Dnm Forward Spectral voltage halfwidth @20mA(V) nm Viewing angle @20mA(mcd) 2 1/2 (deg) Luminous intensity Lens 630 White Diffused 574 20 20 Min. Max. Min. Typ. 1.5 1.7 2.4 2.6 220 90 350 160 60 60 LSRFUG2692-AS-PF AlGaInP Green Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The luminous intensity data did not including 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSRFUG2692-AS-PF Page 3/6 Typical Electro-Optical Characteristics Curve SRF CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 60 2.0 Forward Current(mA) 40 30 20 10 0 0 0.5 1.0 1.5 2.0 2.5 3.0 Relative Intensity Normalize @20mA 50 1.0 0.0 1.0 10 100 1000 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Forward Current(mA) Fig.4 Relative Intensity vs. Temperature Forward Voltage@20mA Normalize @25 Relative Intensity@20mA Normalize @25 -20 0 20 40 60 80 1.2 1.1 1.0 0.9 2.5 2.0 1.5 1.0 0.5 0.0 -20 0 20 40 60 80 0.8 Ambient Temperature( ) Ambient Temperature( ) Fig.5 Relative Intensity vs. Wavelength 1.0 Relative Intensity@20mA 0.5 0.0 550 600 650 700 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSRFUG2692-AS-PF Page 4/6 Typical Electro-Optical Characteristics Curve UG CHIP Fig.1 Forward current vs. Forward Voltage 60 Fig.2 Relative Intensity vs. Forward Current 2.0 Forward Current(mA) 50 40 30 20 10 0 0 0.5 1.0 1.5 2.0 2.5 3.0 Relative Intensity Normalize @20mA 1.0 0 1.0 10 100 1000 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Forward Current(mA) Fig.4 Relative Intensity vs. Temperature 1.2 1.1 1.0 0.9 0.8 -20 0 20 40 60 80 Relative Intensity @20mA Normalize @25 Forward Voltage@20mA Normaliz @25 2.5 2.0 1.5 1.0 0.5 0 -20 0 20 40 60 80 Ambient Temperature() Ambient Temperature() Fig.5 Relative Intensity vs. Wavelength Relative Intensity @20mA 1.0 0.5 0 500 550 600 650 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSRFUG2692-AS-PF Page 5/6 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case) 2.Wave Soldering Profile Dip Soldering Preheat: 120C Max Preheat time: 60seconds Max Ramp-up 2C/sec(max) Ramp-Down:-5C/sec(max) Solder Bath:260C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case) Temp( C) 260C3sec Max 260 5 /sec max 120 2/sec max Preheat 60 Seconds Max 25 0 0 50 100 150 Time(sec) Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSRFUG2692-AS-PF Page 6/6 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=1055 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-405 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=655 2.RH=90%~95% 3.t=240hrs2hrs The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=1055&-405 (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=2605 2.Dwell time= 10 1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=2305 2.Dwell time=5 1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 |
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