View HSB226WK_4657913.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

HSB226WK
Silicon Schottky Barrier Diode for High Speed Switching
REJ03G0592-0200 Rev.2.00 Sep 15, 2006
Features
* Low reverse current, Low capacitance. * CMPAK package is suitable for high density surface mounting and high speed assembly.
Ordering Information
Type No. HSB226WK Laser Mark E6 Package Name CMPAK Package Code PTSP0003ZB-A
Pin Arrangement
3
2 1 (Top View)
1. Anode 2. Anode 3. Cathode
Rev.2.00 Sep 15, 2006 page 1 of 4
HSB226WK
Absolute Maximum Ratings
(Ta = 25C)
Item Repetitive peak reverse voltage Non-Repetitive peak forward surge current Forward current Junction temperature Storage temperature Notes: 1. 10 ms sine wave 1 pulse 2. Two device total Symbol VRRM IFSM * * 2 IF * Tj Tstg
12
Value 25 200 50 125 -55 to +125
Unit V mA mA C C
Electrical Characteristics *
(Ta = 25C)
Item Forward voltage Reverse current Capacitance Note: Per one device. Symbol VF1 VF2 IR C Min -- -- -- -- Typ -- -- -- -- Max 0.33 0.38 450 2.80 Unit V nA pF IF = 1 mA IF = 5 mA VR = 20 V VR = 1 V, f = 1 MHz Test Condition
Rev.2.00 Sep 15, 2006 page 2 of 4
HSB226WK
Main Characteristic
101 100 10-1 10-5
Ta = 75C
10-4
Forward current IF (A)
10-2 10-3 10
-4
Reverse current IR (A)
10-6
Ta = 25C
Ta = 75C Ta = 25C
10-5 10-6 10-7 10-8 0 0.2
10-7
0.4
0.6
0.8
1.0
10-8
0
10
20
30
40
Forward voltage VF (V) Fig.1 Forward current vs. Forward voltage
Reverse voltage VR (V) Fig.2 Reverse current vs. Reverse voltage
f=1MHz 10
Capacitance C (pF)
1.0
0.1 0.1
1.0 Reverse voltage VR (V)
10
Fig.3 Capacitance vs. Reverse voltage
Rev.2.00 Sep 15, 2006 page 3 of 4
HSB226WK
Package Dimensions
JEITA Package Code SC-70 RENESAS Code PTSP0003ZB-A Previous Code CMPAK / CMPAKV MASS[Typ.] 0.006g
D e Q c
E
HE
L A A b e
Reference
Dimension in Millimeters
A2
A
Symbol
A1 e1
b
l1
c A -- A Section
b2 Pattern of terminal position areas
A A1 A2 b c D E e HE L b2 e1 l1 Q
Min 0.8 0 0.8 0.25 0.1 1.8 1.15 1.8 -
Nom 0.9 0.3 0.16 2.0 1.25 0.65 2.1 0.425 1.5 0.2
Max 1.1 0.1 1.0 0.4 0.26 2.2 1.35 2.4 0.45 0.9 -
Rev.2.00 Sep 15, 2006 page 4 of 4
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
http://www.renesas.com
Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510
(c) 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .6.0

▲Up To Search▲

Price & Availability of HSB226WK

	To Download HSB226WK Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .