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| CYStech Electronics Corp. P-Channel Enhancement Mode Power MOSFET Spec. No. : C404J3 Issued Date : 2008.09.19 Revised Date :2009.02.04 Page No. : 1/7 MTP9575J3 Features * Single Drive Requirement * Low On-resistance * Fast switching Characteristic * RoHS compliant package BVDSS ID RDSON -60V -15A 90m Symbol MTP9575J3 Outline TO-252 GGate DDrain SSource GDS Absolute Maximum Ratings (Ta=25C) Parameter Symbol Limits Unit Drain-Source Voltage Gate-Source Voltage Continuous Drain Current @VGS=-10V, TC=25C Continuous Drain Current @VGS=-10V, TC=100C Pulsed Drain Current Total Power Dissipation (TC=25) Linear Derating Factor Operating Junction and Storage Temperature Note : *1. Pulse width limited by safe operating area VDS VGS ID ID IDM Pd Tj, Tstg -60 25 -15 -9.5 -45 *1 36 0.29 -55~+150 V V A A A W W/C C MTP9575J3 CYStek Product Specification CYStech Electronics Corp. Thermal Data Parameter Thermal Resistance, Junction-to-case, max Thermal Resistance, Junction-to-ambient, max Symbol Rth,j-c Rth,j-a Spec. No. : C404J3 Issued Date : 2008.09.19 Revised Date :2009.02.04 Page No. : 2/7 Value 3.5 110 Unit C/W C/W Characteristics (Tj=25C, unless otherwise specified) Symbol Min. Typ. -0.06 14 17 5 6 10 19 46 53 1660 160 100 56 159 Max. -3.0 100 -1 -25 90 120 27 2660 -1.2 Unit V V/C V S nA A A m m Test Conditions VGS=0, ID=-250A Reference to 25C, ID=-1mA VDS = VGS, ID=-250A VDS =-10V, ID=-9A VGS=25V VDS =-60V, VGS =0 VDS =-48V, VGS =0, Tj=150C VGS =-10V, ID=-12A VGS =-4.5V, ID=-9A Static BVDSS -60 BVDSS/Tj VGS(th) -1.0 GFS IGSS IDSS IDSS *RDS(ON) *RDS(ON) Dynamic *Qg *Qgs *Qgd *td(ON) *tr *td(OFF) *tf Ciss Coss Crss Source-Drain Diode *VSD *trr *Qrr - nC ID=-9A, VDS=-48V, VGS=-4.5V VDS=-30, ID=-9A, VGS=-10V, RG=3.3, RL=3.3 ns pF VGS=0V, VDS=-25V, f=1MHz V ns nC IS=-9A, VGS=0V IS=-9A, VGS=0, dI/dt=100A/s *Pulse Test : Pulse Width 300s, Duty Cycle2% Ordering Information Device MTP9575J3 Package TO-252 (RoHS compliant) Shipping 2500 pcs / Tape & Reel Marking 9575 MTP9575J3 CYStek Product Specification CYStech Electronics Corp. Characteristic Curves Spec. No. : C404J3 Issued Date : 2008.09.19 Revised Date :2009.02.04 Page No. : 3/7 MTP9575J3 CYStek Product Specification CYStech Electronics Corp. Characteristic Curves(Cont.) Spec. No. : C404J3 Issued Date : 2008.09.19 Revised Date :2009.02.04 Page No. : 4/7 MTP9575J3 CYStek Product Specification CYStech Electronics Corp. Reel Dimension Spec. No. : C404J3 Issued Date : 2008.09.19 Revised Date :2009.02.04 Page No. : 5/7 Carrier Tape Dimension MTP9575J3 CYStek Product Specification CYStech Electronics Corp. Recommended temperature profile for IR reflow Spec. No. : C404J3 Issued Date : 2008.09.19 Revised Date :2009.02.04 Page No. : 6/7 Note : All temperatures refer to topside of the package, measured on the package body surface. Profile feature Average ramp-up rate (Tsmax to Tp) Preheat -Temperature Min(TS min) -Temperature Max(TS max) -Time(ts min to ts max) Time maintained above: -Temperature (TL) - Time (tL) Peak Temperature(TP) Time within 5C of actual peak temperature(tp) Ramp down rate Time 25 C to peak temperature Sn-Pb eutectic Assembly 3C/second max. 100C 150C 60-120 seconds 183C 60-150 seconds 240 +0/-5 C 10-30 seconds 6C/second max. 6 minutes max. Pb-free Assembly 3C/second max. 150C 200C 60-180 seconds 217C 60-150 seconds 260 +0/-5 C 20-40 seconds 6C/second max. 8 minutes max. Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 C Soldering Time 5 +1/-1 seconds MTP9575J3 CYStek Product Specification CYStech Electronics Corp. TO-252 Dimension A C Spec. No. : C404J3 Issued Date : 2008.09.19 Revised Date :2009.02.04 Page No. : 7/7 Marking: B L F G D Device Name Date code 9575 3 H E K 2 I 1 J Style: Pin 1.Gate 2.Drain 3.Source 3-Lead TO-252 Plastic Surface Mount Package CYStek Package Code: J3 *: Typical DIM A B C D E F Inches Min. Max. 0.0177 0.0217 0.0650 0.0768 0.0354 0.0591 0.0177 0.0236 0.2441 0.2677 0.2125 0.2283 Millimeters Min. Max. 0.45 0.55 1.65 1.95 0.90 1.50 0.45 0.60 6.20 6.80 5.40 5.80 DIM G H I J K L Inches Min. Max. 0.0866 0.1102 *0.0906 0.0449 0.0346 0.2047 0.2165 0.0551 0.0630 Millimeters Min. Max. 2.20 2.80 *2.30 1.14 0.88 5.20 5.50 1.40 1.60 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: * Lead: KFC; tin plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MTP9575J3 CYStek Product Specification |
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