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RKV604KL
Variable Capacitance Diode for VCO
REJ03G1363-0100 Rev.1.00 Apr 05, 2006
Features
* High capacitance ratio. (n = 1.73 to 2.10) * Low series resistance. (rs = 0.70 max) * Extremely small Flat Lead Package (EFP) is suitable for surface mount design.
Ordering Information
Type No. RKV604KL Laser Mark A Package Name EFP Package Code PXSF0002ZA-A
Pin Arrangement
Cathode mark Mark 1
A -
2 1. Cathode 2. Anode
Rev.1.00 Apr 05, 2006 page 1 of 4
RKV604KL
Absolute Maximum Ratings
(Ta = 25C)
Item Reverse voltage Junction temperature Storage temperature Symbol VR Tj Tstg Value 15 125 -55 to +125 Unit V C C
Electrical Characteristics
(Ta = 25C)
Item Reverse current Capacitance Capacitance ratio Series resistance Symbol IR1 IR2 C1 C3 n rS Min -- -- 2.35 1.22 1.73 -- Typ Max 10 50 2.70 1.42 2.10 0.70 Unit nA pF -- Test Condition VR = 15 V VR = 15 V, Ta = 60C VR = 1 V, f = 1 MHz VR = 3 V, f = 1 MHz C1/C3 VR = 1 V, f = 470 MHz
Note: For EFP package, the material of lead is exposed for cutting plane. There for, soldering nature of lead tip part is considered as unquestioned. Please kindly consider soldering nature.
Rev.1.00 Apr 05, 2006 page 2 of 4
RKV604KL
Main Characteristic
10-6 10
-7
4.5 f = 1MHz 4.0 3.5
Reverse current IR (A)
Capacitance C (pF)
0 4 8 12 16 20
10-8 10-9 10-10 10-11 10
-12
3.0 2.5 2.0 1.5 1.0 0.5 0 0.1 1 Reverse voltage VR (V) Fig.2 Capacitance vs. Reverse voltage 10
10-13
Reverse voltage VR (V) Fig.1 Reverse current vs. Reverse voltage
1.0 f = 470MHz 0.8
Series resistance rS ()
0.6
0.4
0.2
0
0
1
2
3
4
5
Reverse voltage VR (V) Fig.3 Series resistance vs. Reverse voltage
Rev.1.00 Apr 05, 2006 page 3 of 4
RKV604KL
Package Dimensions
Package Name EFP JEITA Package Code RENESAS Code PXSF0002ZA-A Previous Code EFP / EFPV MASS[Typ.] 0.0007g
D b
E
HE
c
A
b
e1
Reference Symbol
Dimension in Millimeters
Pattern of terminal position areas
A b c D E HE b e1
Min 0.44 0.25 0.08 0.55 0.75 0.95
Nom 0.47 0.30 0.13 0.60 0.80 1.00 0.40 1.00
Max 0.50 0.35 0.18 0.65 0.85 1.05
Rev.1.00 Apr 05, 2006 page 4 of 4
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