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| PMBD914 Single high-speed switching diode Rev. 05 -- 26 November 2007 Product data sheet 1. Product profile 1.1 General description Single high-speed switching diode, fabricated in planar technology, and encapsulated in a SOT23 (TO-236AB) small Surface-Mounted Device (SMD) plastic package. 1.2 Features I High switching speed: trr 4 ns I Low leakage current I Repetitive peak reverse voltage: VRRM 100 V I Low capacitance: Cd 1.5 pF I Reverse voltage: VR 100 V I Small SMD plastic package 1.3 Applications I High-speed switching 1.4 Quick reference data Table 1. Symbol IF VR trr [1] [2] Quick reference data Parameter forward current reverse voltage reverse recovery time [2] Conditions [1] Min - Typ - Max 215 100 4 Unit mA V ns Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. When switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA. NXP Semiconductors PMBD914 Single high-speed switching diode 2. Pinning information Table 2. Pin 1 2 3 Pinning Description anode not connected cathode 1 2 3 1 3 2 006aaa764 Simplified outline Symbol 3. Ordering information Table 3. Ordering information Package Name PMBD914 Description plastic surface-mounted package; 3 leads Version SOT23 Type number 4. Marking Table 4. PMBD914 [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China Marking codes Marking code[1] *5D Type number 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VRRM VR IF IFRM IFSM Parameter repetitive peak reverse voltage reverse voltage forward current repetitive peak forward current non-repetitive peak forward current square wave tp = 1 s tp = 1 ms tp = 1 s [2] [1] Conditions Min - Max 100 100 215 500 Unit V V mA mA - 4 1 0.5 A A A PMBD914_5 (c) NXP B.V. 2007. All rights reserved. Product data sheet Rev. 05 -- 26 November 2007 2 of 10 NXP Semiconductors PMBD914 Single high-speed switching diode Table 5. Limiting values ...continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Ptot Tj Tstg [1] [2] [3] Parameter total power dissipation junction temperature storage temperature Conditions Tamb 25 C [1][3] Min -65 Max 250 150 +150 Unit mW C C Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Tj = 25 C prior to surge. Soldering point of cathode tab. 6. Thermal characteristics Table 6. Symbol Rth(j-a) Rth(j-t) [1] [2] Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to tie-point Conditions in free air [1] Min - Typ - Max 500 330 Unit K/W K/W [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Soldering point of cathode tab. 7. Characteristics Table 7. Characteristics Tamb = 25 C unless otherwise specified. Symbol VF Parameter forward voltage Conditions IF = 1 mA IF = 10 mA IF = 50 mA IF = 150 mA IR reverse current VR = 25 V VR = 75 V VR = 25 V; Tj = 150 C VR = 75 V; Tj = 150 C Cd trr VFR [1] [2] Min [1] [2] Typ - Max 715 855 1 1.25 25 1 30 50 1.5 4 1.75 Unit mV mV V V nA A A A pF ns V diode capacitance reverse recovery time forward recovery voltage f = 1 MHz; VR = 0 V - When switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA. When switched from IF = 10 mA; tr = 20 ns. PMBD914_5 (c) NXP B.V. 2007. All rights reserved. Product data sheet Rev. 05 -- 26 November 2007 3 of 10 NXP Semiconductors PMBD914 Single high-speed switching diode 300 IF (mA) (1) (2) (3) mbg382 102 IFSM (A) 10 mbg704 200 100 1 0 10-1 0 1 VF (V) 2 1 10 102 103 tp (s) 104 (1) Tamb = 150 C; typical values (2) Tamb = 25 C; typical values (3) Tamb = 25 C; maximum values Based on square wave currents. Tj = 25 C; prior to surge Fig 1. Forward current as a function of forward voltage mga884 Fig 2. Non-repetitive peak forward current as a function of pulse duration; maximum values mbg446 105 0.8 Cd (pF) IR (nA) 104 (1) 0.6 103 (2) 0.4 (3) 102 0.2 10 0 0 100 Tj (C) 200 0 4 8 12 VR (V) 16 (1) VR = 75 V; maximum values (2) VR = 75 V; typical values (3) VR = 25 V; typical values f = 1 MHz; Tamb = 25 C Fig 3. Reverse current as a function of junction temperature Fig 4. Diode capacitance as a function of reverse voltage; typical values PMBD914_5 (c) NXP B.V. 2007. All rights reserved. Product data sheet Rev. 05 -- 26 November 2007 4 of 10 NXP Semiconductors PMBD914 Single high-speed switching diode 250 IF (mA) 200 msa562 150 100 50 0 0 50 100 150 200 Tamb (C) FR4 PCB, standard footprint Fig 5. Forward current as a function of ambient temperature; derating curve 8. Test information tr D.U.T. RS = 50 V = VR + IF x RS IF SAMPLING OSCILLOSCOPE Ri = 50 VR mga881 tp t 10 % + IF trr t 90 % input signal output signal (1) (1) IR = 1 mA Fig 6. Reverse recovery time test circuit and waveforms I 1 k 450 I 90 % V RS = 50 D.U.T. OSCILLOSCOPE Ri = 50 10 % t tr tp input signal VFR t output signal mga882 Fig 7. Forward recovery voltage test circuit and waveforms PMBD914_5 (c) NXP B.V. 2007. All rights reserved. Product data sheet Rev. 05 -- 26 November 2007 5 of 10 NXP Semiconductors PMBD914 Single high-speed switching diode 9. Package outline 3.0 2.8 3 1.1 0.9 0.45 0.15 2.5 1.4 2.1 1.2 1 2 1.9 Dimensions in mm 0.48 0.38 0.15 0.09 04-11-04 Fig 8. Package outline SOT23 (TO-236AB) 10. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PMBD914 [1] Package SOT23 Description 4 mm pitch, 8 mm tape and reel Packing quantity 3000 -215 10000 -235 For further information and the availability of packing methods, see Section 14. PMBD914_5 (c) NXP B.V. 2007. All rights reserved. Product data sheet Rev. 05 -- 26 November 2007 6 of 10 NXP Semiconductors PMBD914 Single high-speed switching diode 11. Soldering 2.90 2.50 0.85 3.00 0.85 1.30 2 1 solder lands 2.70 3 solder resist solder paste occupied area 0.60 (3x) Dimensions in mm 0.50 (3x) 0.60 (3x) 1.00 3.30 sot023 Fig 9. Reflow soldering footprint SOT23 (TO-236AB) 3.40 1.20 (2x) solder lands solder resist occupied area 2 1 3 4.60 4.00 1.20 Dimensions in mm 2.80 4.50 preferred transport direction during soldering sot023 Fig 10. Wave soldering footprint SOT23 (TO-236AB) PMBD914_5 (c) NXP B.V. 2007. All rights reserved. Product data sheet Rev. 05 -- 26 November 2007 7 of 10 NXP Semiconductors PMBD914 Single high-speed switching diode 12. Revision history Table 9. Revision history Release date 20071126 Data sheet status Product data sheet Change notice Supersedes PMBD914_4 Document ID PMBD914_5 Modifications: * * * * * * * * * * * * The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Section 1.2 "Features": VRRM maximum value changed from 85 V to 100 V Section 1.2 "Features": VR maximum value changed from 70 V to 100 V Table 1 "Quick reference data": added Table 5 "Limiting values": VRRM maximum value changed from 85 V to 100 V Table 5 "Limiting values": VR maximum value changed from 70 V to 100 V Figure 6: figure title amended Figure 8: superseded by minimized package outline drawing Section 10 "Packing information": added Section 11 "Soldering": added Section 13 "Legal information": updated Product specification Product specification Product specification Product specification PMBD914_3 PMBD914_2 PMBD914_1 - PMBD914_4 PMBD914_3 PMBD914_2 PMBD914_1 20040106 19990511 19960918 19960404 PMBD914_5 (c) NXP B.V. 2007. All rights reserved. Product data sheet Rev. 05 -- 26 November 2007 8 of 10 NXP Semiconductors PMBD914 Single high-speed switching diode 13. Legal information 13.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 13.3 Disclaimers General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com PMBD914_5 (c) NXP B.V. 2007. All rights reserved. Product data sheet Rev. 05 -- 26 November 2007 9 of 10 NXP Semiconductors PMBD914 Single high-speed switching diode 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Packing information. . . . . . . . . . . . . . . . . . . . . . 6 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Contact information. . . . . . . . . . . . . . . . . . . . . . 9 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 26 November 2007 Document identifier: PMBD914_5 |
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