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ST7GEME4
Full-speed USB MCU with smartcard firmware and EMV/non-EMV interface
Features
24
Clock, reset and supply management - Low voltage reset - Halt power saving mode - PLL for generating 48 MHz USB clock using a 4 MHz crystal USB (Universal Serial Bus) interface - USB 2.0 compliant - CCID V1.0 - Full speed, hubless - Bus-powered, low consumption Serial RS232 interface - Transmission rate: 9.6 Kbps to 115 Kbps - Format: 8-bit, no parity - Auto baud rate - CCID V1.0 on serial TTL link ISO 7816-3 UART interface - 4 Mhz clock generation - Synchronous/Asynchronous protocols (T=0, T=1) - Automatic retry on parity error - Programmable baud rate from 372 to 11.625 clock pulses (D=32/F=372) - Card insertion/removal detection
1
VFQFPN24
SO24(9U)
- Internal Step-up converter for 5V supplied Smartcards (with a current of up to 55mA) using only two external components. - Programmable smartcard internal voltage regulator (1.8 to 3.0 V) with current overload protection and 4 kV ESD protection (Human Body Model) for all smartcard interface I/Os Development tools - Application note on PCB recommendations and component bill of materials - Full hardware/software kit for performance evaluation
Description
The ST7GEME4 is an 8-bit microcontroller dedicated to smartcard reading applications. It has been developed to be the core of smartcard readers communicating through a serial or USB link. It is pre-programmed using Gemplus software, and offers a single integrated circuit solution with very few external components.
Smartcard power supply - Selectable card VCC: 1.8 V, 3 V, and 5 V Table 1. Device summary
Order codes Features ST7GEME4M1 Program memory User RAM + USB data buffer (bytes) Peripherals Operating Supply Package CPU Frequency Operating temperature SO24 4 or 8 MHz 0 to +70 C 16K ROM 512 + 256 USB Full-Speed (7 Ep), TBU, Watchdog timer, ISO 7816-3 Interface 4.0 to 5.5 V VFQFPN24 ST7GEME4U1
September 2007
Rev 2.0
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www.st.com 1
Contents
ST7GEME4
Contents
1 2 3 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 ST7GEME4 implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1 3.2 3.3 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Smartcard interface features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 EMV versus PC/SC-ISO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.1 4.2 4.3 4.4 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Supply and reset characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Clock and timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.4.1 4.4.2 General timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Crystal resonator oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.5 4.6 4.7
Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Smartcard supply supervisor electrical characteristics . . . . . . . . . . . . . . 19 EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.7.1 4.7.2 4.7.3 Functional EMS (electromagnetic susceptibility) . . . . . . . . . . . . . . . . . . 21 Electromagnetic interference (EMI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Absolute maximum ratings (electrical sensitivity) . . . . . . . . . . . . . . . . . 23
4.8
Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 24
5
Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.1 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
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ST7GEME4
List of tables
List of tables
Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. Table 24. Table 25. Table 26. Table 27. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Technical features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Current injection on I/O port and control pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 I/O port pins characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 LED pins characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Low voltage detector and supervisor characteristics (LVDS) . . . . . . . . . . . . . . . . . . . . . . . 16 General timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 External clock source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Crystal resonator oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Typical crystal resonator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Recommended values for 4 MHz crystal resonator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 RAM and hardware registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Smartcard supply supervisor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 USB DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 USB full speed electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 24-lead very thin fine pitch quad flat no-lead 5x5mm,0.65mm pitch, mechanical data. . . . 25 24-pin plastic small outline package- 300-mil width, mechanical data . . . . . . . . . . . . . . . . 26 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
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List of figures
ST7GEME4
List of figures
Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. ST7GEME4 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 24-lead VFQFPN package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 24-pin SO package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Smartcard interface reference application - 24-pin SO package . . . . . . . . . . . . . . . . . . . . . 9 Typical application with an external clock source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Typical application with a crystal resonator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 USB data signal rise and fall time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 24-lead very thin fine pitch quad flat no-lead 5x5 mm 0.65 mm pitch, package outline . . . 25 24-pin plastic small outline package- 300-mil width, package outline. . . . . . . . . . . . . . . . . 26
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ST7GEME4
Introduction
1
Introduction
The ST7GEME4 device is a member of the ST7 microcontroller family designed for USB applications. All devices are based on a common industry-standard 8-bit core, featuring an enhanced instruction set. The ST7GEME4 is factory-programmed ROM devices and as such are not reprogrammable. It operates at a 4 MHz external oscillator frequency. Under software control, all devices can be placed in Halt mode, reducing power consumption when the application is in idle or stand-by state. The enhanced instruction set and addressing modes of the ST7 offer both power and flexibility to software developers, enabling the design of highly efficient and compact application code. In addition to standard 8-bit data management, all ST7 microcontrollers feature true bit manipulation, 8x8 unsigned multiplication and indirect addressing modes. The ST7GEME4 includes an ST7 Core, up to 16 Kbytes of program memory, up to 512 bytes of user RAM and the following on-chip peripherals:
USB full speed interface with 7 endpoints, programmable in/out configuration and embedded 3.3 V voltage regulator and transceivers (no external components are needed). ISO 7816-3 UART interface with programmable baud rate from 372 clock pulses up to 11.625 clock pulses Smartcard supply block able to provide programmable supply voltage and I/O voltage levels to the smartcards Low voltage reset ensuring proper power-on or power-off of the device (selectable by option) 8-bit timer (TBU)

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Introduction Figure 1. ST7GEME4 block diagram
ST7GEME4
OSCIN OSCOUT
4MHz OSCILLATOR PLL 48 MHz DIVIDER USB DATA BUFFER (256 bytes) 8 MHz or 4 MHz
ADDRESS AND DATA BUS
PORT A
PA[1:0]
LED ISO 7816 UART SUPPLY MANAGER
LED0
USBDP USBDM USBVCC
USB
8-BIT TIMER PA6 VPP
CONTROL 8-BIT CORE ALU LVD RAM (512 Bytes) PROGRAM MEMORY (16K Bytes) 3V/1.8V Vreg DC/DC CONVERTER
DIODE SELF CRDVCC CRDDET CRDIO CRDC4 CRDC8 CRDRST CRDCLK
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ST7GEME4
Pin description
2
Pin description
Figure 2. 24-lead VFQFPN package pinout
DIODE GNDA VDDA
19 18 17 16 15 14 13 7 8 9 10 11 12
SELF
21
GND
24
23
22
CRDVCC CRDRST CRDCLK C4 CRDIO C8
1 2 3 4 5 6
VDD
20
USBVCC DP DM LED0 PA6 VPP
CRDDET
ICCCLK/WAKUP2
ICCDATA/WAKUP2/
OSCIN
NC
Figure 3.
24-pin SO package pinout
DIODE GNDA GND CRDVCC CRDRST CRDCLK C4 CRDIO C8 CRDDET ICCDATA/WAKUP2/ ICCCLK/WAKUP2/P
1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13
OSCOUT SELF VDD VDDA USBVcc DP DM LED0 PA6 VPP OSCOUT OSCIN NC
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Pin description
ST7GEME4
Legend / Abbreviations

Type: I = input, O = output, S = supply In/Output level: CT = CMOS 0.3VDD/0.7VDD with input trigger Output level: HS = 10mA high sink (on N-buffer only) Port and control configuration: - - Input: float = floating, wpu = weak pull-up, int = interrupt, ana = analog Output: OD = open drain, PP = push-pull
Table 2.
Pin number VFQFPN24
Pin description
Level Type Input Pin name Output VCARD supplied Port / Control Input wpu int Output OD PP Main function (after reset) Alternate function
2 3 4 5 6 7 8 9 11 12 13 14 15 16 17 18 19 20 21 22
SO24 5 6 7 8 9 10 11 12 14 15 16 17 18 19 20 21 22 23 24 1
CRDRST CRDCLK C4 CRDIO C8 CRDDET PA0/WAKUP2/ ICCDATA PA1/WAKUP2/ ICCCLK OSCIN OSCOUT VPP PA6 LED0 DM DP USBVCC VDDA VDD SELF DIODE
O O O I/O O I I/O I/O C
T
CT CT CT CT CT C
T
X X X X X X X X
X X X
Smartcard reset Smartcard clock Smartcard C4 Smartcard I/O
X
Smartcard C8 Smartcard detection
CT CT
X X
X X
X X
X X
Port A0 Port A1
Interrupt, In-circuit communication data input Interrupt, In-circuit communication clock input
CT S I O I/O I/O O S S O S CT CT C
T
Input/output oscillator pins. These pins connect a 4 MHz parallel-resonant crystal, or an external source to the on-chip oscillator. Must be held low in normal operating mode. PA6
HS CT CT CT
X
Constant current output USB Data Minus line USB Data Plus line 3.3 V output for USB Power Supply voltage 4-5.5 V Power Supply voltage 4-5.5 V An external inductance must be connected to these pins for the step up converter An external diode must be connected to this pin for the step up converter
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ST7GEME4 Table 2.
Pin number VFQFPN24 Type SO24 Pin name
Pin description Pin description (continued)
Level Output Input VCARD supplied Port / Control Input wpu int Output OD PP Main function (after reset) Alternate function
23 24 1
2 3 4
GNDA GND CDRVCC
S Ground S O CT X Smartcard supply pin
Figure 4.
Smartcard interface reference application - 24-pin SO package
VDD
C1 L1 D1 C3
C4 C5 C6
SELF DIODE VDD GNDA VDDA GND CRDVCC USBVcc DP CRDRST DM CRDCLK LED0 C4 CRDIO PA6 C8 VPP CRDDET OSCOUT PA0 OSCIN NC PA1
VDD C2 R LED D+ DVDD
CL1
CL2
1. Mandatory values for the external components: C1 = 4.7 F; C2 = 100 nF. C1 and C2 must be located close to the chip (refer to Section 4.4.2.). C3 = 1 nF; C4 = 4.7 F ESR 0.5 . C5 : 470 pF; C6 : 100 pF; R : 1.5k; L1 : 10 H, 2 ; Crystal 4.0 MHz; Impedance max100 D1: BAT42 SHOTTKY.
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ST7GEME4 implementation
ST7GEME4
3
ST7GEME4 implementation
The ST7GEME4 has been developed to offer a complete ready-to-use firmware solution which allows fast development and rapid time-to-market of smartcard reader applications. It offers a single IC solution and simplifies the integration of smartcard interfaces into electronic devices such as computers, POS terminals, mobile phones, PDAs, home routers, and set-top boxes. Pre-programmed with communication software from our partner GEMPLUS, the ST7GEME4 is a complete firmware solution controlling the communication between ISO 7816 1-2-3-4 cards and a host system. An evaluation kit and reference design with a complete bill of materials and PCB recommendations are available. The ST7GEME4 complies with EMVCo/EMV2000 standards. Software support and engineering expertise in system integration and PCB design are available as additional services.
3.1
Functionality
The core functionality of ST7GEME4 resides in its pre-programmed software embedded in ROM memory. GemCoreTM technology manages the communication protocol to/from the host computer and the external card. Basic features and compliance are described in the features section and in Table 3 on page 11. A dedicated analog block provides smartcard power supplies 1.8 V, 3 V, and 5 V necessary to interface with different card voltages available on the market. Voltages are selected by software. External LEDs can also be directly connected to dedicated I/Os. A dedicated UART interface provides an ISO 7816 communication port for connection with the smartcard connector. A full-speed USB interface port allows external connection to a host computer. An optional RS232 connection is also available on dedicated I/Os.
3.2
Smartcard interface features
The ST7GEME4 firmware includes the following features:

Compatibility with asynchronous cards Compatibility with T=0 and T=1 protocols Compatibility with EMV and PC/SC modes. Compatibility with ISO 7816-3 and 4 and ability to supply the cards with 5V, 3V or 1.8V (class A, B or C cards, respectively) Resume/wake-up mode upon smartcard insertion/removal
Further details on smartcard management can be found in "Gemcore USB Pro reference manual" from Gemplus. The reader is able to communicate with smartcards up to the maximum baud rate allowed, namely 344 086 bps (TA1=16) for a clock frequency of 4 MHz. Because the size of the smartcard buffer is 261 bytes, care must be taken not to exceed this size during APDU exchanges when the protocol in use is T=1.
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ST7GEME4
ST7GEME4 implementation
3.3
EMV versus PC/SC-ISO mode
The ST7GEME4 supports two operating modes:

An EMV mode, based on the EMV4.1 specifications A PC/SC-ISO mode which allows to manage of a smartcard according to the PC/SC and ISO 7816-3 standards
The default mode is PC/SC, however, the reader can switch between EMV and PC/SC-ISO modes. GemCore2000 is a utility in charge of managing the switching between the two modes. When the utility is activated, the reader attempts EMV mode management whenever a smartcard is inserted. If reading is successful, PC/SC mode will not be available. Caution: The activation of the GemCore2000 utility must be done before any card command. Any activation of the GemCore2000 utility is not recommended unless the reader is reset. The EMV mode fails if:

The smartcard has not sent an EMV-compliant answer to reset (ATR) Negotiation of the buffer size with a T=1 card has failed
Using PC/SC-ISO mode with GemCore2000
The reader switches to PC/SC mode after the application or the driver has sent the appropriate dedicated command to the reader (with a proprietary Escape command). In this case, the reader remains in PC/SC mode as long as the card remains in the reader. Whenever the EMV mode fails, the smartcard is powered off. After the host application has sent the PC/SC switch (proprietary) Escape command, the application must send a new Card Power On command. When the reader deals with an EMV card, the data exchanged between the reader and the host consists of short APDU messages. When the card is not EMV-compliant and the reader is set to PC/SC-ISO mode, the reader exchanges TPDU messages with the host. Restriction: character level and the extended APDU are not implemented in ST7GEME4 solution. Table 3. Technical features
Description Characteristics - Microprocessor cards - T=0, T=1 protocols - Transmission rate: 2 Kbps to 344 Kbps - Through a comprehensive API - 5V/55mA and 3V/50mA and 1.8V/20mA - Short circuit current limitation - Power up/power down control sequences - Card insertion/extraction detection - 4 kV Human Body Model
Features
Supported smartcards
Asynchronous Synchronous Smartcard power supply
Smartcard electrical interface
Smartcard management ESD protection on card I/O
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ST7GEME4 implementation Table 3. Technical features (continued)
ST7GEME4
USB and serial versions Drivers
Microsoft Windows 2000/XP/Server 2003 Microsoft Windows CE 4.1/4.2/5.0 Linux Red Hat/SUSE/Debian Microsoft Windows XP 64-bit on AMD64 and EMT64 - Microsoft Windows Server 2003 64-bit - Mac OS 10.3/10.4 - Microsoft Windows 2000/XP/Server 2003 - Microsoft Windows Vista (beta version) - Mac OS 10.3/10.4 - CCID V1.0 - Full speed, hubless - Bus powered, low consumption - Transmission rate: 9.6 Kbps to 115 Kbps - Format: 8-bit, no parity - Auto baud rate - CCID V1.0 on serial TTL link - Operating range: 0 to +70C - Storage: -65 to +150C - RoHS compliant
- - - -
Compliance with class drivers
USB interface
USB 2.0 compliant
Serial host interface
Serial asynchronous link Communication protocol Temperature range
Other features Environmental standard
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ST7GEME4
Electrical characteristics
4
4.1
Electrical characteristics
Absolute maximum ratings
The ST7GEME4 contains circuitry to protect the inputs against damage due to high static voltages. However it is advisable to take normal precautions to avoid applying any voltage higher than the specified maximum rated voltages. For proper operation it is recommended that VI and VO be higher than VSS and lower than VDD. Reliability is enhanced if unused inputs are connected to an appropriate logic voltage level (VDD or VSS).
Power considerations
The average chip-junction temperature, TJ, in Celsius can be obtained by the following equation:
T J = T A + PD x RthJA
where: TA = Ambient temperature RthJA = Package thermal resistance (junction-to ambient) PD = PINT + PPORT PINT = IDD x VDD (chip internal power) PPORT = Port power dissipation determined by the user Stresses above those listed as "absolute maximum ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these conditions is not implied. Exposure to maximum rating for extended periods may affect device reliability. Table 4. Absolute maximum ratings
Ratings Supply voltage Input voltage Output voltage ESD susceptibility ESD susceptibility for card pads Total current into VDD_i (source) Total current out of VSS_i (sink) Value 6.0 VSS - 0.3 to VDD + 0.3 VSS - 0.3 to VDD + 0.3 2000 4000 250 250 Unit V V V V V mA
Symbol VDD - VSS VIN VOUT ESD ESDCard IVDD_i IVSS_i
Warning:
Direct connection to VDD or VSS of the I/O pins could damage the device in case of program counter corruption (due to unwanted change of the I/O configuration). To guarantee safe conditions, this connection has to be done through a typical 10k pull-up or pull-down resistor.
13/28
Electrical characteristics Table 5.
Symbol RthJA TJmax TSTG PDmax
ST7GEME4
Thermal characteristics
Ratings Package thermal resistance Max. junction temperature Storage temperature range Power dissipation VFQFPN24 SO24 VFQFPN24 SO24 Value 42 80 150 -65 to +150 600 500 Unit C/W C/W C C mW mW
4.2
Recommended operating conditions
Table 6.
Symbol VDD fOSC TA
General operating conditions
Parameter Supply voltage External clock source Ambient temperature range 0 Conditions Min 4.0 4 70 Typ Max 5.5 Unit V MHz C
Operating conditions are given for TA = 0 to +70 C unless otherwise specified. Table 7.
Symbol
Current injection on I/O port and control pins(1)
Parameter Total positive injected current(2)(3) Conditions VEXTERNAL>VDD (Standard I/Os) VEXTERNAL>VCRDVCC (Smartcard I/Os) Digital pins Analog pins 20 mA Min Typ Max Unit
IINJ+
IINJ-
Total negative injected current VEXTERNAL20
mA
1. When several inputs are submitted to a current injection, the maximum injected current is the sum of the positive (resp. negative) currents (instantaneous values). 2. Positive injection. The IINJ+ is done through protection diodes insulated from the substrate of the die. 3. For SmartCard I/Os, VCRDVCC has to be considered. 4. The negative injected current, IINJ-, passes through protection diodes which are NOT INSULATED from the substrate of the die. The drawback is a small leakage (few A) induced inside the die when a negative injection is performed. This leakage is tolerated by the digital structure. The effect depends on the pin which is submitted to the injection. Of course, external digital signals applied to the component must have a maximum impedance close to 50k. 5. Location of the negative current injection: Pure digital pins can tolerate 1.6mA. In addition, the best choice is to inject the current as far as possible from the analog input pins.
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ST7GEME4
Electrical characteristics Table 8 characteristics are measured at TA=0 to +70oC, and VDD-VSS=5.5V unless otherwise specified. Table 8.
Symbol
Current consumption(1)
Parameter Supply current in RUN mode
(2)
Conditions fOSC = 4MHz
Min
Typ. 10
Max 15 500
Unit mA
IDD
External ILOAD = 0mA Supply current in suspend mode (USB transceiver enabled) Supply current in Halt mode External ILOAD = 0mA (USB transceiver disabled) 50
A 100
1. All I/O pins are in input mode with a static value at VDD or VSS; clock input (OSCIN) driven by external square wave. 2. CPU running with memory access, all I/O pins in input mode with a static value at VDD or VSS; clock input (OSCIN) driven by external square wave.
Table 9 characteristics are measured at TA=0 to +70oC. Voltage are referred to VSS unless otherwise specified. Table 9.
Symbol VIL VIH VHYS VOL VOH IL RPU tOHL
I/O port pins characteristics
Parameter Input low level voltage Input high level voltage Schmidt trigger voltage hysteresis(1) Output low level voltage for Standard I/O port pins Output high level voltage Input leakage current Pull-up equivalent resistor Output high to low level fall time for high sink I/O port pins (Port D)(2) Output high to low level fall time for standard I/O port pins (Port A, B or C)(2) Output L-H rise time (Port D)(2) Output L-H rise time for standard I/O port pins (Port A, B or C)(2) External interrupt pulse time I=-5mA I=-2mA I=3mA VSStOHL tOLH tOLH tITEXT
Cl=50pF
18 7 19 1 9
23 14 28
ns
tCPU
1. Hysteresis voltage between Schmitt trigger switching levels. Based on characterization results, not tested. 2. Guaranteed by design, not tested in production.
15/28
Electrical characteristics Table 10.
Symbol ILsink ILsink
ST7GEME4
LED pins characteristics
Parameter Low current High current Conditions VPAD > VDD-2.4 VPAD > VDD-2.4 for ROM Min 2 5 6 Typ Max 4 mA 8.4 Unit
4.3
Supply and reset characteristics
Table 11 characteristics are measured at T = 0 to +70 oC, VDD - VSS = 5.5 V unless otherwise specified. Table 11.
Symbol VIT+ VITVhys VtPOR
Low voltage detector and supervisor characteristics (LVDS)
Parameter Reset release threshold (VDD rising) Reset generation threshold (VDD falling) Hysteresis VIT+ - VIT-(1) VDD rise time rate
1)
Conditions
Min
Typ 3.7
Max 3.9
Unit V V mV ms/V
3.3
3.5 200
20
1. Hysteresis voltage between Schmitt trigger switching levels. Based on characterization results, not tested.
4.4
4.4.1
Clock and timing characteristics
General timings
Table 12 characteristics are measured at T = 0 to +70 oC unless otherwise specified. Table 12.
Symbol tc(INST)
General timings
Parameter Instruction cycle time fCPU=4 MHz Interrupt reaction time(2) tv(IT) = tc(INST) + 10(3) 500 10 fCPU=4 MHz 2.5 750 3000 22 5.5 Conditions Min 2 Typ(1) 3 Max 12 Unit tCPU ns tCPU s
tv(IT)
1. Data based on typical application software. 2. Time measured between interrupt event and interrupt vector fetch. tc(INST) is the number of tCPU cycles needed to finish the current instruction execution. 3. tINST is the number of tCPU to finish the current instruction execution.
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ST7GEME4 Table 13.
Symbol VOSCINH VOSCINL
Electrical characteristics External clock source
Parameter OSCIN input pin high level voltage OSCIN input pin low level voltage see Figure 5 15 ns 15 VSSVINVDD 1 A Conditions Min 0.7VDD VSS Typ Max VDD 0.3VDD Unit
V
tw(OSCINH) OSCIN high or low time(1) tw(OSCINL) tr(OSCIN) tf(OSCIN) IL OSCIN rise or fall time(1) OSCx Input leakage current
1. Data based on design simulation and/or technology characteristics, not tested in production.
Figure 5.
VOSCINH VOSCINL
Typical application with an external clock source
90% 10%
tr(OSCIN)
tf(OSCIN)
tw(OSCINH)
tw(OSCINL)
OSCOUT fOSC EXTERNAL CLOCK SOURCE OSCIN
IL
ST7XXX
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Electrical characteristics
ST7GEME4
4.4.2
Crystal resonator oscillators
The ST7 internal clock is supplied with one Crystal resonator oscillator. All the information given in this paragraph are based on characterization results with specified typical external components. In the application, the resonator and the load capacitors have to be placed as close as possible to the oscillator pins in order to minimize output distortion and start-up stabilization time. Refer to the crystal resonator manufacturer for more details (frequency, package, accuracy...).
Table 14.
Symbol fOSC RF CL1 CL2 i2
Crystal resonator oscillator characteristics
Parameter Oscillator Frequency(1) Feedback resistor Recommended load capacitances versus equivalent serial resistance of the crystal resonator (RS) OSCOUT driving current Conditions MP: Medium power oscillator 90 Min Typ 4 150 Max Unit MHz k
See Table 16
(MP oscillator)
22
56
pF
VDD=5V, VIN=VSS (MP oscillator)
1.5
3.5
mA
1. The oscillator selection can be optimized in terms of supply current using an high quality resonator with small RS value. Refer to crystal resonator manufacturer for more details.
Table 15.
Oscillator Crystal
Typical crystal resonator characteristics
Reference SS3-400-3030/30 Freq. Characteristic(1) fOSC=[30ppm25C,30ppmTa], Typ. RS=60 CL1 [pF] 33 CL2 [pF] 33 tSU(osc) [ms](2) 7~10
MP
JAUCH
4 MHz
1. Resonator characteristics given by the crystal resonator manufacturer. 2. tSU(OSC) is the typical oscillator start-up time measured between VDD=2.8 V and the fetch of the first instruction (with a quick VDD ramp-up from 0 to 5 V (<50 s).
Table 16.
Recommended values for 4 MHz crystal resonator
Symbol RSMAX(1) COSCIN COSCOUT Min 20 56 56 Typ 25 47 47 Max 70 22 22 Unit pF
1. RSMAX is the equivalent serial resistor of the crystal (see crystal specification).
18/28
ST7GEME4 Figure 6. Typical application with a crystal resonator
Electrical characteristics
WHEN RESONATOR WITH INTEGRATED CAPACITORS CL1
i2 fOSC OSCIN
RESONATOR CL2 OSCOUT
RF
ST7XXX
4.5
Memory characteristics
Subject to general operating conditions for VDD, fOSC, and TA unless otherwise specified. Table 17.
Symbol VRM
RAM and hardware registers
Parameter Data retention mode(1) Conditions Halt mode (or Reset) Min 2 Typ Max Unit V
1. Minimum VDD supply voltage without losing data stored in RAM (in Halt mode or under Reset) or in hardware registers (only in Halt mode). Not tested in production.
4.6
Smartcard supply supervisor electrical characteristics
Table 18 characteristics are measured at TA = 0 to +70 oC, 4.0 V < VDD - VSS < 5.5 V unless otherwise specified.
Table 18.
Symbol
Smartcard supply supervisor characteristics
Parameter Conditions Min Typ Max Unit
5 V regulator output (for IEC 7816-3 Class A Cards) VCRDVCC ISC IOVDET tIDET tOFF tON VCRDVCC IVDD SmartCard power supply voltage SmartCard supply current Current overload detection Detection time on current overload VCRDVCC turn-off time VCRDVCC turn-on time VCARD above minimum supply voltage VDD supply current
(2)
4.6
5.00
5.4 55 120(1)
V mA mA s s s V mA
170(1) CLOADmax 4.7F CLOADmax 4.7F 4.52(1) 150
1400(1) 750 500 4.76(1) 100
19/28
Electrical characteristics Table 18.
Symbol
ST7GEME4
Smartcard supply supervisor characteristics (continued)
Parameter Conditions Min Typ Max Unit
3 V regulator output (for IEC 7816-3 Class B Cards) VCRDVCC ISC IOVDET tIDET tOFF tON SmartCard power supply voltage SmartCard supply current Current overload detection Detection time on current overload VCRDVCC turn-off time VCRDVCC turn-on time CLOADmax 4.7F CLOADmax 4.7F 150 170(1) 2.7 3.3 50 100
(1)
V mA mA s s s
1400(1) 750 500
1.8V regulator output (for IEC 7816-3 Class C Cards) VCRDVCC ISC IOVDET tIDET tOFF tON SmartCard power supply voltage SmartCard supply current Current overload detection Detection time on current overload VCRDVCC turn-off time VCRDVCC turn-on time CLOADmax 4.7F CLOADmax 4.7F 150 170(1) 1.65 1.95 20 100(1) 1400(1) 750 500 V mA mA s s s
Smartcard CLKPin VOL VOH TOHL TOLH FVAR FDUTY POL POH ISGND Output low level voltage Output high level voltage Output high to low fall time(1) Output low to high rise time Frequency Duty variation(1)
(1)
I = -50 A I = 50 A Cl = 30 pF Cl = 30 pF
VCRDVCC 45 -0.25 VCRDVCC-0.5 -0.5(3)
-
0.4(3) 20 20 1 55 0.4 VCRDVCC +0.25
V V ns ns % % V V mA
cycle(1)
Signal low perturbation(1) Signal high perturbation(1) Short-circuit to ground(1)
15
Smartcard I/O Pin VIL VIH VOL VOH IL IRPU Input low level voltage Input high level voltage Output low Level Voltage Output high level voltage Input leakage current(1) I = -0.5 mA I = 20 A VSS(3)
24
0.5(3) 0.4(3) VCRDVCC(3) 10 30
V V V V A k
Pull-up equivalent resistance
20/28
ST7GEME4 Table 18.
Symbol TOHL TOLH ISGND
Electrical characteristics Smartcard supply supervisor characteristics (continued)
Parameter Conditions
(1)
Min -
Typ
Max 0.8 0.8
Unit s s mA
Output high to low fall time
Cl = 30 pF Cl = 30 pF
Output low to high rise time(1) Short-circuit to ground
(1)
15 Smartcard RST C4 and C8 Pin
VOL VOH TOHL TOLH ISGND
Output low Level Voltage Output high level voltage Output high to low fall time Output low to high rise Short-circuit to
(1)
I = -0.5 mA I = 20 A Cl = 30 pF Cl = 30 pF
VCRDVCC-0.5(3) -
-
0.4 (3) VCRDVCC(3) 0.8 0.8
V V s s mA
time(1)
ground(1)
15
1. Guaranteed by design. 2. VDD = 4.75 V, Card consumption = 55mA, CRDCLK frequency = 4MHz, LED with a 3mA current, USB in reception mode and CPU in WFI mode. 3. Data based on characterization results, not tested in production.
4.7
EMC characteristics
Susceptibility tests are performed on a sample basis during product characterization.
4.7.1
Functional EMS (electromagnetic susceptibility)
Based on a simple running application on the product (toggling 2 LEDs through I/O ports), the product is stressed by two electromagnetic events until a failure occurs (indicated by the LEDs).
ESD: electrostatic discharge (positive and negative) is applied on all pins of the device until a functional disturbance occurs. This test conforms with the IEC 1000-4-2 standard. FTB: a burst of fast transient voltage (positive and negative) is applied to VDD and VSS through a 100 pF capacitor, until a functional disturbance occurs. This test conforms with the IEC 1000-4-4 standard.
A device reset allows normal operations to be resumed. The test results are given in the table below based on the EMS levels and classes defined in application note AN1709.
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical application environment and simplified MCU software. It should be noted that good EMC performance is highly dependent on the user application and the software in particular. Therefore it is recommended that the user applies EMC software optimization and prequalification tests in relation with the EMC level requested for his application.
21/28
Electrical characteristics
ST7GEME4
Software recommendations
The software flowchart must include the management of runaway conditions such as:

Corrupted program counter Unexpected reset Critical Data corruption (control registers...)
Prequalification trials
Most of the common failures (unexpected reset and program counter corruption) can be reproduced by manually forcing a low state on the RESET pin or the Oscillator pins for 1 second. To complete these trials, ESD stress can be applied directly on the device, over the range of specification values. When unexpected behavior is detected, the software can be hardened to prevent unrecoverable errors occurring (see application note AN1015). Table 19.
Symbol VFESD
EMS characteristics
Parameter Conditions Level/ Class 2B
Voltage limits to be applied on any I/O pin to VDD=5 V, TA=+25 C, fOSC=8 MHz induce a functional disturbance conforms to IEC 1000-4-2 Fast transient voltage burst limits to be VDD=5 V, TA=+25 C, fOSC=8 MHz applied through 100 pF on VDD and VDD pins conforms to IEC 1000-4-4 to induce a functional disturbance
VFFTB
4B
4.7.2
Electromagnetic interference (EMI)
Based on a simple application running on the product (toggling 2 LEDs through the I/O ports), the product is monitored in terms of emission. This emission test is in line with the norm SAE J 1752/3 which specifies the board and the loading of each pin. Table 20.
Symbol
EMI characteristics
Parameter Conditions Monitored frequency band 0.1 MHz to 30 MHz 30 MHz to VDD=5 V, TA=+25 C, 130 MHz conforming to SAE J 1752/3 130 MHz to 1 GHz SAE EMI Level Max vs. [fOSC/fCPU](1) 4/8 MHz 4/4 MHz 19 32 31 4 18 27 26 3.5 dB V Unit
SEMI
Peak level
1. Data based on characterization results, not tested in production.
22/28
ST7GEME4
Electrical characteristics
4.7.3
Absolute maximum ratings (electrical sensitivity)
Based on three different tests (ESD, LU and DLU) using specific measurement methods, the product is stressed in order to determine its performance in terms of electrical sensitivity. For more details, refer to the application note AN1181.
Electrostatic discharge (ESD)
Electrostatic discharges (a positive then a negative pulse separated by 1 second) are applied to the pins of each sample according to each pin combination. The sample size depends on the number of supply pins in the device (3 parts*(n+1) supply pin). The Human Body Model is simulated. This test conforms to the JESD22-A114A standard. Table 21.
Symbol VESD(HBM)
Absolute maximum ratings
Ratings Electrostatic discharge voltage (Human Body Model) Conditions TA=+25 C Maximum value(1) 2000 Unit V
1. Data based on characterization results, not tested in production.
Static and dynamic latch-up
LU: 3 complementary static tests are required on 10 parts to assess the latch-up performance. A supply overvoltage (applied to each power supply pin) and a current injection (applied to each input, output and configurable I/O pin) are performed on each sample. This test conforms to the EIA/JESD 78 IC latch-up standard. For more details, refer to the application note AN1181. DLU: Electrostatic discharges (one positive then one negative test) are applied to each pin of 3 samples when the micro is running to assess the latch-up performance in dynamic mode. Power supplies are set to the typical values, the oscillator is connected as near as possible to the pins of the micro and the component is put in reset mode. This test conforms to the IEC1000-4-2 and SAEJ1752/3 standards. For more details, refer to the application note AN1181. Electrical sensitivities
Parameter Static latch-up class Dynamic latch-up class Conditions TA=+25 C VDD=5.5 V, fOSC=4 MHz, TA=+25 C Class(1) A A
Table 22.
Symbol LU DLU
1. Class description: A Class is an STMicroelectronics internal specification. All its limits are higher than the JEDEC specifications, that means when a device belongs to Class A it exceeds the JEDEC standard. B Class strictly covers all the JEDEC criteria (international standard).
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Electrical characteristics
ST7GEME4
4.8
Communication interface characteristics
Table 23. USB DC electrical characteristics(1)
Symbol Conditions Min. Max. Unit Parameter Input Levels Differential input sensitivity Differential common mode range Single ended receiver threshold Output levels Static output low Static Output high USBVCC: voltage level VOL VOH USBV RL of 1.5 k to 3.6 V RL of 15 k to VSS VDD=5 V 2.8 3.00 0.3 3.6 3.60 V V V VDI VCM VSE I(D+, D-) Includes VDI range 0.2 0.8 1.3 2.5 2.0 V V V
1. RL is the load connected on the USB drivers. All the voltages are measured from the local ground potential.
Figure 7.
USB data signal rise and fall time
Differential Data Lines VCRS
Crossover points
VSS tf tr
Table 24.
USB full speed electrical characteristics
Symbol Conditions Min Max Unit
Parameter Driver characteristics: Rise time Fall time Rise/ fall time matching Output signal crossover Voltage
tr tf trfm VCRS
CL = 50 pF(1) CL = 50 pF tr/tf
(1)
4 4 90 1.3
20 20 110 2.0
ns ns % V
1. Measured from 10% to 90% of the data signal. For more detailed informations, please refer to Chapter 7 (Electrical) of the USB specification (version 1.1).
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ST7GEME4
Package characteristics
5
5.1
Figure 8.
Package characteristics
Package mechanical data
24-lead very thin fine pitch quad flat no-lead 5x5 mm 0.65 mm pitch, package outline
D e 19 18 24 1 e C
E2
b
13 12 b D2 7
6 L
E
L
A1 A
Table 25.
Dim.
24-lead very thin fine pitch quad flat no-lead 5x5mm,0.65mm pitch, mechanical data
mm Min Typ 0.90 0.02 0.25 0.30 5.00 3.50 3.60 5.00 3.50 3.60 0.65 0.35 0.45 0.08 Number of pins 0.55 0.014 3.70 0.138 3.70 0.138 Max 1.00 0.05 0.35 0.010 Min 0.031 inches(1) Typ 0.035 0.001 0.012 0.197 0.142 0.197 0.142 0.026 0.018 0.003 0.022 0.146 0.146 Max 0.039 0.002 0.014
A A1 b D D2 E E2 e L ddd
0.80
N
24
1. Values in inches are converted from mm and rounded to 3 decimal digits.
25/28
Package characteristics Figure 9. 24-pin plastic small outline package- 300-mil width, package outline
D 12 1 h x 45
ST7GEME4
C E H
13
28 A
B
e
A1
ddd A1 L 9U_ME
Table 26.
Dim.
24-pin plastic small outline package- 300-mil width, mechanical data
mm Min Typ Max 2.65 0.30 0.51 0.32 15.60 7.60 1.27 10.00 0.25 0 0.40 10.65 0.75 8 1.27 0.10 Number of pins 0.394 0.010 0 0.016 Min 0.093 0.004 0.013 0.009 0.599 0.291 0.050 0.419 0.030 8 0.050 0.004 inches Typ Max 0.104 0.012 0.020 0.020 0.619 0.299
A A1 B C D E e H h L ddd
2.35 0.10 0.33 0.23 15.20 7.40
N
24
26/28
ST7GEME4
Revision history
6
Revision history
Table 27.
Date 01-Aug-06 10-May-2007
Document revision history
Revision 0.1 1 Initial release Root part number changed from ST7GEM to ST7GEME4. Document reformatted. Modified Figure 1 title. USB host interface replaced by USB interface in Section 1: Introduction and Table 3: Technical features. Updated Figure 9: 24-pin plastic small outline package- 300-mil width, package outline. ddd tolerance and maximum values in inched added in Table 26: 24-pin plastic small outline package- 300-mil width, mechanical data. QFN24 package renamed VFQFPN24. Figure 8: 24-lead very thin fine pitch quad flat no-lead 5x5 mm 0.65 mm pitch, package outline updated to remove A2 and A3 dimensions. Changes
21-Sep-2007
2
27/28
ST7GEME4
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