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HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6108 Issued Date : 1997.09.05 Revised Date : 2001.08.13 Page No. : 1/3 HA8550 PNP EPITAXIAL PLANAR TRANSISTOR Description The HA8550 is designed for use in 2W output amplifier of portable radios in class B push-pull operation. Features * High total power dissipation (PT: 2W, TC=25C) * High collector current (IC: 1.5A) * Complementary to HA8050 Absolute Maximum Ratings * Maximum Temperatures Storage Temperature ....................................................................................................... -55 ~ +150 C Junction Temperature................................................................................................ +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C)................................................................................................... 1 W Total Power Dissipation (Tc=25C) ................................................................................................... 2 W * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage.................................................................................................... -40 V VCEO Collector to Emitter Voltage................................................................................................. -25 V VEBO Emitter to Base Voltage......................................................................................................... -6 V IC Collector Current ..................................................................................................................... -1.5 A IB Base Current ............................................................................................................................ -0.5 A Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) VBE(on) *hFE1 *hFE2 *hFE3 fT Min. -40 -25 -6 45 85 40 100 Typ. Max. -100 -100 -0.5 -1.2 -1 500 Unit V V V nA nA V V V Test Conditions IC=-100uA IC=-2mA IE=-100uA VCB=-35V VEB=-6V IC=-0.8A, IB=-80mA IC=-0.8A, IB=-80mA VCE=-1V, IC=-10mA VCE=-1V, IC=-5mA VCE=-1V, IC=-100mA VCE=-1V, IC=-800mA VCE=-10V, IC=-50mA, f=100MHZ MHz *Pulse Test : Pulse Width 380us, Duty Cycle2% Classification on hFE2 Rank Range HA8550 C 120-200 D 160-320 E 250-500 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 10000 Spec. No. : HE6108 Issued Date : 1997.09.05 Revised Date : 2001.08.13 Page No. : 2/3 Saturation Voltage & Collector Current Saturation Voltage (mV) 1000 VBE(sat) @ IC=10IB 100 hFE 100 10 VCE(sat) @ IC=10IB 10 0.1 1 10 100 1000 10000 1 0.1 1 10 100 1000 10000 Collector Curremt-IC (mA) Collector Current-IC (mA) On Voltage & Collector Current 10000 1000 Cutoff Frequency & Collector Current Cutoff Frequency (MHz) On Voltage (mV) VCE=10V 100 1000 VBE(on) @ VCE=1V 100 1 10 100 1000 10000 10 1 10 100 1000 Collector Current-IC (mA) Collector Current-IC (mA) Capcitance & Reverse-Biased Voltage 100 10000 PT=1ms PT=100ms 1000 Safe Operating Area Capacitance (pF) Cob 10 Collector Current-IC (mA) PT=1s 100 10 1 0.1 1 10 100 1 1 10 100 Reverse-Biased Voltage (V) Forward Voltage-VCE (V) HA8550 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 12 3 Spec. No. : HE6108 Issued Date : 1997.09.05 Revised Date : 2001.08.13 Page No. : 3/3 2 Marking : HSMC Logo Part Number Date Code Rank Product Series 3 Laser Mark HSMC Logo Product Series C D Part Number H I E F G Ink Mark Style : Pin 1.Emitter 2.Base 3.Collector 1 3-Lead TO-92 Plastic Package HSMC Package Code : A *:Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I 1 2 3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2 Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : * Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : * Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 HA8550 HSMC Product Specification |
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