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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE9011-B Issued Date : 1996.03.12 Revised Date : 2000.11.01 Page No. : 1/2 HI210 PNP EPITAXIAL PLANAR TRANSISTOR Description The HI210 is designed for low voltage, low-power, high-gain audio amplifier applications. Absolute Maximum Ratings (Ta=25C) * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature .................................................................................................... +150 C * Maximum Power Dissipation Total Power Dissipation (Tc=25C) .................................................................................... 10 W * Maximum Voltages and Currents BVCBO Collector to Base Voltage ..................................................................................... -40 V BVCEO Collector to Emitter Voltage.................................................................................. -25 V BVEBO Emitter to Base Voltage .......................................................................................... -8 V IC Collector Current ............................................................................................................ -5 A IB Base Current ................................................................................................................... -1 A Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat)1 *VCE(sat)2 *VCE(sat)3 *VBE(sat) *VBE(on) *hFE1 *hFE2 *hFE3 Cob fT Min. -40 -25 -8 70 45 10 65 Typ. Max. -100 -100 -0.3 -0.75 -1.8 -2.5 -1.6 120 Unit V V V nA nA V V V V V Test Conditions IC=-100uA, IE=0 IC=-10mA, IB=0 IE=-100uA, IC=0 VCB=-40V, IE=0 VEB=-8V, IC=0 IC=-500mA, IB=-50mA IC=-2A, IB=-200mA IC=-5A, IB=-1A IC=-5A, IB=-0.1A VCE=-1V, IC=-2A VCE=-1V, IC=-500mA VCE=-1V, IC=-2A VCE=-2V, IC=-5A VCB=-10V, f=1MHz VCE=-10V, IC=-100mA, f=100MHz *Pulse Test : Pulse Width 380us, Duty Cycle2% pF MHz HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-251 Dimension Marking : HSMC Logo Spec. No. : HE9011-B Issued Date : 1996.03.12 Revised Date : 2000.11.01 Page No. : 2/2 A B C D Product Series Rank Part Number Date Code Ink Mark F 3 I E K 2 1 G Style : Pin 1.Base 2.Collector 3.Emitter H J 3-Lead TO-251 Plastic Package HSMC Package Code : I *:Typical DIM A B C D E F Inches Min. Max. 0.0177 0.0217 0.0354 0.0591 0.0177 0.0236 0.0866 0.0945 0.2520 0.2677 0.2677 0.2835 Millimeters Min. Max. 0.45 0.55 0.90 1.50 0.45 0.60 2.20 2.40 6.40 6.80 6.80 7.20 DIM G H I J K Inches Min. Max. 0.2559 *0.1811 0.0354 0.0315 0.2047 0.2165 Millimeters Min. Max. 6.50 *4.60 0.90 0.80 5.20 5.50 Notes : 1.Dimension and tolerance based on our Spec. dated May. 24,1995. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : * Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : * Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 * Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification |
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