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| NUP4060AXV6 4-Line Transient Voltage Suppressor Array This 4-line voltage transient suppressor array is designed for application requiring transient voltage protection capability. It is intended for use in over-transient voltage and ESD sensitive equipment such as cell phones, portables, computers, printers and other applications. This device features a common cathode design which protects four independent lines in a single SOT-563 package. Features http://onsemi.com SOT-563 4-LINE TRANSIENT VOLTAGE SUPPRESSOR PIN ASSIGNMENT D1 D2 VCC 1 2 3 6 5 4 GND D3 GND * Protects up to 4 Lines in a Single SOT-563 Package * ESD Rating: IEC61000-4-2: Level 4 * * * * * * * Contact (8 kV), Air (15 kV) VCC Pin = 16 V Protection D1, D2, and D3 Pins = 6.8 V Protection Low Capacitance (< 7 pF @ 3 V) for D1, D2, and D3 This is a Pb-Free Device Applications Hand Held Portable Applications USB Interface Notebooks, Desktops, Servers SIM Card Protection MARKING DIAGRAM 6 1 SOT-563 CASE 463A STYLE 6 MT MG G 1 MAXIMUM RATINGS (TJ = 25C, unless otherwise specified) Symbol PPK 1 Rating Peak Power Dissipation VCC Diode 8x20 msec double exponential waveform, (Note 1) D1, D2, and D3 Operating Junction Temperature Range Storage Temperature Range Lead Solder Temperature - Maximum (10 seconds) IEC 61000-4-2 Air IEC 61000-4-2 Contact Value 200 20 -40 to 125 -55 to 150 260 15000 8000 Unit W W C C C V MT = Specific Device Code M = Date Code G = Pb-Free Package (Note: Microdot may be in either location) TJ TSTG TL ESD ORDERING INFORMATION Device Package Shipping NUP4060AXV6T1G SOT-563 4000/Tape & Reel (Pb-Free) For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Nonrepetitive current pulse per Figure 1. (c) Semiconductor Components Industries, LLC, 2007 1 January, 2007 - Rev. 1 Publication Order Number: NUP4060/D NUP4060AXV6 ELECTRICAL CHARACTERISTICS (TJ = 25C, unless otherwise specified) Parameter Reverse Working Voltage (D1, D2, and D3) Breakdown Voltage (D1, D2, and D3) Breakdown Voltage (VCC) Reverse Leakage Current (D1, D2, and D3) Reverse Leakage Current (VCC) Capacitance (D1, D2, and D3) (Note 2) IT = 1 mA, (Note 3) IT = 5 mA, (Note 3) VRWM = 3 V VBR = 11 V VR = 3 V, f = 1 MHz (Line to GND) Conditions Symbol VRWM VBR VBR2 IR IR CJ Min - 6.2 15.3 - - - Typ - 6.8 16 0.01 - 7 Max 5.0 7.2 17.1 0.5 0.05 10 Unit V V V mA mA pF 2. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal or greater than the DC or continuous peak operating voltage level. 3. VBR is measured at pulse test current IT. http://onsemi.com 2 NUP4060AXV6 TYPICAL ELECTRICAL CHARACTERISTICS (Diode D1, D2, and D3 only) 100 Ppk, PEAK SURGE POWER (W) % OF RATED POWER OR IPP 110 100 90 80 70 60 50 40 30 20 10 0 10 1 1 10 t, TIME (ms) 100 1000 0 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (C) Figure 1. Pulse Width Figure 2. Power Derating Curve 0.16 TYPICAL CAPACITANCE (pF) 1 MHz FREQUENCY IR, REVERSE LEAKAGE (mA) 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0 -60 -40 -20 0 20 40 60 80 100 T, TEMPERATURE (C) 14 12 10 8 6 4 2 0 0 1 2 3 4 5 6 BIAS VOLTAGE (V) TA = 25C Figure 3. Reverse Leakage versus Temperature Figure 4. Capacitance 100 % OF PEAK PULSE CURRENT 90 80 70 60 50 40 30 20 10 0 tr PEAK VALUE IRSM @ 8 ms PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms HALF VALUE IRSM/2 @ 20 ms IF, FORWARD CURRENT (A) 1 0.1 0.01 tP TA = 25C 0.001 0 20 40 t, TIME (ms) 60 80 0.6 0.8 1.0 1.2 1.4 1.6 1.8 VF, FORWARD VOLTAGE (V) Figure 5. 8 x 20 ms Pulse Waveform Figure 6. Forward Voltage http://onsemi.com 3 NUP4060AXV6 PACKAGE DIMENSIONS SOT-563, 6 LEAD CASE 463A-01 ISSUE F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. MILLIMETERS MIN NOM MAX 0.50 0.55 0.60 0.17 0.22 0.27 0.08 0.12 0.18 1.50 1.60 1.70 1.10 1.20 1.30 0.5 BSC 0.10 0.20 0.30 1.50 1.60 1.70 INCHES NOM MAX 0.021 0.023 0.009 0.011 0.005 0.007 0.062 0.066 0.047 0.051 0.02 BSC 0.004 0.008 0.012 0.059 0.062 0.066 MIN 0.020 0.007 0.003 0.059 0.043 D -X- A L 4 6 5 1 2 3 E -Y- HE b e 5 6 PL M C XY 0.08 (0.003) DIM A b C D E e L HE SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.0 0.0394 1.35 0.0531 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 4 NUP4060/D |
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