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AU9360 USB Multiple Slots Flash Memory Card Reader Controller TRM
Revision 1.2
(c) 1997-2003 Alcor Micro Corp. All Rights Reserved
Copyright Notice Copyright 1997 - 2003 Alcor Micro Corp. All Rights Reserved.
Trademark Acknowledgements The company and product names mentioned in this document may be the trademarks or registered trademarks of their manufacturers. Disclaimer Alcor Micro Corp. reserves the right to change this product without prior notice. Alcor Micro Corp. makes no warranty for the use of its products and bears no responsibility for any error that appear in this document. Specifications are subject to change without prior notice.
Contact Information: Web site: http://www.alcormicro.com/ Taiwan Alcor Micro Corp. 4F, No 200 Kang Chien Rd., Nei Hu, Taipei, Taiwan, R.O.C. Phone: 886-2-8751-1984 Fax: 886-2-2659-7723
Santa Clara Office 2901 Tasman Drive, Suite 206 Santa Clara, CA 95054 USA Phone: (408) 845-9300 Fax: (408) 845-9086
Los Angeles Office 9400 Seventh St., Bldg. A2 Rancho Cucamonga, CA 91730 USA Phone: (909) 483-9900 Fax: (909) 944-0464
Table of Contents
1 Introduction................................................................................. 1 1.1 Description............................................................................ 2 3 4 1 1.2 Features................................................................................ 1 Application Block Diagram............................................................ 3 Pin Assignment............................................................................ 5 System Architecture and Reference Design..................................... 9 4.1 AU9360 Block Diagram............................................................ 9 4.2 Sample Schematics................................................................... 10 5 Electrical Characteristics............................................................... 13 5.1 Absolute Maximum Ratings......................................................... 13 5.2 Recommended Operating Conditions.......................................... 13 5.3 General DC Characteristics......................................................... 13 5.4 DC Electrical Characteristics for 5 volts operation............................ 14 5.5 Crystal Oscillator Circuit Setup for Characterization.......................... 14 5.6 USB Transceiver Characteristics................................................ 15 5.7 ESD Test Results..................................................................... 19 5.8 Latch-Up Test Results............................................................... 20 6 7 Mechanical Information................................................................. 23 Errata.......................................................................................... 25
TABLE OF CONTENTS
i
TABLE OF CONTENTS
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1.0 Introduction
1.1 Description
The AU9360 is a single chip USB flash memory reader controller which supports not only the widely used flash memory cards, such as Compact Flash (CF) card, Micro Drive (MD), SmartMedia Card (SMC), XD Picture Card, Memory Stick (MS), Memory Stick Duo, Memory Stick PRO, Secure Digital (SD) and Multimedia Card (MMC), but also supports NAND type flash as a USB flash disk. It can be used as removable storage disks in enormous data exchange applications between PC and PC or PC and various consumer electronic appliances. The AU9360 reads digital data saved on memory card while users manipulating electronic devices such as digital cameras, MP3 players, PDAs and mobile phones... etc. By the AU9360, users can transfer information such as data, graphics, texts or digital images from one electronic device to another quickly and easily. With AU9360, users' knowledge will be further enhanced by the Plug-and-Play nature built into latest operation systems such as Windows 2000/XP and Mac OS X. By integrating of various analog components, the AU9360 is the most powerful and most effective solution for various flash memory reader.
1.2 Features
Fully compliant with USB v1.1 specification and USB Device Class Definition for Mass Storage, Bulk-Transport v1.0 Fully compliant with Compact Flash (CF) v1.4 Specification Fully compliant with Secure Digital (SD) v1.0 Specification. Fully compliant with Memory Stick (MS) v1.3 Specification. Fully compliant with Memory Stick PRO v1.0 Specification. Fully compliant with Memory Stick ROM Format v1.0 Specification. Fully compliant with Memory Stick Duo Format v1.01 Specification. Fully compliant with Smart Media Card (SMC) Standard 2000 Specification. Support 1 piece NAND type flash memory up to 2Gbit capacity. Support Mask ROM Card capacity from 2MB to 256MB. Work with default driver from Windows ME, Windows XP, Mac OS 9, and Mac OS X. Windows 98, Windows 2000 are supported by vendor driver from Alcor. INTRODUCTION 1
Ping-pong FIFO implementation for concurrent bus operation Support multiple sectors transfer to 4GB to optimize performance Support optional external EEPROM for USB VID, PID and string customization Support slot to slot read/write operation. Support auto-detecting slot with card inserted on Win 2000 without driver. Capable of handling 8 sets of built-in PID, VID and strings to minimize inventory control and improve lead production lead time Support 5 different LEDs for bus activity indication of 5 separated slots. Each slot can be enables/disabled by 5 independent pins to fit all the different card readers' combinations requirement. Integrated 4 power switches and power management circuit for each slot to meet USB 500uA power consumption during suspend with card in the slot. Runs at 12MHz, built-in 48 MHz PLL Built-in 3.3V regulator 100-pin LQFP package
INTRODUCTION
2
2.0 Application Block Diagram
Following is the application diagram of a typical flash memory card reader using AU9360. By connecting the reader to a PC through USB bus, the AU9360 is acting as a bridge between the flash memory card from digital camera, MP3 player, PDA or mobile phone and PC.
Digital Camera
PC with USB Host Controller
MP3 Player
PDA USB 9-in-1 Flash Memory Card Reader CF/MS/MD/S MC/SD/MMC NAND...etc Moble Phones
PC
APPLICATION BLOCK DIAGRAM
3
APPLICATION BLOCK DIAGRAM
4
3.0Pin Assignment
The AU9360 is packed in 100-LQFP-form factor. The following figure shows signal name for each pin and the table in the following page describes each pin in detail.
SMDATA7 SMDATA0 SMDATA2 SMDATA3 SMDATA6
77
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
GPI1 GPI2 XDCDN VCCA GNDA XTAL1 XTAL2 VCC2Card VCC5V VCC3V RSTN USB_DP USB_DM GNDIO
ROMAD14 ROMAD13 ROMAD12 ROMAD11 ROMAD10 ROMAD9 ROMAD8 ROMAD7 ROMAD6 ROMAD5 ROMAD4
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
SMDATA5
76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
EEPDATA
MDATA1
SDDATA
EEPCLK
SDCMD
SMCEN
SDCDN
SDCLK
GPON4
GPON5
GPON7
GPON6
SDWP
GPI0
GPI3
CT1
CT2
CT3
CT4
SMDATA4
SMRBN SMRDN SMCDN SMCLE SMALE SMWRN SMWPN
MSDATA
Alcor Micro AU9360 100 -PIN LQFP
MSCLK MSBS MSINS GNDK VCCK
ROMD7/ SWAUSW ROMD6/ XDWPN
CFRST CFWTN CFOEN CFWEN CFWRN CFRDN CFCDN XDCEN CFD7
ROMD3/XDSLOTEN
ROMD5/FMSLOTEN
ROMD1/VID1
ROMD2 /XDSTREN
ROMD4/LED MODE
ROMAD3
ROMAD2
ROMAD1
ROMAD15
ROMAD0
PWRLED
ROMD0/VID0
GPON3
CFAD3
CFAD2
CFAD1
CFAD0
CFD2
CFD3
CFD4
CFD5
CFD0
CFAD9
CFD1
PIN ASSIGNMENT
CFD6
5
Table 3-1. Pin Descriptions
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
Pin Name GPI1 GPI2 XDCDN VCCA GNDA XTAL1 XTAL2 VCC2Card VCC5V VCC3V RSTN USB_DP USB_DM GNDIO ROMAD14 ROMAD13 ROMAD12 ROMAD11 ROMAD10 ROMAD9 ROMAD8 ROMAD7 ROMAD6 ROMAD5 ROMAD4 ROMAD3 ROMAD15 GPON3 ROMAD2 ROMAD1 ROMAD0 PWRLED ROMD0 / VID0 ROMD1 / VID1 ROMD2 / XDSTREN ROMD3/ XDSLOTEN
I/O Type I I I PWR PWR I O O PWR PWR Input I/O I/O PWR O O O O O O O O O O O O O O O O O O I/O I/O I/O I/O CF card slot enable SM card slot enable Connect to XD Card Detect Analog 3.3V input Ground Crystal Oscillator Input (12MHz)
Description
Crystal Oscillator Output (12MHz) Connect to Card Power 5V power supply Regular 3.3V output/ IO 3.3V input Hardware reset (Active Low) USB D+ USB DGround Connect to External ROM Addr14 Connect to External ROM Addr13 Connect to External ROM Addr12 Connect to External ROM Addr11 Connect to External ROM Addr10 Connect to External ROM Addr9 Connect to External ROM Addr8 Connect to External ROM Addr7 Connect to External ROM Addr6 Connect to External ROM Addr5 Connect to External ROM Addr4 Connect to External ROM Addr3 Connect to External ROM Addr15 General Purpose Output pin, used as activity LED / XD card Access LED blink Connect to External ROM Addr2 Connect to External ROM Addr1 Connect to External ROM Addr0 General Purpose Output pin, used as activity LED / Power LED Connect to External ROM D0 / Selection VID/PID Connect to External ROM D1 / Selection VID/PID Connect to External ROM D2 / XD String Enable Connect to External ROM D3 / XD card slot enable
PIN ASSIGNMENT
6
37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75
ROMD4/ LED MODE ROMD5/ FMSLOTEN CFAD9 CFAD3 CFAD2 CFAD1 CFAD0 CFD0 CFD1 CFD2 CFD3 CFD4 CFD5 CFD6 CFD7 XDCEN CFCDN CFRDN CFWRN CFWEN CFOEN CFWTN CFRST ROMD6/ XDWPN ROMD7/ SWAUSW VCCK GNDK MSINS MSBS MSCLK MSDATA SMWPN SMWRN SMALE SMCLE SMCDN SMRDN SMRBN SMDATA4
I/O I/O O O O O O I/O I/O I/O I/O I/O I/O I/O I/O O I O O O O I O I/O I/O PWR PWR I O O I/O I O O O I O I I/O
Connect to External ROM D4/ LED Mode Selection Connect to External ROM D5/ Flash Slot Enable Connect to CF Card Addr9 Connect to CF Card Addr3 Connect to CF Card Addr2 Connect to CF Card Addr1 Connect to CF Card Addr0 Connect to CF Card Data0 Connect to CF Card Data1 Connect to CF Card Data2 Connect to CF Card Data3 Connect to CF Card Data4 Connect to CF Card Data5 Connect to CF Card Data6 Connect to CF Card Data7 Connect to XD Card Enable Connect to CF Card Card Detect Connect to CF Card IORD Connect to CF Card IOWR Connect to CF Card WE Connect to CF Card OE Connect to CF Card WAIT Connect to CF Card Reset Connect to External ROM D6 / XD Write protection (protect=0, not protect=1) Connect to External ROM D7/ Software auto switch disk for win 2000 (Enable=0, Disable=1). Core 3.3V Input Ground Connect to MemoryStick Card INS Connect to MemoryStick Card BS Connect to MemoryStick Card SCLK Connect to MemoryStick Card DATA Connect to SmartMedia Card Write Protect Connect to SmartMedia Card Write Enable Connect to SmartMedia Card Address Latch Enable Connect to SmartMedia Card Command Latch Enable Connect to SmartMedia Card Card Detect Connect to SmartMedia Card Read Enable Connect to SmartMedia Card Ready/Busy Output Connect to SmartMedia Card Data 4
PIN ASSIGNMENT
7
76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100
SMDATA5 SMDATA6 SMCEN EEPCLK EEPDATA SMDATA3 SMDATA2 SMDATA1 SMDATA0 SMDATA7 SDCMD SDCLK SDDATA SDCDN SDWP GPON7 GPON6 GPON5 GPON4 GPI3 CT4 CT3 CT2 CT1 GPI0
I/O I/O O O I/O I/O I/O I/O I/O I/O I/O O I/O I I O O O O I I I I I I
Connect to SmartMedia Card Data5 Connect to SmartMedia Card Data 6 Connect to SM Card Enable Connect to EEPROM Serial Clock Connect to EEPROM Serial Data Connect to SmartMedia Card Data 3 Connect to SmartMedia Card Data 2 Connect to SmartMedia Card Data 1 Connect to SmartMedia Card Data 0 Connect to SmartMedia Card Data 7 Connect to SD CMD Connect to SD CLK Connect to SD Data Connect to SD Card Detect Connect to SD Write Protect General Purpose Output pin, used as activity LED / MS card Access General Purpose Output pin, used as activity LED / SM card Access General Purpose Output pin, used as activity LED / CF card Access General Purpose Output pin, used as activity LED / SD card Access MS card slot enable ECC Selection ('0'=Disable, '1'=Enable) Connect to ground ROM Selection ('0' = Internal ROM, '1'=External ROM) Connect to ground SD card slot enable
PIN ASSIGNMENT
8
4.0 System Architecture and Reference Design
4.1 AU9360 Block Diagram
Alcor Micro - AU9360 Flash Memory Card Reader Controller Chip Block Diagram
USB Upstream Port
XCVR
USB SIE
RAM
CF/CF/ SMC/ MS/ /MS PRO/ MMC/SD/ FM /XD Control FIFO
CF MD SMC MS MS PRO MS Duo SD MMC Flash Memory (FM) Other
Processor
ROM
Arbitrator
EEPROM Control
3.3 V Card Power
3.3 V Voltage Regulator /Power Switch
12MHz XTAL
EEPROM
SYSTEM ARCHITECTURE AND REFERENCE DESIGN
9
4.2 Sample Schematics
GPI0 CT1 CT2 CT3 CT4 GPI3 GPON4 GPON5 GPON6 GPON7 SDWP SDCDN SDDATA SDCLK SDCMD SMDATA7 SMDATA0 SMDATA1 SMDATA2 SMDATA3 EEPDATA EEPCLK SMCEN SMDATA6 SMDATA5
CT2: ROM CT4: ECC GPI0: SD GPI1: CF GPI2: SM GPI3: MS
Selection Selection card slot card slot card slot card slot
('0'= Internal '1'= External ROM) ( '0'= Disable.'1'= Enable) enable enable enable enable
U1
SMDATA[0..7] Q3 MOSFET P SDPWR VCC2CARD
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
SDCDN 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 SMDATA4 SMRBN SMRDN SMCDN SMCLE SMALE SMWRN SMWPN MSDATA MSCLK CFPWR MSBS MSINS R4 GNDK VCCK ROMD7/SWAUSW ROMD6/XDWPN CFRST MSINS 100K CFWTN CFOEN CFWEN CFWRN CFRDN CFCDN XDCEN CFD7 Q4 MOSFET P SMPWR VCC2CARD
VCC2CARD VCC3.3 VCC FB C3 J1 VCC DATADATA+ GND FGND1 1 2 3 4 5 0.1UF F2 C4 1UF 10UF 1.5K R2 R3 39 39 0.1UF R1 FB C1 F1 C2
GPI1 GPI2 XDCDN VCCA GNDA XTAL1 XTAL2 VCC5V
ROMAD3 ROMAD15 GPON3 ROMAD2 ROMAD1 ROMAD0 PWRLED ROMD0/VID0 ROMD1/VID1 ROMD2/XDSTREN ROMD3/XDSLOTEN ROMD4/LED MODE ROMD5/FMSLOTEN CFAD9 CFAD3 CFAD2 CFAD1 CFAD0 CFD0 CFD1 CFD2 CFD3 CFD4 CFD5 CFD6
ROMAD14 ROMAD13 ROMAD12 ROMAD11 ROMAD10 ROMAD9 ROMAD8 ROMAD7 ROMAD6 ROMAD5 ROMAD4
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
GPI1 GPI2 XDCDN VCCA GNDA XTAL1 XTAL2 VCC2CARD VCC5V VCC3V RSTN USB_DP USB_DM GNDIO ROMAD14 ROMAD13 ROMAD12 ROMAD11 ROMAD10 ROMAD9 ROMAD8 ROMAD7 ROMAD6 ROMAD5 ROMAD4
GPI0 CT1 CT2 CT3 CT4 GPI3 GPON4 GPON5 GPON6 GPON7 SDWP SDCDN SDDATA SDCLK SDCMD SMDATA7 SMDATA0 SMDATA1 SMDATA2 SMDATA3 EEPDATA EEPCLK SMCEN SMDATA6 SMDATA5
AU9360 100pin
SMDATA4 SMRBN SMRDN SMCDN SMCLE SMALE SMWRN SMWPN MSDATA MSCLK MSBS MSINS GNDK VCCK ROMD7/SWAUSW ROMD6/XDWPN CFRST CFWTN CFOEN CFWEN CFWRN CFRDN CFCDN XDCEN CFD7
SMCDN
Q5 MOSFET P MSPWR VCC2CARD
R8
100K C22 0.1UF
VCC
Optional,if external rom selected
U2 ROMAD0 ROMAD1 ROMAD2 ROMAD3 ROMAD4 ROMAD5 ROMAD6 ROMAD7 ROMAD8 ROMAD9 ROMAD10 ROMAD11 ROMAD12 ROMAD13 ROMAD14 ROMAD15 10 9 8 7 6 5 4 3 25 24 21 23 2 26 27 1 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 D0 D1 D2 D3 D4 D5 D6 D7 11 12 13 15 16 17 18 19 ROMD0/VID0 ROMD1/VIC1 ROMD2/XDSTREN ROMD3/XDSLOTEN ROMD4/LED MODE ROMD5/FMSLOTEN ROMD6/XDWPN ROMD7/SWAUSW
R9 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 VCC2CARD ROMAD3 ROMAD15 GPON3 ROMAD2 ROMAD1 ROMAD0 PWRLED ROMD0/VID0 ROMD1/VID1 ROMD2/XDSTREN ROMD3/XDSLOTEN ROMD4/LED MODE ROMD5/FMSLOTEN CFAD9 CFAD3 CFAD2 CFAD1 CFAD0 CFD0 CFD1 CFD2 CFD3 CFD4 CFD5 CFD6
100K
MOSFET P Q7 CFCDN R5 100K 9012 3 R7 100K 2 Q2 9013 1 CFPWR Q1
VCC3.3 OE/VPP CE W27E512 22 20 PWRLED VCC VCC5V C9 VCC3.3 FB C10 0.1UF FB F6 F4 VCCK C11 0.1UF GNDK Size A4 Date: Document Number C6 0.1UF FB F5 FB F3 C7 0.1UF GNDA VCCA
C5
18PF R10 Y1
XTAL1
C8
18PF
1M
12MHZ XTAL2
Disclaimer: This schematic is for reference only. Alcor Micro Corp. makes no warranty for the use of its products and bears no responsibility for any error that appear in this document. Specifications are subject to change without notice.
0.1UF
Rev
AU9360 9 in 1 demostration schematics Saturday, April 05, 2003 Sheet 1 of 3
2.41
SYSTEM ARCHITECTURE AND REFERENCE DESIGN
10
VCC3.3 CFPWR JP4 CFD4 CFD6 CT1 CFOEN 1 CT2 SW2 2 3 C12 CT3 1 CT4 SW4 2 3 1 GPI0 SW5 2 3 1 GPI1 SW6 2 3 C16 1 GPI2 SW7 2 3 47PF 1 GPI3 SW8 2 3 MSINS MSCLK MSDATA MSBS 0.1UF C17 TP CFWRN INTRQ CFRST CFAD3 CFAD1 CFD0 47PFCFD2 CFCDN 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 GND CFdata4 CFdata6 CE1N -OE CFaddr8 VCC CFaddr5 CFaddr3 CFaddr1 CFdata0 CFdata2 CDN CFdata11 CFdata13 CFdata15 VS1 IOWRN INTRQ CSEL RESET INDACK SPKR CFdata8 CFdata10 2 CFdata3 4 CFdata5 6 CFdata7 8 CFaddr10 10 CFaddr9 12 CFaddr7 14 CFaddr6 16 CFaddr4 18 CFaddr2 20 CFaddr0 22 CFdata1 24 IOIS16 26 CDN 28 CFdata12 30 CFdata14 32 CE2N 34 IORDN 36 WEN 38 VCC 40 VS2 42 WAITN 44 REGN 46 STSCHG 48 CFdata9 50 GND CFD3 CFD5 CFD7 CFAD9 SDPWR
SDPWR R11 R12 R14
SDPWR
10K 10K SDCMD SDCDN CFAD2 CFAD0 CFD1 TP CFPWR CFRDN CFWEN TP CFWTN C14 47PF C13 SDDATA 0.1UF SDWP C23 SDCLK
100K
JP1 9 1 2 SDCD 3 4 5 6 7 8 SDWP
SD SOCKET 18PF C15 47PF MSPWR
CF CONNECTOR
JP2 VSS BS VCC SDIO RESERVED INS RESERVED SCLK VCC VSS R16 0.1UF 10K MS SOCKET
C19
Optional
SMPWR VCC3.3 VCC3.3 JP3 R17 D1 D2 D3 D4 D5 R22 330 D6 GPON3 GPON4 GPON5 GPON6 C20 GPON7 0.1UF PWRLED 10K EEPCLK EEPDATA VCC3.3 U3 8 A0 7 VCC A1 6 WP A2 5 SCL SDA GND 1 2 3 4 SMCLE SMALE SMWRN SMWPN SMDATA0 SMDATA1 SMDATA2 SMDATA3 SMCDN 1 2 3 4 5 06 07 08 09 10 11 GND CLE ALE -WE -WP D0 D1 D2 D3 GND -CD VCC D4 D5 D6 D7 LVD GND R/-B -RE -CE VCC 12 13 14 15 16 17 18 19 20 21 22 R23 SMC CONNECTOR C21 0.1UF
SMDATA4 SMDATA5 SMDATA6 SMDATA7 SMRBN SMRDN SMCEN1
24C02 or compatible
VCC3.3
470K
Disclaimer: This schematic is for reference only. Alcor Micro Corp. makes no warranty for the use of its products and bears no responsibility for any error that appear in this document. Specifications are subject to change without notice.
SMPWR
R25
47K
Size A4 Date:
Document Number AU9360 9 in 1 demostration schematics Saturday, April 05, 2003 Sheet 2 of 3
Rev
2.41
ELECTRICAL CHARACTERISTICS
11
VCC3.3
XDPWR 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
JP5 VCC2CARD NC VCC D7 D6 D5 D4 D3 D2 D1 D0 GND -WP -WE ALE CLE -CE -RE R/-B GND -CD HEADER 19 SMDATA[0..7] 29 30 31 32 41 42 43 44 U4 I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 12 VCC 37 VCC
1 ROMD0/VID0 SW9 2 3 1 ROMD1/VID1 SW10 2 3 1 ROMD2/XDSTREN SW11 2 3 1 ROMD3/XDSLOTEN SW12 2 3 1 ROMD4/LED MODE SW13 2 3 1 ROMD5/FMSLOTEN SW14 2 3 1 ROMD6/XDWPN SW15 2 3 1 ROMD7/SWAUSW SW16 2 3
SMDATA[0..7]
VCC2CARD
SMWRN SMALE SMCLE XDCEN1 SMRDN SMRBN XDCDN
6 13 GND 36 VSS VSS
R/B RE CE CLE ALE WE WP
7 8 9 16 17 18 19
SMRBN SMRDN FMCEN SMCLE SMALE VCC2CARD SMWRN
K9F5608U0A-YCB0
XDPWR
Q6 MOSFET P VCC2CARD SMCEN XDCEN XDCDN VCC2CARD U5 1 2A 3B C 6 4 G1 5 G2A G2B 15 FMCEN 14 XDCEN1 13 SMCEN1 12 11 10 9 7
Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7
74HC138 or compatable
Internal ROM only
VID0: Selection VID/PID VID1: Selection VID/PID XDSTREN: XD slot string enable (disable=0, enable=1) XDSLOTEN: XD card slot enable LED MODE: LED Mode Enable(Single LED=1, 5 LED=0) FMSLOTEN: Flash slot enable (disable=0, enable=1) XDWPN: XD Write protect (proect=0, not protect=1) SWAUSW: Software auto switch disk for win 2000 (Enable=0, Disable=1)
Pin 16 connect to vcc2card Pin 8 connect to GND
Size A Date:
Document Number AU9360 9 in 1 demostration schematics Friday, April 11, 2003 Sheet 3 of 3
Rev
2.41
ELECTRICAL CHARACTERISTICS
12
5.0 Electrical Characteristics
5.1 Absolute Maximum Ratings
SYMBOL VCC VIN VOUT TSTG PARAMETER Power Supply Input Voltage Output Voltage Storage Temperature RATING -0.3 to 6.0 -0.3 to VCC+0.3 -0.3 to VCC+0.3 -40 to 125 UNITS V V V
C
5.2 Recommended Operating Conditions
SYMBOL VCC VIN TOPR PARAMETER Power Supply Input Voltage Operating Temperature MIN 4.5 0 -5 TYP 5.0 MAX 5.5 VCC 85 UNITS V V O C
5.3 General DC Characteristics
SYMBOL IIL IIH IOZ CIN COUT CBID PARAMETER Input low current Input high current Tri-state leakage current Input capacitance Output capacitance Bi-directional buffer capacitance CONDITIONS no pull-up or pull-down no pull-up or pull-down MIN -1 -1 -10 TYP MAX 1 1 10 UNITS A A A F F F
4 4 4
ELECTRICAL CHARACTERISTICS
13
5.4 DC Electrical Characteristics for 5 volts operation
( Under Recommended Operating Conditions and VCC=4.5v ~ 5.5v , Tj= -40OC to + 85OC ) SYMBOL PARAMETER CONDITIONS MIN TYP VIL Input Low Voltage TTL VIL Input Low Voltage CMOS VIL Schmitt input Low Voltage TTL 1.10 VIL Schmitt input Low V oltage CMOS 1.84 VIH Input High Voltage TTL 2.2 VIH Input Hight Voltage CMOS 0.7*VCC VIH Schmitt input High Voltage TTL 1.87 VIH Schmitt input High Voltage CMOS 3.22 VOL Output low voltage IOL=2, 4, 8, 12, 16, 24 mA VOH Output high voltage IOH=2, 4, 8, 12, 16, 24 mA 3.5 RI Input Pull-up/down resistance Vil=0V or Vih=VCC 50 MAX UNITS 0.8 V 0.3*VCC V V V V V V V 0.4 V V K
5.5 Crystal Oscillator Circuit Setup for Characterization
The following setup was used to measure the open loop voltage gain for crystal oscillator circuits. The feedback resistor serves to bias the circuit at its quiescent operating point and the AC coupling capacitor, Cs, is much larger than C1 and C2.
ELECTRICAL CHARACTERISTICS
14
5.6 USB Transceiver Characteristics
RECOMMENDED OPERATING CONDITIONS
SYMBOL VCC VI VI/O VO TAMB PARAMETER DC supply voltage DC input voltage range DC input range for I/Os DC output voltage range Operating ambient temperature range in free air CONDITIONS LIMITS MIN MAX 3.0 3.6 0 5.5 0 VCC 0 VCC 0 70 UNIT V V V V C
See DC and AC characteristics for individual device
ABSOLUTE MAXIMUM RATINGS (Notes 1 and 2) In accordance with the Absolute Maximum Rating System, Voltages are referenced to GND (Ground=0v)
SYMBOL VCC IIK VI VI/O IOK VO IO IO ICC, IGND TSTO PTOT PARAMETER DC supply voltage DC input diode current DC input voltage DC input voltage range for I/Os DC output diode current DC output voltage DC output source sink current for VP/VM and RCV pins DC output source or sink current for D+/D- pins DC Vcc or GND current Storage temperature range Power dissipation per package CONDITIONS LIMITS MIN MAX -0.5 +6.5 -50 -0.5 +5.5 -0.5 Vcc +0.5 +/-50 -0.5 Vcc +0.5 +/-15 +/-50 +/-100 +150 UNIT V mA V V mA V mA mA mA C mW
Vi<0 Note 3
Vo> Vcc or Vo<0 Note 3 Vo=0 to Vcc Vo= 0 to Vcc
-60
NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. 2. The performance capability of a high performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150C. 3. The input and output voltage ratings may be exceeded if the input and output clamp current ratings are observed. ELECTRICAL CHARACTERISTICS 15
DC ELECTRICAL CHARACTERISTICS Over recommended operating conditions. Voltages are referenced to GND (Ground=0V).
LIMITS -40C to +85C MIN TYP MAX 0.3 0.4 0.5 1.5 2.0 0.8 1.1 28 34 43 28 35 43 2.2 2.7 2.4 2.8 0.3 0.7 0.4 0.2 330 600 70 9 2 +/0.1 +/-0.5 +/-10 14
SYMBOL VHYS VIH VIL RoH RoL VOH
PARAMETER Hysteresis on inputs HIGH level input LOW level input Output impedance (HIGH state) Output impedance (LOW state) HIGH level output (Note 3) LOW level output (Note 3) Quiescent supply current Supply current in suspend Active supply current (Full Speed) Active supply current (Low Speed) Input leakage current 3-state output OFF-state current
TEST CONDITIONS Vcc=3.0V to 3.6V (Note 3) Vcc=3.0V to 3.6V (Note 3) Vcc=3.0V to 3.6V (Note 3) Note 2 Note 2 Vcc=3.0V Io=6mA Vcc=3.0V Io=4mA Vcc=3.0V Io=100A Vcc=3.0V Io=6mA Vcc=3.0V Io=4mA Vcc=3.0V Io=100A Vcc=3.6V VI=Vcc or GND Io=0 Vcc=3.6V VI=Vcc or GND Io=0 Vcc=3.3V Vcc=3.3V Vcc=3.6V VI=5.5V or GND, not for I/O Pins Vi=Vih or ViL; Vo=Vcc or GND
UNIT V V V ohm ohm V
VOL
V
IQ Isup IFS ILS ILeak IOFF
A A mA mA A A
NOTES: 1. All typical values are at Vcc=3.3V and Tamb=25C. 2. This value includes an external resistor of 24 ohm +/-1%. See "Load D+ and D-" diagram for testing details. 3. All signals except D+ and D-.
ELECTRICAL CHARACTERISTICS
16
AC ELECTRICAL CHARACTERISTICS GND=0V, tR = tF =3.0 ns; CL =50 pF; RL=500 Ohms
SYMBOL PARAMETER WAVEFORM LIMITS (TAMB) 0C to +25C MIN TYP MAX 0 12 0 12 4 9 20 4 9 20 90 110 0C to +70C MIN MAX 0 14 0 14 4 20 4 20 90 110 UNIT
tpLH tpHL trise tfall tRFM
tpLH tpHL trise tfall tRFM
tpLH tpHL tpLH tpHL tpHZ tpZH tpLZ tpZL tsu Vcr
VMO/VPO to D+/DFull Speed Rise and Fall Times Full Speed Rise and Fall Time Matching Full Speed VMO/VPO to D+/DLow Speed Rise and Fall Times Low Speed Rise and Fall Time Matching Low Speed D+/D- to RCV D+/D- to VP/VM
1 2
ns ns %
1 2 75 75 70
120 120
300 300 300 200 130
75 75 70
300 300 300 200 130
ns ns %
3 1
9 9 4 4
OE# to D+/D- RL = 500ohm Setup for SPEED Crossover point1
4
16 16 8 8 12 12 10 10 2.0 1.3
16 16 8 8 12 12 10 10 2.0
ns ns ns
5 3
0 1.3
ns V
NOTES: 1. The crossover point is in the range of 1.3V to 2.5V for the low speed mode with a 50 pF capacitance.
ELECTRICAL CHARACTERISTICS
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ELECTRICAL CHARACTERISTICS
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5.7 ESD Test Results
Test Description: ESD Testing was performed on a Zapmaster system using the HumanBody-Model (HBM) and Machine-Model (MM), according to MIL-STD 883 and EIAJ IC121 respectively. * Human-Body-Model stresses devices by sudden application of a high voltage supplied by a 100pF capacitor through 1.5k-ohm resistance. * Machine-Model stresses devices by sudden application of a high voltage supplied by a 200pF capacitor through very low (0 ohm) resistance. Test Circuit & Condition - Zap Interval: 1 second - Number of Zaps: 3 positive and 3 negative at room temperature - Criteria: I-V Curve Tracing ESD Data Model HBM MM Mode Vdd, Vss, I/C Vdd, Vss, I/C S/S 15 15 Target 6000V 200V Results PASS PASS
ELECTRICAL CHARACTERISTICS
19
5.8 Latch-Up Test Results
Test Description: Latch-Up testing was performed at room ambient using an IMCS-4600 system which applies a stepped voltage to one pin per device with all other pins open except Vdd and Vss which were biased to 5Volts and ground respectively. Testing was started at 5.0V (Positive) or 0V (Negative), and the DUT was biased for 0.5 seconds. If neither the PUT current supply nor the device current supply reached the predefined limit (DUT=00mA, Icc=100mA), then the voltage was increased by 0.1Volts and the pin was tested again. This procedure was recommended by the JEDEC JC-40.2 CMOS Logic standardization committee. Notes: 1. DUT: The device under test. 2. PUT: The pin under test.
Test Circuit: Positive Input/Output Overvoltage/Overcurrent
ELECTRICAL CHARACTERISTICS
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Test Circuit: Negative Input/Output Overvoltage/Overcurrent
Supply Overvoltage Test
Latch-Up Data Mode + Voltage + Current Vdd - Vxx
Voltage (V)/Current (mA) 11.0 11.0 200 200 9.0
S/S 5 5 5 5 5
Results Pass Pass Pass Pass Pass
ELECTRICAL CHARACTERISTICS
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MECHANICAL INFORMATION
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6.0 Mechanical Information
Following table shows the dimensions of the AU9360 100-pin LQFP. Measurements are in inches. The illustration is just an example for LQFP but not for AU9360 real size.
body size D1 14 E1 14
lead count 100
A1 0.1
A2 1.4
L1 1
b 0.2
c 0.127
e 0.5
A1 A2 L1 b c e
stand-off body thickness lead length lead width lead thickness lead pitch
MECHANICAL INFORMATION
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MECHANICAL INFORMATION
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7.0 Errata
Record History
12/23/2002 CT3 should change connection from high to low. Shuttle 9360 chip using 24 MHz is not working, so we let the CT3 connect to high for using 12 MHz. After firmware changed (code: 911218), 24 MHz is working fine and we used 24MHz to tape out. So the schematic should change to use 24 MHz. Data book updated to version1.1 AU9360 controller chip improved to support Memory Stick PRO. Data book was then updated the version to 1.2 to add information on Memory Stick PRO. Modified parts are descriptions, features, pin names, diagrams and schematics.
03/26/2003
MECHANICAL INFORMATION
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