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INTEGRATED CIRCUITS
DATA SHEET
TZA1027 Analog current buffer for CD-R and CD-RW systems
Preliminary specification File under Integrated Circuits, IC01 1999 Sep 17
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW systems
FEATURES * Eight amplifiers for servo and power calibration functions * Gain selector for CD-R and CD-RW discs * Separate data amplifier for read speed up to thirty times nominal data speed. GENERAL DESCRIPTION The TZA1027 is an analog current buffer IC for CD-R and CD-RW systems with a 3-spot push-pull tracking system. The IC interfaces directly to the photo diodes and TZA1020. A HF current amplifier is implemented to detect the actual HF data signal. QUICK REFERENCE DATA SYMBOL VDD Ii(cd) Ii(sd) BCAHF td(f) GSS Tamb PARAMETER supply voltage central diode input current satellite diode input current bandwidth flatness delay servo satellite detector gain ambient temperature WRON = 1 WRON = 1 Ci = 5 pF Ci = 5 pF; f = 0.1 to 32 MHz HG = 1 HG = 0 CONDITIONS MIN. 4.5 0 0 72 - - - 0 TYP. 5.0 - - - 30 32 8 -
TZA1027
MAX. 5.5 3400 520 - 200 - - 70
UNIT V A A MHz ps
C
ORDERING INFORMATION TYPE NUMBER TZA1027HL PACKAGE NAME LQFP32 DESCRIPTION plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm VERSION SOT401-1
1999 Sep 17
2
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW systems
BLOCK DIAGRAM
TZA1027
handbook, full pagewidth
TZA1027
A1 7 23 A1LF
A2
2
28
A2LF
B1
6
24
B1LF
B2
3
27
B2LF
C1
1
29
C1LF
C2
8
22
C2LF
C3
5
25
C3LF
C4
4
26
C4LF
+
n.c. PDWN WRON HG 9, 10, 11, 12, 17, 20, 32 21 31 30 GAIN SELECTOR
19
CAHF
18
HFGND
16
15
13
14
MGR881
VDDA VDDD AGND DGND
Fig.1 Block diagram.
1999 Sep 17
3
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW systems
PINNING SYMBOL C1 A2 B2 C4 C3 B1 A1 C2 n.c. n.c. n.c. n.c. AGND DGND VDDD VDDA n.c. HFGND CAHF n.c. PDWN C2LF A1LF B1LF C3LF C4LF B2LF A2LF C1LF HG WRON n.c. PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 central photo diode current input satellite diode current input satellite diode current input central photo diode current input central photo diode current input satellite diode current input satellite diode current input central photo diode current input not connected not connected not connected not connected analog ground digital ground digital power supply analog power supply not connected ground connection of CAHF output stage central aperture high-frequency output not connected digital input power-down C2 central detector signal output A1 satellite detector signal output B1 satellite detector signal output C3 central detector signal output C4 central detector signal output B2 satellite detector signal output A2 satellite detector signal output C1 central detector signal output digital input high gain selection digital input write on gain selection not connected DESCRIPTION
TZA1027
1999 Sep 17
4
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW systems
TZA1027
C1 A2 B2 C4 C3 B1 A1 C2
1 2 3 4
25 C3LF
29 C1LF
26 C4LF
27 B2LF
28 A2LF
handbook, full pagewidth
32 n.c.
31 WRON
30 HG
24 B1LF 23 A1LF 22 C2LF 21 PDWN
TZA1027HL
5 6 7 8 20 n.c. 19 CAHF 18 HFGND 17 n.c.
n.c. 11
n.c. 10
n.c. 12
AGND 13
DGND 14
VDDD 15
VDDA 16
9
n.c.
MGR882
Fig.2 Pin configuration.
1999 Sep 17
5
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW systems
FUNCTIONAL DESCRIPTION
TZA1027
All detector signals are applied to wide-band amplifiers for servo and laser power calibration functions of the TZA1020. Signals from the central detector are added and amplified to suitable levels for the decoder circuit. Current gain can be selected for CD-R and CD-RW discs. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD Tstg Tamb Ves supply voltage storage temperature ambient temperature electrostatic handling: Machine model Human body model THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient CONDITION in free air VALUE 95 UNIT K/W -100 -500 +100 +500 V V PARAMETERS 0 -6.5 0 MIN. MAX. 5.5 +150 70 UNIT V C C
LOGIC FUNCTIONS PDWN 1 0 0 0 0 Note 1. X = don't care. WRON X; note 1 0 0 1 1 HG X; note 1 0 1 0 1 MODE power-down CD-R read CD-RW read CD-R write CD-RW write
1999 Sep 17
6
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW systems
TZA1027
CHARACTERISTICS VDDA = VDDD = 5 V; Tamb = 25 C; Ii(cd) = 25 A with x = 1LF to 4LF; Ii(sd) = 4 A with y = A or B and z = 1LF or 2LF; PDWN = 0; WRON = 0; HG = 0 and Ccd = Csd = 5 pF; the given maximum and minimum values are 4 values; unless otherwise specified. Signals available on the IC pins are upper case. Signals not visible on the IC pins are lower case. SYMBOL Supplies VDDA VDDD VDD IDDA IDDD analog supply voltage digital supply voltage difference between VDDA and VDDD analog supply current digital supply current PDWN = 1 PDWN = 1 4.5 4.5 -0.3 - - - - Detector inputs INPUT CURRENT RANGE Ii(cd) Ii(sd) central diode input current WRON = 1 satellite diode input current WRON = 1 INPUT VOLTAGE LEVEL Vi(cd) Vi(sd) central diode input voltage level WRON = 1 satellite diode input voltage level WRON = 1 INPUT RESISTANCE Ri(cd) Ri(sd) central diode input resistance WRON = 1; Ii(cd) = 1 mA satellite diode input resistance WRON = 1; Ii(cd) = 200 A Transfer functions SERVO OUTPUTS CD Gcd servo central detector gain HG = 1 WRON = 1 WRON = 1; HG = 1 Gmm Bcd gain mismatch bandwidth HG = 1; Ii(cd) = 6 A WRON = 1; Ii(cd) = 1000 A 3 -0.93 -2.8 -0.94 -0.93 - 33 18 150 -1 -3 -1 -1 - 44 22 230 130 -1.07 -3.2 -1.06 -1.07 3 - - - - % MHz MHz MHz MHz - - - - 420 220 620 370 - - - - 2.5 2.6 1.6 1.7 2.9 3.0 1.9 2.0 3.3 3.4 2.2 2.3 V V V V 1.0 0 0.6 0 - - - - 75 3400 9 520 A A A A 5.0 5.0 - 0.1 13 0 14 5.5 5.5 +0.3 - - - - V V V mA mA mA mA PARAMETERS CONDITIONS MIN. TYP. MAX. UNIT
WRON = 1; HG = 1; Ii(cd) = 250 A 100 1999 Sep 17 7
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW systems
SYMBOL tr td PARAMETERS rise time delay time CONDITIONS WRON = 1; 30 A < Ii(cd) < 520 A HG = 1 WRON = 0; HG = 0 WRON = 1; HG = 0 WRON = 1; HG = 1 BS tr td GSS bandwidth rise time delay time HG = 1; Ii(cd) = 1 A WRON = 1; 4 A < Ii(cd) < 65 A WRON = 1; 4 A < Ii(cd) < 65 A MIN. - TYP. 2 2.5 - -
TZA1027
MAX.
UNIT ns ns
WRON = 1; 30 A < Ii(cd) < 520 A -
SERVO OUTPUTS SD GSS servo satellite detector gain -2.85 -0.96 -0.88 -0.88 24 - - 7.5 HG = 1 WRON = 1; HG = X; note 1 BCAHF td(f) In bandwidth HG = 1; Ii(cd) = 6 A flatness delay HG = 1; Ii(cd) = 6 A noise current HG = 1; Ii(cd) = 6 A Output pins Vo(cd) Vo(sd) Vo(CAHF) Ro(cd) Ro(sd) RCAHF central diode output voltage satellite diode output voltage data output voltage central diode output resistance satellite diode output resistance data output resistance -0.2 -0.2 1 - - - - - - 1 5 40 VDDD - 1 VDDD - 1 - - - V V M M k 29 - 80 72 - - - - -3.05 -1.02 -0.95 -0.95 - - 3.6 4.5 -3.25 -1.08 -1.02 -1.02 - - - - 8.7 35 - - - 200 - - - MHz MHz ps ps A A MHz MHz ns ns
WRON = X; note 1; HG = X; note 1 46
DATA OUTPUT; PIN CAHF servo satellite detector gain 8.1 32 0 - - 30 170 1.4 2
VDDD + 0.2 V
Digital control signals INPUT VOLTAGE LEVELS; PINS PDWN, WRON AND HG VIL VIH ILI DELAY TIME td Note 1. X = don't care. 1999 Sep 17 8 delay time - 0.3 - s LOW-level input voltage HIGH-level input voltage -0.2 1.8 -1 - - - +1.2 V VDDD + 0.2 V +1 A
INPUT CURRENT input leakage current
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW systems
TEST AND APPLICATION INFORMATION
TZA1027
handbook, full pagewidth
I i(sd)(AC) 50
100 nF 3.3 k 470 k 100 nF 3.3 k 470 k 100 nF 3.3 k 470 k 100 nF 3.3 k 3.9 pF B2 3.9 pF 3.3 k 470 k 50 100 nF 3.3 k 470 k 100 nF 3.3 k 470 k 100 nF 3.3 k 3.9 pF C4 3.9 pF 4 3.9 pF C3 5 3.9 pF C2 8 C1 1 3 3.9 pF B1 6 3.9 pF A2 2 A1 7
TZA1027
23 A1LF
100 nF 50 4.7 k 100 nF 50 28 A2LF 4.7 k 100 nF 50 24 B1LF 4.7 k 100 nF 50 27 B2LF 4.7 k 100 nF 50 29 C1LF 4.7 k 100 nF 50 22 C2LF 4.7 k 100 nF 50 25 C3LF 4.7 k 100 nF 50 26 C4LF 4.7 k
Vbias(sd) I i(cd)(AC)
470 k 100 nF
Vbias(cd)
470 k
+
GAIN SELECTOR
100 nF 50 19 CAHF 1 k +5 V
+5 V
PDWN 21 WRON 31 HG 30 16 VDDA +5 V 15 VDDD 13 AGND 14 DGND
MGR883
18 HFGND
Fig.3 Test diagram.
1999 Sep 17
9
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW systems
TZA1027
handbook, full pagewidth +12 V
TZA1027
A1 7 23 A1LF SA1 4
A2
2
28
A2LF
SA2
8
B1
6
24
B1LF
SB1
5
B2
3
27
B2LF
SB2
9
TZA1020
C1 1 29 C1LF C1 10
SAA7399
C2
8
22
C2LF
C2
3
C3
5
25
C3LF
C3
6
C4
4
26
C4LF
C4
7
+
PDWN 21 WRON 31 HG 30 GAIN SELECTOR
19
CAHF
SAA7392
18 HFGND
to block decoder/ encoder
16 VDDA +5 V
15 VDDD
13 AGND
14 DGND
MGR884
Fig.4 Application diagram.
1999 Sep 17
10
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW systems
PACKAGE OUTLINE LQFP32: plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm
TZA1027
SOT401-1
c y X
24 25
17 16 ZE
A
e E HE wM bp 32 1 8 9 L detail X Lp A A2 A1 pin 1 index (A 3)
e bp D HD
ZD wM B
vM A
vM B
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.60 A1 0.15 0.05 A2 1.5 1.3 A3 0.25 bp 0.27 0.17 c 0.18 0.12 D (1) 5.1 4.9 E (1) 5.1 4.9 e 0.5 HD 7.15 6.85 HE 7.15 6.85 L 1.0 Lp 0.75 0.45 v 0.2 w 0.12 y 0.1 Z D (1) Z E (1) 0.95 0.55 0.95 0.55 7 0o
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT401-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-12-19 97-08-04
1999 Sep 17
11
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW systems
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
TZA1027
* Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1999 Sep 17
12
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW systems
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable suitable(2) recommended(3)(4) recommended(5) suitable not not suitable suitable suitable suitable suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not
TZA1027
REFLOW(1)
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
1999 Sep 17
13
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW systems
NOTES
TZA1027
1999 Sep 17
14
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW systems
NOTES
TZA1027
1999 Sep 17
15
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 68
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545002/01/pp16
Date of release: 1999
Sep 17
Document order number:
9397 750 04724

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