PART |
Description |
Maker |
SNAP-MODFUSEHLDRB |
Fuse Holder; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No
|
Opto 22
|
SNAP-IT-RM-UADS |
Controllers; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No
|
Opto 22
|
122506A |
Connector assemblies, Test; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes INTERCONNECTION DEVICE
|
Pomona Electronics
|
KMZ10 KMZ10A |
Speaker; Current Rating:14A; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No Magnetic field sensor
|
PHILIPS[Philips Semiconductors] NXP Semiconductors
|
7MBP50NA060-01 |
NTC Thermistor; Resistance:15000ohm; Thermistor Tolerance: /- 5%; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes IGBT-IPM
|
FUJI ELECTRIC HOLDINGS CO., LTD. FUJI[Fuji Electric]
|
P50E-100S-TG |
Connector; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No 100 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, IDC, SOCKET
|
Integrated Device Technology, Inc. ROBINSON NUGENT INC
|
2MBI100NB-120 |
NTC Thermistor; Resistance:1Mohm; Thermistor Tolerance: /- 5%; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes IGBT MODULE ( N series )
|
FUJI ELECTRIC HOLDINGS CO., LTD.
|
UFT200 UFT20005 UFT20010 UFT20015 UFT20020 UFT2012 |
Desolder Braid; Roll Length:10ft; Width:0.075"; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes 100 A, 50 V, SILICON, RECTIFIER DIODE ULTRA FAST RECOVERY MODULES
|
Microsemi, Corp. MICROSEMI[Microsemi Corporation]
|
PJRAS2X1S02 PJRAN1X1U04 |
Phono Jack; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No; Number of Contacts:2; Terminal Type:PCB Thru Hole GENERAL PURPOSE AUDIO CONNECTOR, JACK
|
SWITCHCRAFT INC
|
UM9203 UM9204 |
Flash Memory IC; Memory Size:8Mbit; Supply Voltage Max:3V; Package/Case:48-TSOP; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes DTMF Receiver
|
Electronic Theatre Controls, Inc. UMC
|
MSA-0286 MSA-0286-BLK MSA-0286-TR1 |
Cascadable Silicon Bipolar MMIC Amplifier 级联硅双极MMIC放大 Buffer / Driver / Receiver Logic IC; Package/Case:28-PLCC; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No; Mounting Type:Surface Mount
|
Agilent Technologies, Inc. HP[Agilent(Hewlett-Packard)] Agilent (Hewlett-Packard)
|