PART |
Description |
Maker |
21-0542 |
PACKAGE OUTLINE 12 BUMPS, WLP PKG, 0.4MM PITCH
|
Maxim Integrated Products
|
MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
AP2311GN-HF AP2311GN-HF-14 |
1.8 A, 60 V, 0.25 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp. Advanced Power Electronics ...
|
WLCSP3X3-9 |
Package Outline
|
Global Mixed-mode Techn...
|
SOT223 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN3.5X3.5-14 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-24-EP |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-20 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP2X2-4 |
Package Outline
|
Global Mixed-mode Techn...
|
HTSSOP-14 |
Package Outline
|
Global Mixed-mode Techn...
|
TDFN3X3-8 |
Package Outline
|
Global Mixed-mode Techn...
|