| PART |
Description |
Maker |
| MTB09N04H8 |
MTB09N04H8 CYStek Product Specification
|
Cystech Electonics Corp.
|
| MTA17A02CDN6 |
MTA17A02CDN6 CYStek Product Specification
|
Cystech Electonics Corp.
|
| DBMC-13X3SJ-K126 |
Brand: Cannon Product Category: D Sub Product Line: D Sub Series: COMBO D
|
List of Unclassifed Manufacturers
|
| K9KAG08U0MPIB00 K9KAG08U0M-PCB0000 K9KAG08U0MPCK00 |
sheet of this product is either in preparation or is not effective yet. For more details about product specifications or technical files, please inquire through Contact us
|
Samsung semiconductor
|
| TMP86C847 TMP86C846 TMP86CH46 TMP86CH47 TMP86CK74 |
The product information available by this search method contains an overview of each product only.
|
TOSHIBA
|
| V850E1 V850E_SV2 V850E_IA1 V850E_IA2 V850E_IA3 V85 |
V850E/IA2 Flash product ROM: 128 KB, RAM: 6 KB
V850E/IA2 Mask product ROM: 128 KB, RAM: 6 KB
V850E/IA3 Flash product ROM: 256 KB, RAM: 12 KB
ROM-less version; Internal RAM: 4K bytes
32-bit RISC single-chip microcontroller V850E/SV2
V850E/IA4 Flash memory product ROM: 256 KB, RAM: 12 KB
32-Bit Microprocessor Core
|
NEC[NEC]
|
| COG-C286FVJ-01 |
MODULE SPEC
|
VARITRONIX[Varitronix international limited]
|
| 3-1721081-2 3-1721081-5 3-1721081-9 3-1721081-6 3- |
PJC SPEC, 301
|
Tyco Electronics
|
| MS29512 |
Mil Spec O-Rings
|
ERC
|
| 385005 |
(Spec.A) Standard characteristics
|
Renesas Electronics Corporation
|
| 3850SA |
Difference between Standard ver. and Spec.A
|
Renesas Electronics Corporation
|
