| PART |
Description |
Maker |
| IRG4CC50WB |
IGBT Die in Wafer Form 600 V Size 5 WARP Speed
IRG4CC50WB IGBT Die in Wafer Form
|
Hittite Microwave Corporation
International Rectifier
|
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| IRG4CC81KB IRG4CC40RB |
TRANSISTOR | IGBT | N-CHAN | 600V V(BR)CES | CHIP 晶体管| IGBT的|正陈| 600V的五（巴西）国际消费电子展|芯片
IRG4CC81KB IGBT Die in Wafer Form
|
International Rectifier
|
| BUY25CS45B-01 |
Bare Die IGBT
|
Infineon Technologies AG
|
| DD400S17K6CB2 |
Bare Die IGBT
|
Infineon Technologies AG
|
| IRG4CC50SB |
IRG4CC50SB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CH30KB |
IRG4CH30KB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CH20KB |
IRG4CH20KB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC77KB |
IRG4CC77KB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC40FB |
IRG4CC40FB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC30UB |
IRG4CC30UB IGBT Die in Wafer Form
|
International Rectifier
|
