PART |
Description |
Maker |
MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装(SSOP封装),EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp. Fairchild Semiconductor Corporation
|
HA12062AMP |
Data Strobe IC Developed For R-DAT
|
Hitachi,Ltd. Hitachi Semiconductor
|
TA8552AFN02 |
PLL Data Synchronizer For DAT Streamer
|
Toshiba Semiconductor
|
TQFN4X4-20 |
Package Outline
|
Global Mixed-mode Techn...
|
SOP-20 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP5X5-25 |
Package Outline
|
Global Mixed-mode Techn...
|
TSOT23-6 |
Package Outline
|
Global Mixed-mode Techn...
|
TSOT23-5 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-28 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN4X4-24 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP2X2-4 |
Package Outline
|
Global Mixed-mode Techn...
|