| PART |
Description |
Maker |
| SOT765-1 |
plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| SOT340-1 |
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装（SSOP封装），EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp.
Fairchild Semiconductor Corporation
|
| HYM324000GD-60 HYM324000GD-50 |
4M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE 4M X 32 FAST PAGE DRAM MODULE, 60 ns, ZMA72
CAP 0.5PF 50V /-0.2PF THIN-FILM SN96/AG4/NI 30PPM TR-7-PA
4M x 32 Bit DRAM Module (SO-DIMM)
-4M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE
|
SIEMENS A G
SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
Infineon
|
| QBG |
HEAT SHRINK THIN WALL TUBING
|
Qualtek Electronics Corporation
|
| Q2-F3X Q2-F2X |
HEAT SHRINK THIN WALL TUBING
|
Qualtek Electronics Corporation
|
| 0192670129 8-5BK PF-1 |
Perma-Fit Thin-Wall multi Purpose Heat Shrink Tubing
Perma-Fit?Thin-Wall multi Purpose Heat Shrink Tubing
|
Molex Electronics Ltd.
|
| PF-1/2-1RD 0192670227 |
Perma-Fit Thin-Wall multi Purpose Heat Shrink Tubing, 12.70mm (.500) InsideDiameterAs SuppliedRed
|
Molex Electronics Ltd.
|
| 0192670303 PF-1-4BK |
Perma-Fit?/a> Thin-Wall multi Purpose Heat Shrink Tubing, 25.40mm (1.000) InsideDiameter (As Supplied
|
Molex Electronics Ltd.
|
| PF-1/2-1BK 0192670225 |
Perma-Fit Thin-Wall multi Purpose Heat Shrink Tubing, 12.70mm (.500) InsideDiameterAs Supplied)Black
|
Molex Electronics Ltd.
|
| PF-3/8-1RD 0192670197 |
Perma-Fit Thin-Wall multi Purpose Heat Shrink Tubing, 9.53mm (.375) InsideDiameterAs SuppliedRed1.22m (4.0
|
Molex Electronics Ltd.
|
