| PART |
Description |
Maker |
| H48-6C |
Thermal Conductive Pad
|
List of Unclassifed Manufacturers
|
| HSP-7 |
Thermal Pad suitable for NOVA22 Panel Mount SSRs
|
Crydom Inc.,
|
| AND8044D |
Single-Channel 1206A ChipFET TM Power MOSFET Recommended Pad Pattern and Thermal Performance
|
ON Semiconductor
|
| P1BR |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| TC77-5.0MO TC77 TC77-3.3MC TC77-5.0MOA TC773.3MCTT |
Thermal Sensor with SPI Interface
|
MICROCHIP[Microchip Technology]
|
| TD1-2D00-031 |
Thermal Dispersion Flow/Level/Interface Switch
|
Magnetrol International, Inc.
|
| G751-1P1 G751-2P1 G751-2P8 G75105 G751-2RD |
Digital Temperature Sensor and Thermal Watchdog with Two-Wire Interface
|
Global Mixed-mode Technology Inc.
|
| ADT7490 ADT7490ARQZ ADT7490ARQZ-R7 ADT7490ARQZ-REE |
dBCool Remote Thermal Monitor and Fan Controller with PECI Interface
|
ON Semiconductor
|
| U6803B_05 U6803B U6803B-MFPG3Y U6803B-MFPY U6803B0 |
Triple Driver IC with Thermal Monitoring SPECIALTY INTERFACE CIRCUIT, PDSO8
|
Atmel, Corp.
ATMEL[ATMEL Corporation]
|
| AT77C104B AT77C104BCB08V |
FingerChip Thermal Fingerprint Sweep Sensor, Hardware Based, Navigation and Click Function, SPI Interface
|
ATMEL Corporation
|
| FF300R12KS4P |
62mm C-Serien Modul mit schnellem IGBT2 für hochfrequentes Schalten und bereits aufgetragenem Thermal Interface Material
|
Infineon Technologies A...
|
